821002B00000

Board Level Heat Sinks P/N: 821002B00000 TO-220 PRODUCT SPECIFICATIONS • Hole for Device Attachment • RoHS Compliant CUSTOMIZED HEATSINKS 0 200 400 600 800 1000 100 20 80 16 60 12 40 8 20 4 0 0 0 1 2 3 Heat Dissipated - Watts • Specialized Plating • Specialized Body Configurations • Contact Applications Engineering COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph (858) 348-6200 Fax (858) 566-4577 E-mail: sales@comairrotron.com, Web: www.comairrotron.com 4 5 Thermal Resistance - oC / Watt (Mounting Surface to Ambient) FEATURES & BENEFITS Air Velocity - LFM Temp Rise Above Ambient -oC (Mounting Surface) • Devices: TO-220 • Size: 6.4 x 13.2 x 19.1 mm • Material: Aluminum, 1.2 mm Thick • Type: Stamped • Weight: 1.3 grams • PCB Mounting: Solderable Device Leads • Finish: Black Anodized • Package: Bulk • Accessories: Hardware & Thermal Interface Material