TAI-TECH
TBM01-161100171
High Current Ferrite Chip Bead(Lead Free)
HCB2012KF-Series
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
楊祥忠
羅培君
張嘉玲
楊祥忠
羅培君
張嘉玲
1.0
13/06/06 變更可靠度條件
2.0
14/01/24
3.0
14/08/01 變更 Reflow 圖示
楊祥忠
羅培君
張嘉玲
3.1
14/08/01 修正包裝帶尺寸
楊祥忠
羅培君
張嘉玲
4.0
16/01/26
楊祥忠
詹偉特
張嘉玲
變更電鍍錫層厚度
3.0um min.=>3.5um min.
增訂可靠度 Thermal shock:
(Bead) Step3:125±2℃ 30±5min
備
註
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P1.
TAI-TECH
TBM01-161100171
High Current Ferrite Chip Bead(Lead Free)
P2.
HCB2012KF-Series
1.Features
1. Monolithic inorganic material construction.
2. Closed magnetic circuit avoids crosstalk.
Halogen
3. Suitable for reflow soldering.
4. Shapes and dimensions follow E.I.A. spec.
Halogen-free
5. Available in various sizes.
6. Excellent solder ability and heat resistance.
7. High reliability.
8. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
9. Low DC resistance structure of electrode to prevent wasteful electric power consumption.
Pb
Pb-free
2.Dimensions
Chip Size
A
2.00±0.20
B
1.25±0.20
C
0.85±0.20
D
0.50±0.30
Units: mm
3.Part Numbering
HCB
2012
KF
A
B
C
A: Series
B: Dimension
C: Material
D: Impedance
E: Packaging
F: Rated Current
-
121
T
20
D
E
F
LxW
Lead Free Material
121=120Ω
T=Taping and Reel, B=Bulk(Bags)
20=2000mA
4.Specification
Tai-Tech
Part Number
●
●
Impedance (Ω)
Test Frequency
(MHz)
DC Resistance
(Ω) max.
Rated Current
(mA) max.
HCB2012KF-300T30
30±25%
100
0.04
3000
HCB2012KF-800T30
80±25%
100
0.04
3000
2000
HCB2012KF-121T20
120±25%
100
0.10
HCB2012KF-151T20
150±25%
100
0.10
2000
2000
HCB2012KF-221T20
220±25%
100
0.10
HCB2012KF-301T10
300±25%
100
0.20
1000
HCB2012KF-471T10
470±25%
100
0.20
1000
HCB2012KF-601T10
600±25%
100
0.20
1000
Rated current: based on temperature rise test
In compliance with EIA 595
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TAI-TECH
TBM01-161100171
5. Reliability and Test Condition
Item
Series No.
Operating Temperature
Performance
FCB
FCM
GHB
FCA
FCI
Test Condition
HCI
--
-40~+125℃
(Including self-temperature rise)
-40~+105℃
(Including self-temperature rise)
--
-40~+125℃
(on board)
-40~+105℃
(on board)
Transportation
Storage Temperature
HCB
FHI
FCH
For long storage conditions, please see the
Application Notice
Agilent4291
Impedance (Z)
Agilent E4991
Inductance (Ls)
Q Factor
P3.
Agilent4287
Agilent16192
Refer to standard electrical characteristics list
DC Resistance
Agilent 4338
Rated Current
DC Power Supply
Over Rated Current requirements, there will be
some risk
Rated Current < 1A ΔT 20℃Max
Temperature Rise Test
1. Applied the allowed DC current.
2. Temperature measured by digital surface
thermometer.
Rated Current ≧ 1A ΔT 40℃Max
Number of heat cycles: 1
Resistance to Soldering
Heat
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not exceed the specification value
Temperature
(°C)
Time
(s)
Temperature
ramp/immersion
and emersion rate
260 ±5
(solder temp)
10 ±1
25mm/s ±6 mm/s
Depth: completely cover the termination
Preheating Dipping Natural cooling
More than 95% of the terminal
Solderability
electrode should be covered
245¢X
C
150¢X
C
with solder.
Terminal strength
Bending
Vibration Test
60
second
4∮1
second
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
Appearance:No damage.
Impedance:within±10% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not exceed the specification value
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not exceed the specification value
Preheat: 150℃,60sec.
Solder: Sn96.5%-Ag3%-Cu0.5%
Solder temperature: 245±5℃
Flux for lead free: Rosin. 9.5%
Depth: completely cover the termination.
Dip time: 4±1sec.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Component mounted on a PCB apply a force
(>0805:1kg =0805:40x100x1.2mm
=0805:1.2mm
1GΩ
**Derating Curve
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85℃, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
6.Soldering and Mounting
6-1. Recommended PC Board Pattern
Land Patterns For
Reflow Soldering
Chip Size
HCB
GHB
FCI
FHI
FCH
HCI
0603
0.6±0.03
0.30±0.03
0.30±0.03 0.15±0.05
0.80
0.30
0.30
1005
1.0±0.10
0.50±0.10
0.50±0.10 0.25±0.10
1.50
0.40
0.55
1608
1.6±0.15
0.80±0.15
0.80±0.15 0.30±0.20
2.60
0.60
0.80
2.0±0.20
1.25±0.20
0.85±0.20 0.50±0.30
2.0±0.20
1.25±0.20
1.25±0.20 0.50±0.30
3.00
1.00
1.00
3216
3.2±0.20
1.60±0.20
1.10±0.20 0.50±0.30
4.40
2.20
1.40
3225
3.2±0.20
2.50±0.20
1.30±0.20 0.50±0.30
4.40
2.20
3.40
4516
4.5±0.20
1.60±0.20
1.60±0.20 0.50±0.30
5.70
2.70
1.40
4532
4.5±0.20
3.20±0.20
1.50±0.20 0.50±0.30
5.90
2.57
4.22
2012
L
Land
Solder Resist
2.8
0.8
FCM
FCA3216
A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm)
2.2-2.6
FCB
Type
0.8
Pitch
0.4
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
H
Series
G
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TAI-TECH
TBM01-161100171
P5.
6-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
6-2.1 Lead Free Solder re-flow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)
6-2.2 Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must
be employed the following precautions are recommended. for Iron Soldering in Figure 2.
‧Preheat circuit and products to 150℃
‧350℃ tip temperature (max)
‧Never contact the ceramic with the iron tip
‧1.0mm tip diameter (max)
‧Use a 20 watt soldering iron with tip diameter of 1.0mm
‧Limit soldering time to 4~5sec.
Reflow Soldering
Iron Soldering
PRE-HEATING
NATURAL
COOLING
SOLDERING
PRE-HEATING
TEMPERATURE(¢X
C)
TP(260 ℃ / 10s max.)
TEMPERATURE(¢X
C)
tp(245¢X
C / 20~40s.)
217
200
150
NATURAL
COOLING
SOLDERING
within 4~5s
60~150s
60~180s
350
150
Gradual cooling
Over 60s
480s max.
25
TIM E(sec.)
TIME( sec.)
Reflow times: 3 times max
Fig.1
Iron Soldering times:1 times max
Fig.2
6-2.3 Solder Volume:
U p p e r lim it
R e co m m e n d a b le
Accordingly increasing the solder volume, the mechanical stress to
product is also increased. Exceeding solder volume may cause the
failure of mechanical or electrical performance. Solder shall be used
not to be exceed as shown in right side:
Minimum fillet height = soldering thickness + 25% product height
t
7.Packaging Information
7-1. Reel Dimension
A
A(mm)
B(mm)
C(mm)
D(mm)
7”x8mm
9.0±0.5
60±2
13.5±0.5
178±2
7”x12mm
13.5±0.5
60±2
13.5±0.5
178±2
.5
Type
C
B
0.5
R1
R1
.9
.5
R0
120¢X
7"x8mm
7"x12mm
7-2.1 Tape Dimension / 8mm
■Material of taping is paper
1.
.0
-0
.1
t
P
P2:2∮0.1
D:
5
.1
5
.0
-0
F:3.5∮0.1
P
P(mm)
t(mm)
0.70±0.06 0.40±0.06
2.0±0.05
0.45max
100505
1.12±0.03 0.62±0.03 0.60±0.03
2.0±0.05
0.60±0.03
0.45max
t
B0
1.
0
6+
Bo(mm) Ao(mm) Ko(mm)
060303
Ko
A0
P0:4∮0.1
Size
A0
W:8.0∮0.1
F:3.5∮0.05
B0
E:1.75 ∮0.1
D:
0
5+
W:8.0∮0.3
P0:4∮0.1
E:1.75 ∮0.1
D
13
.5
∮0
2∮0.5
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
160808
1.80±0.05
0.96+0.05/-0.03
0.95±0.05
4.0±0.10
0.95±0.05
201209
2.10±0.05
1.30±0.05
0.95±0.05
4.0±0.10
0.95±0.05
Ko
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TAI-TECH
TBM01-161100171
P6.
■Material of taping is plastic
P2:2∮0.05
Po:4∮0.1
.5
.
+0
1
t
A
P
0.
:1 ∮
D1
F:3.5∮0.05
A
Bo
W:8.0∮0.1
E:1.75∮0.1
1
D:
Ko
1
Ao
Size
Bo(mm) Ao(mm) Ko(mm)
P(mm)
t(mm)
D1(mm)
201212
2.10±0.10 1.28±0.10 1.28±0.10
4.0±0.10
0.22±0.05
1.0±0.10
321611
3.35±0.10 1.75±0.10 1.25±0.10
4.0±0.10
0.23±0.05
1.0±0.10
322513
3.42±0.10 2.77±0.10 1.55±0.10
4.0±0.10
0.22±0.05
1.0±0.10
321609
3.40±0.10 1.77±0.10 1.04±0.10
4.0±0.10
0.22±0.05
1.0±0.10
SECTION A-A
7-2.2 Tape Dimension / 12mm
1.75∮0.1
Po:4∮0.1
P2:2.0∮0.05
t
D1:1.5∮0.1
Bo
W:12.0∮0.1
5.5∮0.05
D:1.5+0.1
Size
Bo(mm) Ao(mm) Ko(mm)
P(mm)
t(mm)
D1(mm)
451616
4.70±0.10 1.75±0.10 1.75±0.10
4.0±0.10
0.24±0.05
1.5±0.10
453215
4.70±0.10 3.45±0.10 1.60±0.10
8.0±0.10
0.24±0.05
1.5±0.10
Ko
P
Ao
7-3. Packaging Quantity
Chip Size
453215
451616
322513
321611
321609
201212
201209
160808
100505
060303
Chip / Reel
1000
2000
2500
3000
3000
2000
4000
4000
10000
15000
Inner box
4000
8000
12500
15000
15000
10000
20000
20000
50000
75000
Middle box
20000
40000
62500
75000
75000
50000
100000
100000
250000
375000
Carton
40000
80000
125000
150000
150000
100000
200000
200000
500000
750000
7-4. Tearing Off Force
F
Top cover tape
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
165¢Xto180¢X
Base tape
Room Temp.
Room Humidity
Room atm
Tearing Speed
(℃)
(%)
(hPa)
mm/min
5~35
45~85
860~1060
300
Application Notice
‧Storage Conditions(component level)
To maintain the solder ability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1.
2. Temperature and humidity conditions: Less than 40℃ and 60% RH.
3. Recommended products should be used within 12 months from the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧Transportation
1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
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TAI-TECH
TBM01-161100171
Impedance Frequency Characteristics(Typical)
HCB2012KF-300T30
60
20
X
120
Z
80
X
40
R
10
100
0
1000
1
10
HCB2012KF-151T20
200
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
100
100
R
0
1000
1
10
Z
100
100
1000
FREQUENCY(M Hz)
HCB2012KF-221T20
600
300
0
Z
FREQUENCY(MHz)
FREQUENCY(MHz)
400
200
X
R
HCB2012KF-301T10
600
IMPEDANCE(O hm)
1
IM PEDANCE(O hm)
30
10
400
Z
200
400
Z
200
X
X
R
1
10
100
R
0
1000
1
1000
FREQUENCY(MHz)
HCB2012KF-471T10
800
100
IMPEDANCE(Ohm)
Z
600
Z
400
200
600
400
200
X
R
X
R
0
1
10
100
FREQUENCY(MHz)
1000
0
1
10
100
1
10
100
FREQUENCY(MHz)
HCB2012KF-601T10
800
X
R
0
10
FREQUENCY(MHz)
IMPEDANCE(O hm)
HCB2012KF-121T20
300
160
Z
40
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)
50
0
HCB2012KF-800T30
200
1000
FREQUENCY(MHz)
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1000
P7.
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