SS12 THRU SS1200
Reverse Voltage - 20 to 200 Volts
Forward Current - 1.0 Ampere
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Features
DO-214AC/SMA
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Metal silicon junction,majority carrier conduction
Low power loss,high efficiency
Built-in strain relief,ideal for automated placement
0.110(2.80)
0.094(2.40)
0.067 (1.70)
0.039 (1.00)
High forward surge current capability
High temperature soldering guaranteed:
0.177(4.50)
0.157(3.99)
0.012(0.305)
0.006(0.152)
250 °C/10 seconds at terminals
0.087(2.20)
0.078(1.90)
Mechanical Data
0.059(1.50)
0.035(0.90)
0.008(0.203)MAX.
Ca s e : JEDEC DO-214AC/SMA molded plastic body
Termina ls : Solderable per MIL-STD-750,Method 2026
Po larity : Color band denotes cathode end Moun ting
Po s ition : Any
Weigh t : 0.002 ounce, 0.07 grams
0.205(5.20)
0.188(4.80)
Dimensions in inches and (millimeters)
Maximum Ratings And Electrical Characteristics
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
SS110
SS1150
SS1200
MDD
SS12
MDD
SS13
MDD
SS14
MDD
SS15
MDD
SS16
MDD
SS18
MDD
SS110
MDD
SS1150
MDD
SS1200
SS12
Parameter
SYMBOLS
Marking Code
SS13
SS14
SS15
SS16
SS18
UNITS
Maximum repetitive peak reverse voltage
VRRM
20
30
40
50
60
80
100
150
200
V
Maximum RMS voltage
Maximum DC blocking voltage
VRMS
VDC
14
20
21
30
28
40
35
50
42
60
56
80
70
100
105
150
140
200
V
V
Maximum average forward rectified current
at TL(see fig.1)
I(AV)
1.0
A
8.3ms single half sine-wave
superimposed onrated load (JEDEC Method)
IFSM
30
A
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
TA=25℃
at rated DCblocking voltage
TA=125℃
VF
Peak forward surge current
Typical junction capacitance (NOTE 1)
Typical thermal resistance (NOTE 2)
Operating junction temperature range
Storage temperature range
0.45
0.55
IR
CJ
TJ
0.85
0.2
5.0
90
110
0.9
pF
℃/W
℃
-50 to +150
-50 to +125
℃
-50 to +150
Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.P.C.B. mounted with 0.2x0.2”(5.0x5.0mm) copper pad areas
DN:T20515A0
http://www.microdiode.com
Rev:2020A0
V
mA
2.0
88.0
RθJA
TSTG
0.70
0.5
10.0
Page :1
SS12 THRU SS1200
Reverse Voltage - 20 to 200 Volts
Forward Current - 1.0 Ampere
Typical Characterisitics
Fig.2 Typical Reverse Characteristics
Average Forward Current (A)
1.5
1.0
0.5
Single phase half-wave 60 Hz
resistive or inductive load
0.0
25
50
75
100
125
150
Instaneous Reverse Current ( μA)
Fig.1 Forward Current Derating Curve
10 4
T J=75°C
10 2
SS12/SS14
SS16-SS1200
10
1
T J=25°C
10 0
0
Case Temperature (°C)
40
60
80
100
Fig.4 Typical Junction Capacitance
500
Junction Capacitance (pF)
20
10
1.0
SS12/SS14
SS16/SS18
SS110/SS112
SS115/SS120
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
T J=25°C
200
100
50
SS12/SS14
20
SS16-SS1200
10
1.8
0.1
Fig.5 Maximum Non-Repetitive Peak
Forward Surge Current
36
30
24
18
12
8.3 ms Single Half Sine Wave
(JEDEC Method)
00
1
10
Number of Cycles at 60Hz
1
10
100
Reverse Voltage (V)
100
Transient Thermal Impedance( °C /W)
Instaneous Forward Voltage (V)
Peak Forward Surge Current (A)
20
Percent of Rated Peak Reverse Voltage(%)
Fig.3 Typical Forward Characteristic
Instaneous Forward Current (A)
T J=100°C
10 3
Fig.6- Typical Transient Thermal Impedance
100
10
1
0.01
0.1
1
10
100
t, Pulse Duration(sec)
The curve above is for reference only.
http://www.microdiode.com
Rev:2020A0
Page :2
SS12 THRU SS1200
Reverse Voltage - 20 to 200 Volts
Forward Current - 1.0 Ampere
Packing information
unit:mm
P0
Item
P1
Symbol
Tolerance
SMA
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.05
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.80
5.33
2.36
1.50
330.00
50.00
178.00
62.00
13.00
1.75
5.50
4.00
4.00
2.00
0.28
12.00
18.00
D1
d
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
E
W1
F
B
A
W
P
D2
T
C
D
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
Reel packing
PACKAGE
SMA
REEL SIZE
7"
APPROX.
GROSS WEIGHT
(kg)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
2,000
4.0
4,000
183*155*183
178
382*356*392
80,000
16.0
10,000
290*290*38
330
310*310*360
80,000
11.0
15,000
335*335*38
330
350*330*360
120,000
14.5
REEL
(pcs)
SMA
11"
5,000
4.0
SMA
13"
7,500
4.0
CARTON
SIZE
(m/m)
CARTON
(pcs)
Suggested Pad Layout
Symbol
A
Unit (mm)
1.68
Unit (inch)
0.066
B
1.52
0.060
C
3.90
0.154
D
2.41
0.095
E
5.45
0.215
Important Notice and Disclaimer
Microdiode Electronics (Jiangsu) reserves the right to make changes to this document and its products and
specifications at any time without notice. Customers should obtain and confirm the latest product information and
specifications before final design,purchase or use.
Microdiode Electronics (Jiangsu) makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, not does Microdiode Electronics (Jiangsu) assume any liability for application
assistance or customer product design. Microdiode Electronics (Jiangsu) does not warrant or accept any liability with
products which are purchased or used for any unintended or unauthorized application.
No license is granted by implication or otherwise under any intellectual property rights of Microdiode
Electronics (Jiangsu).
Microdiode Electronics (Jiangsu) products are not authorized for use as critical components in life support
devices or systems without express written approval of Microdiode Electronics (Jiangsu).
http://www.microdiode.com
Rev:2020A0
Page :3
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