JK-mSMD150SF/24V

Jk-mSMD 1812 Series Surface Mount PTC Devices Performance Specification Maximum V max Model Imax Resistance I hold I trip Pd Time To Trip @25°C @25°C Typ. Current Time R i min R1max (V dc) (A) (A) (A) (W) (A) (Sec) () () JK-mSMD 010SF 30.0 100 0.10 0.30 0.8 0.5 1.50 0.750 15.000 JK-mSMD 014SF 60.0 100 0.14 0.34 0.8 1.5 0.15 0.650 6.000 JK-mSMD 020SF 30.0 100 0.20 0.40 0.8 8.0 0.02 0.350 5.000 JK-mSMD 030SF 30.0 100 0.30 0.60 0.8 8.0 0.10 0.250 3.000 JK-mSMD 050SF 15.0 100 0.50 1.00 0.8 8.0 0.15 0.150 1.000 JK-mSMD 050SF/33V 33.0 100 0.50 1.00 0.8 8.0 0.15 0.150 1.000 JK-mSMD 050SF/60V 60.0 100 0.50 1.00 0.8 8.0 0.15 0.150 1.400 JK-mSMD 075SF 13.2 100 0.75 1.50 0.8 8.0 0.20 0.090 0.450 JK-mSMD 110SF 8.0 100 1.10 2.20 0.8 8.0 0.30 0.050 0.250 JK-mSMD 110SF/16V 16.0 100 1.10 2.20 0.8 8.0 0.30 0.050 0.250 JK-mSMD 125SF 16.0 100 1.25 2.50 0.8 8.0 0.40 0.050 0.140 JK-mSMD 150SF 8.0 100 1.50 3.00 0.8 8.0 0.50 0.040 0.160 JK-mSMD 150SF/16V 16.0 100 1.50 3.00 0.8 8.0 0.50 0.040 0.160 JK-mSMD 150SF/24V 24.0 100 1.50 3.00 0.8 8.0 0.50 0.040 0.160 JK-mSMD 160SF 8.0 100 1.60 2.80 0.8 8.0 1.00 0.030 0.130 JK-mSMD 200SF 8.0 100 2.00 4.00 0.8 8.0 2.00 0.020 0.100 JK-mSMD 260SF 8.0 100 2.60 5.00 0.8 8.0 2.50 0.015 0.050 JK-mSMD 300SF 8.0 100 3.00 5.00 0.8 8.0 4.00 0.012 0.040 JK-mSMD 350SF 6.0 100 3.50 6.00 2.0 10.0 4.00 0.008 0.030 V max = Maximum operating voltage device can withstand without damage at rated current (Imax). I max = Maximum fault current device can withstand without damage at rated voltage (V max). I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air. Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame. Environmental Specifications Test Conditions Resistance change Passive aging +85°C, 1000 hrs. ±5% typical Humidity aging +85°C, 85% R.H. , 168 hours ±5% typical Thermal shock +85°C to -40°C, 20 times ±33% typical Resistance to solvent MIL-STD-202,Method 215 No change Vibration MIL-STD-202,Method 201 No change Ambient operating conditions : - 40 °C to +85 °C Maximum surface temperature of the device in the tripped state is 125 °C http:// www.jksemi.com 2016-12-01 版次: c Jk-mSMD 1812 Series Surface Mount PTC Devices Agency Approval and Environmental Complianc Agency File Number Regulation Standard UL EN217453 2002/95/EC TUV pending EN14582 Thermal Derading Chart Recommended Hold Current(A) at Ambient Temperature(°C) Ambient Operation Temperature Model -40°C -20°C 0°C 25°C 40°C 50°C 60°C 70°C 85°C SMD1812-010SF 0.16 0.14 0.12 0.10 0.08 0.07 0.06 0.05 0.03 SMD1812-014SF 0.23 0.19 0.17 0.14 0.12 0.10 0.09 0.08 0.06 SMD1812-020SF 0.29 0.26 0.23 0.20 0.17 0.15 0.14 0.12 0.10 SMD1812-030SF 0.44 0.39 0.35 0.30 0.26 0.23 0.21 0.18 0.15 SMD1812-050SF 0.59 0.57 0.55 0.50 0.45 0.43 0.35 0.30 0.23 SMD182-075SF 1.10 0.99 0.87 0.75 0.63 0.57 0.49 0.45 0.35 SMD1812-110SF 1.60 1.45 1.28 1.10 0.92 0.83 0.71 0.66 0.52 SMD1812-110SF16V 1.59 1.44 1.27 1.10 0.92 0.82 0.70 0.64 0.50 SMD1812-125SF 2.00 1.75 1.52 1.25 1.00 0.95 0.90 0.75 0.53 SMD1812-150SF 2.30 2.05 1.77 1.50 1.23 1.09 0.95 0.82 0.61 SMD1812-150SF16V 2.28 2.03 1.75 1.50 1.21 1.07 0.93 0.79 0.58 SMD1812-160SF 2.10 1.96 1.88 1.60 1.26 1.12 0.98 0.84 0.63 SMD1812-200SF 2.88 2.61 2.25 2.00 1.80 1.66 1.45 1.09 0.80 SMD1812-260SF 3.90 3.42 2.96 2.60 2.33 2.07 1.94 1.35 1.00 SMD1812-300SF 4.15 3.76 3.46 3.00 2.55 2.28 2.01 1.61 1.33 SMD1812-350SF 4.84 4.39 4.04 3.50 2.98 2.66 2.35 1.88 1.55 Thermal Derating Curve Average Time-Current Curve Average Time Current Curves 100 0.30A Time In Seconds 0.50A 0.75A 10 1.00A 1.25A 1.50A 1 1.85A 2.0A 2.50A 0.1 2.60A 3.00A 3.50A 0.01 0.1 1 10 Current In Amperes http:// www.jksemi.com 2016-12-01 版次: c 100 Jk-mSMD 1812 Series Surface Mount PTC Devices Soldering Parameters TP 20~40 S TP 260 Critical Zone Ramp-up TL to TP TL 217 tL 60~150 s Tsmax 200 Tsmin Ramp-down 150 ts Preheat 60~180 s 25 t 25°C to peak Time Profile Feature Pb-Free Assembly Average Ramp-Up Rate(Ts max to T p) 3℃/second mac. Preheat -Temperature Min(Ts min) 150℃ -Temperature Max(Ts max) 200℃ -Time(Ts min to Ts max) 60~180 seconds Time maintained above: -Temperature(TL) 217℃ -Time(tL) 60~150 seconds Peak Temperature(Tp) 260℃ Ramp-Down Rate 6℃/second max. Time 25℃ to Peak Temperature 8 minutes max Storage Condition 0℃~35℃,≤70%RH Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free Recommended maximum paste thickness is 0.25mm Devices can be cleaned using standard industry methods and solvents. Note 1:All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. http:// www.jksemi.com 2016-12-01 版次: c Jk-mSMD 1812 Series Surface Mount PTC Devices Physical Dimensions(mm.) A XX 010 050 B D E C A Model B C D E Min. Max. Min. Max. Min. Max. Min. Min. SMD1812-010SF 4.37 4.73 3.07 3.41 0.50 1.00 0.30 0.25 SMD1812-014SF 4.37 4.73 3.07 3.41 0.50 1.00 0.30 0.25 SMD1812-020SF 4.37 4.73 3.07 3.41 0.50 1.30 0.30 0.25 SMD1812-030SF 4.37 4.73 3.07 3.41 0.50 1.00 0.30 0.25 SMD1812-050SF 4.37 4.73 3.07 3.41 0.40 0.90 0.30 0.25 SMD1812-050SF33V 4.37 4.73 3.07 3.41 0.70 1.30 0.30 0.25 SMD1812-050SF60V 4.37 4.73 3.07 3.41 1.10 1.80 0.30 0.25 SMD182-075SF 4.37 4.73 3.07 3.41 0.40 0.90 0.30 0.25 SMD1812-110SF 4.37 4.73 3.07 3.41 0.40 0.90 0.30 0.25 SMD1812-110SF16V 4.37 4.73 3.07 3.41 0.60 1.30 0.30 0.25 SMD1812-125SF 4.37 4.73 3.07 3.41 0.60 1.30 0.30 0.25 SMD1812-150SF 4.37 4.73 3.07 3.41 0.40 1.20 0.30 0.25 SMD1812-150SF16V 4.37 4.73 3.07 3.41 0.40 1.20 0.30 0.25 SMD1812-160SF 4.37 4.73 3.07 3.41 0.40 1.20 0.30 0.25 SMD1812-200SF 4.37 4.73 3.07 3.41 0.50 1.30 0.30 0.25 SMD1812-260SF 4.37 4.73 3.07 3.41 0.50 1.50 0.30 0.25 SMD1812-300SF 4.37 4.73 3.07 3.41 0.50 1.50 0.30 0.25 SMD1812-350SF 4.37 4.73 3.07 3.41 0.50 1.50 0.30 0.25 Termination Pad Characteristics Terminal pad materials：Tin-plated Nickel-Copper Terminal pad solder ability：Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Recommended Pad Layout (mm.) 1.78 士 0.1 3..2 士 0.1 1.78 士 0.1 3.2 士 0.1 Packaging Quantity Part Number Quantity SMD812 Series 1,500 pcs/reel Tape & reel packaging per EIA481-1 Tape And Reel Specifications (mm) http:// www.jksemi.com 2016-12-01 版次: c EIA Tape Component Dimensions Jk-mSMD 1812 Series Surface Mount PTC Devices Governing Specifications EIA 481-1 W 12 ± 0.3 P0 4.0 ± 0.10 P1 8.0 ± 0.10 P2 2.0 ± 0.05 A0 3.5 ± 0.10 B0 5.1 ± 0.10 B1max. 5.9 D0 1.50 + 0.1, -0 F 5.5 ± 0.05 E1 1.75 ± 0.10 E2min. 10.25 T 0.6 T1max. 0.1 K0 0.9 ± 0.1 Leader min. 390 Trailer min. 160 EIA Tape Component Dimensions P0 Embossment D T P2 E1 Cover A B F W B0 K0 E2 T P1 EIA Reel Dimensions W2(measured at hub) A N(hub dia.) Reel Dimensions A max. 178 N min. 60 W1 12.4 ± 0.5 W2 18.4 Cover tape W1(measured at hub) Carrier tape Embossed cavity Storage And Handling ‧ Storage conditions：35°C max, 70% R.H. ‧ Devices may not meet specified performance if storage conditions are exceeded. Part Number System JK - mSMD 口口口 S F 口口 V special voltage Rating(Optional) Lead-Free Tin-plated Nickel-Copper Holding Current Rating Device Dimensions: Length/width(Unit:1/100 inch) Size 4532 mm / 1812 inch JKSEMI http:// www.jksemi.com 2016-12-01 版次: c Jk-mSMD 1812 Series Surface Mount PTC Devices Cross Reference Cross Reference Darong Bourns / Polytronics / Multifuse® EVERFUSE® 1812L010 MF-MSMF010 SMD1812P010TF mSMD010 -miniSMDC014F 1812L014 MF-MSMF014 SMD1812P014TF mSMD014 SMD1812-020SF miniSMDC020F 1812L020 MF-MSMF020 SMD1812P020TF mSMD020 SMD1812-030SF - 1812L030 MF-MSMF030 SMD1812P030TF mSMD030 SMD1812-050SF miniSMDC050F 1812L050 MF-MSMF050 SMD1812P050TF mSMD050 SMD1812-050SF33V miniSMDC050F 1812L050-30 - SMD1812P050TF/30 mSMD050-33V SMD1812-050SF60V - 1812L050-60 - - mSMD050-60V SMD182-075SF miniSMDC750F 1812L075 MF-MSMF075 SMD1812P075TF mSMD075 SMD1812-110SF miniSMDC110F 1812L110 MF-MSMF110 SMD1812P110TF mSMD110 SMD1812-110SF16V miniSMDC110F/16 - MF-MSMF110/16 SMD1812P110TF/16 mSMD110-16V SMD1812-125SF miniSMDC125F 1812L125 MF-MSMF125 SMD1812P125TF mSMD125 SMD1812-150SF miniSMDC150F 1812L150 MF-MSMF150 SMD1812P150TF mSMD150 SMD1812-150SF16V miniSMDC150F/12 1812L150-12 - SMD1812P150TF/12 mSMD150-16V SMD1812-160SF miniSMDC160F 1812L160 MF-MSMF160 SMD1812P160TF mSMD160 SMD1812-200SF miniSMDC200F 1812L200 MF-MSMF200 SMD1812P200TFT mSMD200 SMD1812-260SF miniSMDC260F 1812L260 MF-MSMF260 SMD1812P260TFT mSMD260 SMD1812-300SF miniSMDC300F 1812L300 - SMD1812P300TFT mSMD300 SMD1812-350SF - - - mSMD350 TYCO/Raychem Littelfuse SMD1812-010SF miniSMDC010F SMD1812-014SF SEA-LAND “Raychem” is a registered trademark of Tyco Electronics. “Littelfuse” is a registered trademark of Littelfuse “Multifuse” is a registered trademark of bourns,Inc. “EVERFUSE” is a registered trademark of Polytronics Technology Corp. “SEA-LAND” is a registered trademark of Sea-Land electronic corp. Website: http://www.jksemi.com For additional information, please contact your local Sales Representative. ©Copyright 2016, jk semi is a registered trademark of jk semi All rights are reserved http:// www.jksemi.com 2016-12-01 版次: c