0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors
DF23 Series
Low profile - 1.5 mm board-to-board distance
●Board-to-Board Application
Board
1.5 +0.2
- 0.1
Plug
Board
●Board-to-FPC Application
Plug
FPC
1.5 +0.2
- 0.1
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Receptacle
Board
Receptacle
■Features
High Contact Reliability
1. Low profile
The 1.5 mm board-to-board distance makes these
connectors ideal for limited space applications.
2. Large variety of number of contacts
Available with 10, 12, 14, 16, 18, 20, 30, 40, 50, and 60
contacts.
Connectors with 10 to 20 contacts are ideal for use in
small LCD connections in cellular phones, PDA’s, video
equipment, photo cameras and miniature of other
devices requiring reliable connections in a small spaces.
Male contact
Female contact
3. Click sensation
Positive click sensation when completely mated confirms
correct insertion and connection of all contacts.
4. High contact reliability
Although connectors are low profile, the female contacts
maintain reliable spring force assuring secure electrical
contact.
Large Self-alignment
0.3
5. Large self-alignment
The large range of alignment of 0.3 mm allows for
smooth insertion.
6. Board placement with automatic equipment
Flat surfaces allows placement of embossed tape
packaged connectors with vacuum nozzles.
■Applications
Mobile phones, PDA’s, notebook PC’s, digital cameras and
other miniature devices.
A238
0.3
DF23 Series●0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors
■Product Specifications
Current rating
0.3A
Storage
Operating
temperature range -35ç to 85ç (Note 1) temperature range -10ç to 60ç (Note 2)
Voltage rating
50V AC
Operating humidity
-20% to 80%
range
Ratings
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Item
Storage humidity
range
Specification
-40% to 70% (Note 2)
Condition
1. Insulation resistance
2. Withstanding voltage
3. Contact resistance
500M ohms min.
No flashover or insulation breakdown
60m ohms max.
100V DC
150V AC/1 minute
100mA
4. Vibration
No momentary disconnections of 1 μs min
Frequency of 10 to 55 Hz, single amplitude of 0.75 mm, in 3
directions for 2 hours
5. Humidity
Contact resistance : 60 m ohms max.
Insulation resistance : 250 M ohms min.
Temperature of 40ç±2ç, humidity of 90% to 95%, 96 hours
6. Temperature cycle
Contact resistance : 60 m ohms max.
Insulation resistance : 500 M ohms min.
(-55ç : 30minutes /5 to 35ç : 10minutes /85ç : 30minutes
/5 to 35ç: 10minutes ) for 5 cycles
7. Durability
Contact resistance
8. Resistance to
soldering heat
No deformation of the insulator parts affecting
performance
50 cycles (mating/unmating)
: 60m ohms max.
Reflow: At recommended temperature profile
Manual soldering: Soldering iron temperature 300°C, for 3 seconds
Note 1: Includes temperature rise caused by the current flow.
Note 2: The term “storage” refers to products stored for long period of time prior to mounting and use. Operating Temperature Range
and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation.
Note 3: Information contained in this catalog represents general requirements for this Series. Contact us for the drawings and
specifications for a specific part number shown.
■Materials
Item
Part
Material
Finish
Remarks
Receptacles
Insulator
LCP
Color : Black
UL94V-0
Plugs
Contacts
Phosphor bronze
Gold plated
----------
■Ordering information
●Receptacles/Plugs
DF23 C - * DS - 0.5 V ( * * )
1
2
3
4
5
6
7
1
Series name: DF23
5
Contact pitch: 0.5mm
2
Metal fitting & Locating boss type
C: Without metal fittings, without Locating boss
6
Terminal type
V: Straight SMT
3
Number of contacts: 10, 12, 14, 16, 18, 20, 22, 30, 40, 50, 60
7
4
Connector type
DS: Double-row receptacle
DP: Double-row plug
Packaging type
Receptacle(51): Embossed tape packaging (2,000 pieces per reel)
Receptacle(53): Embossed tape packaging (3,000 pieces per reel)
Plug(92): Embossed tape packaging (2,000 pieces per reel)
Plug(91): Embossed tape packaging (3,000 pieces per reel)
A239
DF23 Series●0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors
■Receptacles
A±0.3
B±0.15
P=0.5±0.1
0.25±0.05
5±0.2
1.45±0.1
1.1±0.05
0.9±0.05
B±0.03
P=0.5±0.02
0.25±0.02
Note: Shaded area should be free of any conductive
traces.
[Packaging/ quantity per reel code] - * *, (* *)
(51): Embossed tape packaging (2,000 pieces per reel)
(53): Embossed tape packaging (3,000 pieces per reel)
Unit: mm
Product No.
CL No.
Number of Contacts
A
B
DF23C-10DS-0.5V(**)
CL688-0306-9-**
10
05.1
02.0
DF23C-12DS-0.5V(**)
CL688-0309-7-**
12
05.6
02.5
DF23C-14DS-0.5V(**)
CL688-0300-2-**
14
06.1
03.0
DF23C-16DS-0.5V(**)
CL688-0307-1-**
16
06.6
03.5
(Note 1)
DF23C-18DS-0.5V(**)
CL688-0308-4-**
18
07.1
04.0
(Note 2)
DF23C-20DS-0.5V(**)
CL688-0301-5-**
20
07.6
04.5
(Note 1)
DF23C-22DS-0.5V(**)
CL688-0310-6-**
22
08.1
05.0
(Note 2)
DF23C-30DS-0.5V(**)
CL688-0302-8-**
30
10.1
07.0
(Note 1)
DF23C-40DS-0.5V(**)
CL688-0303-0-**
40
12.6
09.5
(Note 1)
DF23C-50DS-0.5V(**)
CL688-0304-3-**
50
15.1
12.0
(Note 1)
CL688-0305-6-**
60
17.6
14.5
(Note 1)
DF23C-60DS-0.5V(**)
Note
Note
Note
Note
A240
0.5±0.1
BRecommended PCB Footprints
4.4±0.05
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
6±0.2
0.15±0.05
1:
2:
3:
4:
Available in code (51) only.
Available in code (53) only.
Contact Hirose for availability.
Please order embossed tape packaging items by the reel.
Remarks
RoHS
(Note 2)
YES
DF23 Series●0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors
■Plugs
A±0.15
B±0.15
P=0.5±0.1
0.15±0.05
4.3±0.2
1.2±0.1
0.45±0.1
BRecommended PCB Footprints
C
B±0.03
1±0.05
P=0.5±0.02
0.25±0.02
Note 1: Shaded area should be free of any conductive
traces.
Note 2: Do not leave any conductive traces or install
components in this area.
0
1.7 -0.1
2.9±0.05
6
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
3.1±0.15
0.19±0.05
[Packaging/ quantity per reel code] - * *, (* *)
(92): Embossed tape packaging (2,000 pieces per reel)
(91): Embossed tape packaging (3,000 pieces per reel)
Unit: mm
Product No.
CL No.
Number of Contacts
A
B
C
DF23C-10DP-0.5V(**)
CL688-0806-1-**
10
04.0
02.0
05.1
DF23C-12DP-0.5V(**)
CL688-0809-0-**
12
04.5
02.5
05.6
DF23C-14DP-0.5V(**)
CL688-0800-5-**
14
05.0
03.0
06.1
DF23C-16DP-0.5V(**)
CL688-0807-4-**
16
05.5
03.5
06.6
DF23C-18DP-0.5V(**)
CL688-0808-7-**
18
06.0
04.0
07.1
DF23C-20DP-0.5V(**)
CL688-0801-8-**
20
06.5
04.5
07.6
(Note 2)
DF23C-22DP-0.5V(**)
CL688-0810-9-**
22
07.0
05.0
08.1
(Note 1)
DF23C-30DP-0.5V(**)
CL688-0802-0-**
30
09.0
07.0
10.1
DF23C-40DP-0.5V(**)
CL688-0803-3-**
40
11.5
09.5
12.6
(Note 2)
DF23C-50DP-0.5V(**)
CL688-0804-6-**
50
14.0
12.0
15.1
(Note 2)
DF23C-60DP-0.5V(**)
CL688-0805-9-**
60
16.5
14.5
17.6
(Note 2)
Note
Note
Note
Note
1:
2:
3:
4:
Remarks
RoHS
(Note 1)
(Note 2)
YES
Available in code (91) only.
Available in code (92) only.
Contact Hirose for availability.
Please order embossed tape packaged items by the reel.
A241
DF23 Series●0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors
BEmbossed Career Tape Dimensions
2±0.1
1.6±0.15
1.75±0.1
■Receptacles
Y-Y
12±0.1
0.3±0.1
E±0.1
.7
5
+
0
0 .1
X
1
0.
+ 0
5
.7
R0
0.2±0.05
X
Y
(Note.1)
Unreeling direction
X-X
Product name label
3±
■Reel Dimensions
0.2
(Note.2)
Ø1
Ø330±2
Ø80±1
Depth of 1.5
diameter
PS
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
R0
D±0.3
F±0.1
.1
+0 0
.5
Ø1
4±0.1
Y
G±0.5
H±1
Unit: mm
Product No.
D
E
F
G
H
DF23C-10DS-0.5V(**)
16.0
----
07.5
17.5
21.5
DF23C-12DS-0.5V(**)
16.0
----
07.5
17.5
21.5
DF23C-14DS-0.5V(**)
16.0
----
07.5
17.5
21.5
DF23C-16DS-0.5V(**)
16.0
----
07.5
17.5
21.5
DF23C-18DS-0.5V(**)
16.0
----
07.5
17.5
21.5
DF23C-20DS-0.5V(**)
16.0
----
07.5
17.5
21.5
DF23C-22DS-0.5V(**)
24.0
----
11.5
25.5
29.5
DF23C-30DS-0.5V(**)
24.0
----
11.5
25.5
29.5
DF23C-40DS-0.5V(**)
24.0
----
11.5
25.5
29.5
DF23C-50DS-0.5V(**)
24.0
----
11.5
25.5
29.5
DF23C-60DS-0.5V(**)
32.0
28.4
14.2
33.5
37.5
Note 1: This side feed hole is added to embossed tape where the D dimension is 32.0 min. wide.
Note 2: (53) packaging code embossed tape is without the bottom surface protrusion.
A242
DF23 Series●0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors
■Plugs
Y-Y
2±0.1
1.5±0.15
1.75±0.1
12±0.1
Ø1
4±0.1
.1
+00
.5
X
X
Y
Unreeling direction
X-X
(Note.1)
0.2
■Reel Dimensions
3±
Product name label
Ø1
Ø80±1
Ø330±2
Depth of 1.5
diameter
PS
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
D±0.3
F±0.1
Y
0.3±0.1
G±0.5
H±1
Unit: mm
Product No.
D
F
G
H
DF23C-10DP-0.5V(**)
16.0
07.5
17.5
21.5
DF23C-12DP-0.5V(**)
16.0
07.5
17.5
21.5
DF23C-14DP-0.5V(**)
16.0
07.5
17.5
21.5
DF23C-16DP-0.5V(**)
16.0
07.5
17.5
21.5
DF23C-18DP-0.5V(**)
16.0
07.5
17.5
21.5
DF23C-20DP-0.5V(**)
16.0
07.5
17.5
21.5
DF23C-22DP-0.5V(**)
24.0
11.5
25.5
29.5
DF23C-30DP-0.5V(**)
16.0
07.5
17.5
21.5
DF23C-40DP-0.5V(**)
24.0
11.5
25.5
29.5
DF23C-50DP-0.5V(**)
24.0
11.5
25.5
29.5
DF23C-60DP-0.5V(**)
24.0
11.5
25.5
29.5
Note : Code number (91) embossed tape is without the bottom surface protrusion.
A243
DF23 Series●0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors
BUsage Precautions
1.Recommended
Temperature (ç)
Temperature Profile
250ç
250
Temperature
220ç
200
180ç
150
150ç
90~120sec
Preheating
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
100
A244
60sec max
Soldering
50
Room temperature
0
50
100
150
200
250
300
Time (sec.)
Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that there is a return
to normal temperature between the first and second cycle.
Note 2: The temperature profile indicates the board surface temperature at the point of contacts with the
connector terminals.
2.Recommended Manual
Soldering Conditions
3.Recommended Screen
Thickness and Open Area
Ratio (Pattern Area Ratio)
Temperature: 290ç±10ç, Soldering time: within 2 sec.
■Thickness : 0.12 mm
■Open Area ratio: 80%
4.Board Warping
■Maximum of 0.03 mm at the connector center section, with both ends of the connector as reference points.
5.Cleaning Conditions
■Refer to the "Nylon Connector Use Handbook."
6.Use and handling precautions.
■When manually handling the connectors avoid touching any portion of exposed terminal leads.
■This may cause deformation and lead to difficulties with placement and soldering on the PCB.
■When mating/un-mating do not use excessive force or lifting of one side only.