TflexTM HD700 Series
Thermal Gap Filler
PRODUCT DESCRIPTION
Tflex™ HD700 thermal gap filler combines 5 W/mK thermal conductivity with superior pressure
versus deflection characteristics. The combination will allow minimal stress on components
while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will
be experienced within your device.
Tflex™ HD700PI can be provided with an integrated polyimide film on one side. This liner
provides numerous application benefits like electrical isolation, placement ease during
assembly, and tear resistance for applications that require shear.
Tflex™ HD700 and Tflex™ HD700PI are available in thickness from 0.5mm (0.020”) to 5mm
(0.200”). The standard material Tflex™ HD700 material is a light pink color, but we do have the
option to provide this in a grey color if a neutral color is desired (Tflex HD700,GR).
Laird can provide material to meet your production needs in any region through our local
production facilities. Please contact your local Laird sales or field engineering contact for
samples or questions.
FEATURES AND BENEFITS
5.0 W/mK thermal conductivity
Low pressure versus deflection
Excellent surface wetting for low contact resistance
Minimizes board and component stress
Option for additional electrical isolation and tear resistance
Environmentally friendly solution that meets regulatory requirements including RoHS and
REACH
SPECIFICATIONS
Americas: +1.866.928.8181
Europe: +49.(0).8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com
TYPICAL PROPERTIES
VALUE
TEST METHOD
Construction & Composition
Color
Thickness Range
Ceramic filled silicone sheet
Pink (*Option for Dark Grey)
0.50mm (0.020”) 5.0mm (0.20”)
N/A
Visual
N/A
Thickness Tolerance
+/- 10%
N/A
Thermal Conductivity (W/mK)
5.0
ASTM D5470
Density (g/cc)
Hardness (Shore 00)
Outgassing TML (weight %)
3.3
54
0.23
Helium Pycnometer
ASTM D2240
ASTM E595
Outgassing CVCM (weight %)
0.07
ASTM E595
Temperature Range
Rth@ 40 mils, 10 psi
-50°C to 200°C
0.287°C–in2/W
Laird Test Method
ASTM D5470 (Modified)
Dielectric Constant @ 1 MHz
5.01
ASTM D150
UL Flammability Rating
V-0
UL 94
Volume Resistivity
1.4x 1014 ohm-cm
ASTM D257
TflexTM HD700 Series
Thermal Gap Filler
Tflex HD700 Thermal Resistance vs Pressure
1.400 C-in2/W
1.200 C-in2/W
1.000 C-in2/W
0.800 C-in2/W
0.600 C-in2/W
0.400 C-in2/W
0.200 C-in2/W
0.000 C-in2/W
10 psi 20 psi 30 psi 40 psi 50 psi 60 psi 70 psi 80 psi 90 psi 100 psi
Tflex HD720
Tflex HD740
Tflex HD780
Tflex HD7100
Tflex HD7140
Tflex HD7200
Tflex HD700 Deflection vs Pressure
80%
70%
60%
50%
40%
30%
20%
10%
0%
0 psi
20 psi
40 psi
60 psi
80 psi
100 psi
Tflex HD720
Tflex HD740
Tflex HD780
Tflex HD7100
Tflex HD7140
Tflex HD7200
AVAILABILITY
STANDARD THICKNESSES
0.5mm (0.020”) to 5.0mm (0.200”) thick material available in 0.25mm (0.010”) increments
Available in standard sheet sizes of 18” x 18” and 9” x 9” or custom die cut parts
OPTIONS
DC1 – eliminate tack from one side
PI – polyimide liner added to one side
GR - Dark Grey Color
PART NUMBER SYSTEM
Tflex™ indicates Laird elastomeric thermal gap filler product line. HD7xxx indicates Tflex HD700 product line with thickness in mils (0.001”).
Tflex™ HD740 = 0.040” thick Tflex™ HD700 material
Tflex™ HD7100,DC1 = 0.10” thick Tflex™ HD700 material with DC1 option
Tflex™ HD7100PI = 0.10” thick Tflex™ HD700 material with PI liner
Tflex™ HD7120,GR = 0.120” thick Tflex™ HD700 material in dark grey color
A17758-00 Tflex HD700 DS 02-24-2022
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end
user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or
consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies,
Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third
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