P6SMB6.8A

P6SMB6.8(C)A P6SMB550(C)A Stand-off Voltage - 6.8 to 550 Volts Peak Pulse Power: 600 Watts SURFACE MOUNT TRANSISIENT VOLTAGE SUPPRESSOR Features DO-214AA/SMB  For surface mounted applications in order to optimize board  space Low profile package  Built-in strain relief  Glass passivated junction 0.155(3.94) 0.130(3.30) 0.086 (2.20) 0.071 (1.80)  Low inductance  Excellent clamping capability  600W peak pulse power capability at 10/1000μs waveform, 0.185(4.70) 0.160(4.06)  repetition rate (duty cycle): 0.01%  Fast response time 0.012(0.305) 0.006(0.152)  Typical IR less than 1μA above 12V  High Temperature soldering: 260℃/ 40 seconds at terminals  Plastic package has underwriters laboratory flammability 94V-0 0.096(2.44) 0.084(2.13) 0.060(1.52) 0.030(0.76) 0.008(0.203)MAX. Mechanical Data 0.220(5.59) 0.200(5.08) Case : JEDEC DO-214AA/SMB molded plastic body Terminals : Solderable per MIL-STD-750,Method 2026 Polarity : Polarity symbol marking on body Dimensions in inches and (millimeters) Mounting Position : Any Weight : 0.003 ounce, 0.095 grams Applications I/O interface AC/DC power supply Industrial and Consumer electronic applications. MAXIMUM RATINGS AND CHARACTERISTICS Ratings at 25℃ ambient temperature unless otherwise specified. Peak Pulse Power Dissipation at TA=25ºC by 10x1000μs waveform (Fig.1) (Note 1), (Note 2) Power Dissipation on infinite heat sink at TA=50O C Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3) Maximum Instantaneous Forward Voltage at 50A for Unidirectional only (Note 4) Operating Junction and Storage Temperature Range PPPM 600 Watts PM(AV) 5.0 Watts IFSM 100 Amps VF 3.5V/5.0 V TJ,TSTG -65 to +150 ℃ Typical Thermal Resistance Junction to Lead RθJL 20 ℃/W Typical Thermal Resistance Junction to Ambient RθJA 100 ℃/W Notes: (1)Non-repetitive current pulse , per Fig. 3 and derated above TA = 25℃per Fig. 2. (2) Mounted on 0.2 x 0.2" (5.0 x 5.0 mm) copper pads to each terminal (3) VF