BRIGHT LED ELECTRONICS CORP.
Specification for Approval
●
DEVICE NUMBER: BL-HBH36D-TRC
PAGE
DATE
2015.10.22
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SAMPLES
ATTACHED AREA
8
CONTENTS
1.0 1.0 1.0
Initial Released
FOR CUSTOMER’S APPROVAL STAMP OR SIGNATURE
APPROVED
PURCHASE
MANUFACTURE
佰鴻工業股份有限公司
BRIGHT LED ELECTRONICS CORP.
新北市板橋區和平路 19 號 3 樓
3F., No.19, He Ping Road,
Ban Qiao Dist., New Taipei City,
Taiwan
Tel: +886-2-29591090
QUALITY
ENGINEERING
ISSUED
APPROVED
PREPARED
張
占
任
2015.10.22
2015.10.22
2015.10.22
孝 嚴
旭
穎
BRIGHT LED ELECTRONICS CORP.
BL-HBH36D-TRC
● Features:
●Package Dimensions:
1. Emitted Color : Super Blue
2. Lens Appearance: Water Clear.
Cathode Mark
3. Mono-color type.
4. 1.6x0.8x0.8mm(0603) standard package.
Cathode
Anode
5. Suitable for all SMT assembly methods.
6. Compatible with infrared and vapor phase
reflow solder process.
7. Compatible with automatic placement
equipment.
For reflow soldering
0.8(.031)
0.7(.027)
0.8(.031)
8. This product doesn’t contain restriction
Substance, comply ROHS standard.
0.8(.031)
● Applications:
1.
Automotive: Dashboards, stop lamps,
turn signals.
2.
Backlighting: LCDs, Key pads advertising.
3.
Status indicators: Comsumer & industrial
NOTES:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.10mm (0.004”) unless otherwise specified.
3. Specifications are subject to change without notice.
electronics.
4. General use.
● Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Rating
Unit
Power Dissipation
Pd
70
mW
Forward Current
IF
20
mA
Peak Forward Current *1
IFP
100
mA
Reverse Volage
VR
5
V
Operating Temperature
Topr
-40℃~85℃
-
Storage Temperature
Tstg
-40℃~85℃
-
Soldering Temperature
Tsol
See Page 6
-
* 1 Condition for IFP is pulse of 1/10 duty and 0.1msec width.
Ver.1.0 Page 1 of 8
BRIGHT LED ELECTRONICS CORP.
BL-HBH36D-TRC
● Electrical and optical characteristics(Ta=25℃)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Forward Voltage
Vf
IF=5mA
-
2.8
3.2
V
Luminous Intensity
Iv
IF=5mA
12.3
25
-
mcd
Reverse Current
IR
VR=5V
-
-
1
µA
Peak Wave Length
λp
IF=5mA
-
460
-
nm
Dominant Wave Length
λd
IF=5mA
465
475
nm
Spectral Line Half-width
Δλ
IF=5mA
-
30
-
nm
Veiwing Angle
2θ1/2
IF=5mA
-
120
-
deg
● Typical Electro-Optical Characteristics Curves
Fig.2 Forward current derating curve
vs. ambient temperature
Fig.1 Relative intensity vs. wavelength
50
1.0
Forward current (mA)
Relative radiant intensity
40
0.5
30
20
10
0
0
410
460
60
80
100
Fig.4 Relative luminous intensity vs.
ambient temperature
Fig.3 Forward current vs. forward voltage
3.0
50
2.5
30
20
10
1
2
3
4
(Normalized @ 20mA)
Relative luminous intensity
40
Forward current (mA)
40
Ambient temperature Ta( C)
Wavelength (nm)
0
20
510
2.0
1.5
1.0
0.5
0
-40
5
-20
Forward voltage(V)
0
20
40
60
Ambient
A
temperature Ta( C)
Fig.6 Radiation diagram
Fig.5 Relative luminous intensity vs. forward current
0
2.0
10
20
RELATIVE RADIANT INTENSITY
Relative luminous intensity (@20mA)
30
1.5
1.0
0.5
0
10
20
30
40
50
40
1.0
0.9
50
0.8
60
70
0.7
80
90
0.5
0.3
0.1
0.2
0.4
0.6
Forward current (mA)
Ver.1.0 Page 2 of 8
BRIGHT LED ELECTRONICS CORP.
BL-HBH36D-TRC
● Tapping and packaging specifications(Units: mm)
Quantity:1000-4000PCS
START
END
CATHODE
8.0 ± 0.3
ANODE
USER DIRECTION OF FEED
●Package Method:(unit:mm)Vacuum
12 bag/box
4000 pcs/reel
200
Bar Code Label
245
220
220
Aluminum Foil Bag
185
645
6 box/carton
210
470
Ver.1.0 Page 3 of 8
BRIGHT LED ELECTRONICS CORP.
BL-HBH36D-TRC
● Bin Limits
I n t e n s i t y B i n L i m i ts ( A t 5 m A )
BIN CODE
Min. (mcd)
Max. (mcd)
K
12.3
18.5
L
18.5
28
M
28
42
N
42
63
To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 5 %
C o l o r B i n L i m i ts ( A t 5 m A )
BIN CODE
Min. (nm)
Max. (nm)
4
465
470
5
470
475
To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 n m
V F B i n L i m i ts ( A t 5 m A )
BIN CODE
Min.(v)
Max.(v)
E
2.4
2.6
F
2.6
2.8
G
2.8
3.0
H
3.0
3.2
To l e r a n c e f o r e a c h B i n l i m i t i s ± 0 . 0 5 V
● B IN: x
x
x
VF BIN CODE
Color BIN CODE
Intensity BIN CODE
Ver.1.0 Page 4 of 8
BRIGHT LED ELECTRONICS CORP.
BL-HBH36D-TRC
● Reliability Test
Classification
Test Item
Reference Standard
Test Conditions
MIL-STD-750D:1026 Ta: Under room temperature
Operation Life MIL-STD-883D:1005 Test time:1,000hrs
JIS-C-7021
:B-1
IF=Product Recommended IF
High
Temperature MIL-STD-202F:103B Ta:85±5℃
High Humidity JIS-C-7021
:B-11 RH:90%-95%
Endurance
Storage
Test time:240hrs
Test
Ta:100±5℃
High
MIL-STD-883:1008
Temperature
Test time:1,000hrs
JIS-C-7021
:B-10
Storage
Ta: -40±5℃
Low
Temperature JIS-C-7021
:B-11 Test time=1,000hrs
Storage
MIL-STD-202F:107D
Temperature MIL-STD-750D:1051 Ta:-35±5℃~25±5℃~85±5℃~25±5℃
Cycling
MIL-STD-883D:1010 30min 5min
30min
5min
JIS-C-7021
:A-2
MIL-STD-202F:107D( Ta:-40±5℃ ~+85±5℃
1980)
10min
10 min
MIL-STD-750D:1051( Time: 20min/cycle
10cycle
Thermal Shock
95)
Environmental
MIL-STD-883D:1011(1
Test
991)
Result
0/32
0/32
0/32
0/32
0/32
0/32
Wetting
balance
MIL-STD-883:2003
MIL-STD-202F:208D
MIL-STD-883D:2003
Ta:230±5℃
Time:5±0.5s
0/32
Solder
Resistance
MIL-STD-202F:210A
MIL-STD-883D:1011
JIS-C-7021
:A-1
Ta:260±10℃
Time:10±1s
0/32
● Judgment criteria of failure for the reliability
Measuring items
Forward voltage
Reverse current
Luminous intensity
Note:
Symbol
VF ( V)
IR(uA)
Iv ( mcd )
Measuring conditions
IF=5mA
VR=5V
IF=5mA
Judgement criteria for failure
Initial Level*1.1
Over U*2
Initial Level*0.7
1.U means the upper limit of specified characteristics.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
Ver.1.0 Page 5 of 8
BRIGHT LED ELECTRONICS CORP.
BL-HBH36D-TRC
●IR-Reflow Soldering
260℃ Max.
10sec.Max.
Above255℃
30sec.Max.
3℃/sec.Max.
6℃/sec.Max.
Above 217℃
60~150sec.
Pre-heating
150~200℃
60~120sec.
1.
Avoid any external stress applied to the resin while the LEDs are at
high temperature, especially during soldering .
2.
Avoid rapid cooling or any excess vibration during temperature ramp-down process
3.
Although the soldering condition is recommended above,
soldering at the lowest possible temperature is feasible for the LEDs
Ver.1.0 Page 6 of 8
BRIGHT LED ELECTRONICS CORP.
BL-HBH36D-TRC
● Dip Soldering
TEMPERATURE( °C)
300
Max:260℃,5sec.
Suggest:2~3sec.
250
200
150
100
Fluxing
50
30
Preheat
10
20
30
40
50
60
70
80
90
100
110
120
TIME(sec.)
1. Please avoid any external stress applied to the lead-frames and
epoxy while the LEDs are at high temperature,especially during soldering
2. DIP soldering and hand soldering should not be done more than one time.
3. After soldering, avoid the epoxy lens from mechanical shock or
vibration until the LEDs are back to room temerature.
4. Avoid rapid cooling during temperature ramp-down process
5. Although the soldering condition is recommended above,
soldering at the lowest possible temperature is feasible for the LEDs
● IRON
Soldering
300℃ Within 3 sec.,One time only.
Ver.1.0 Page 7 of 8
BRIGHT LED ELECTRONICS CORP.
BL-HBH36D-TRC
● Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
● Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a. Completed within 168 hours.
b. Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
48 hours at 60℃±3℃.
● Package and Label of Products:
(1) Package: Products are packed in one bag of 4000 pcs (one taping reel) and a label is attached
on each bag.
(2) Label:
BRIGHT LED LOGO
C
Part No.
Quantity
BIN.
Sealing Date
x
xx
xx
Year Month
xx
Day
Manufacture Location
Ver.1.0 Page 8of 8
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