SS210A

SS22A THRU SS220A 2.0 A Surface Mount Schottky Barrier Rectifiers - 20V-200V Features Package outline The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Metal silicon junction,majority carrier conduction Low power loss,high efficiency Built-in strain relief,ideal for automated placement High forward surge current capability High temperature soldering guaranteed: 260 C/10 seconds at terminals Compliant to RoHS Directive 2011/65/EU SMA/DO-214AC 0.108(2.75) 0.096(2.45) 0.067 (1.70) 0.051 (1.30) 0.177(4.50) 0.157(3.99) 0.012(0.305) 0.006(0.152) Mechanical data 0.096(2.42) 0.078(1.98) Case: JEDEC DO-214AC molded plastic body Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any 0.060(1.52) 0.030(0.76) 0.008(0.203)MAX. 0.208(5.28) 0.188(4.80) Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT T A=25 oC unless otherwise noted) SYMBOLS SS22A SS23A SS24A SS25A SS26A SS28A SS210A SS215A SS220A UNITS Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL(see fig.1) Peak forward surge current 8.3ms single half sine-wave superimposed on rated load Maximum instantaneous forward voltage at 2.0A Maximum DC reverse current TA=25 C at rated DC blocking voltage TA=100 C Typical junction capacitance (NOTE 1) Typical thermal resistance (NOTE 2) Operating junction temperature range Storage temperature range VRRM VRMS VDC 20 14 20 30 21 30 40 28 40 50 35 50 60 42 60 80 56 80 100 70 100 150 200 105 150 140 200 V V V I(AV) 2.0 A IFSM 50.0 A VF 0.85 0.95 0.1 0.5 10.0 IR CJ RθJA TJ, TSTG 0.70 0.55 5.0 220 80 -55 to +125 -55 to +150 -55 to +150 2.0 V mA pF C/W C C Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 2.P.C.B. mounted with 2.0x2.0”(5.0x5.0cm) copper pad areas www.fuxinsemi.com Page 1 Ver2.1 SS22A THRU SS220A 2.0 A Surface Mount Schottky Barrier Rectifiers - 20V-200V 2.0 1.6 Single Phase Half Wave 60Hz Resistive or inductive Load 1.2 P.C.B mounted on 0.2*0.2"(5.0*5.0mm) copper pad areas 0.8 SS22A-SS24A SS25A-SS220A 0.4 0 0 25 50 75 100 125 150 50 40 30 20 10 175 0 8.3ms SINGLE HALF SINE-WAVE (JEDEC Method) 1 TJ=25 C 10.0 1 SS22A-SS24A SS25A-SS26A SS28A-SS210A SS215A-SS220A 0.1 FIG. 4-TYPICAL REVERSE CHARACTERISTICS 100 10 TJ=100 C 1 TJ=75 C 0.1 0.01 TJ=25 C 0.001 0 20 40 60 80 100 PERCENT OF PEAK REVERSE VOLTAGE,% 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 INSTANTANEOUS FORWARD VOLTAGE, VOLTS FIG. 5-TYPICAL JUNCTION CAPACITANCE 2000 1000 TJ=25 C 100 SS22A-SS24A SS25A-SS220A TRANSIENT THERMAL IMPEDANCE, C/W 0.01 100 NUMBER OF CYCLES AT 60 Hz 50 JUNCTION CAPACITANCE, pF 10 LEAD TEMPERATURE, C FIG. 3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS INSTANTANEOUS FORWARD CURRENT,AMPERES FIG. 2-MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT PEAK FORWARD SURGE CURRENT, AMPERES FIG. 1- FORWARD CURRENT DERATING CURVE INSTANTANEOUS REVERSE CURRENT, MILLIAMPERES AVERAGE FORWARD RECTIFIED CURRENT, AMPERES Rating and characteristic curves FIG. 6-TYPICAL TRANSIENT THERMAL IMPEDANCE 100 10 1 0.1 0.01 0.1 1 10 100 10 0.1 1.0 10 100 REVERSE VOLTAGE,VOLTS www.fuxinsemi.com t,PULSE DURATION,sec. Page 2 Ver2.1 SS22A THRU SS220A 2.0 A Surface Mount Schottky Barrier Rectifiers - 20V-200V Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code SS22 SS23 SS24 SS25 SS26 SS28 SS210 SS215 SS220 SS22A SS23A SS24A SS25A SS26A SS28A SS210A SS215A SS220A Suggested solder pad layout C A B Dimensions in inches and (millimeters) www.fuxinsemi.com PACKAGE A B C SMA 0.110 (2.80) 0.063 (1.60) 0.087 (2.20) Page 3 Ver2.1 SS22A THRU SS220A 2.0 A Surface Mount Schottky Barrier Rectifiers - 20V-200V Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 o t25 C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o