PRODUCT SPECIFICATION
Part
Number
Product
Description
Doc
Number
SIM4065
A
Rev
Date
24/10/14
SIM Card Connector, Push Push Type, 8 Pin, SMT with Card Detect,
1.6mm Profile.
Page
1
SIM4065
Approved
AO
Prepared
Checked
ST
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VJ
PRODUCT SPECIFICATION
Part
Number
Product
Description
Doc
Number
SIM4065
A
Rev
Date
24/10/14
SIM Card Connector, Push Push Type, 8 Pin, SMT with Card Detect,
1.6mm Profile.
Page
2
SIM4065
Approved
Prepared
AO
Checked
ST
VJ
1.0 SCOPE.
This specification covers performance, tests and quality requirements for the SIM Card Connector
SIM 4065 (Push Push Type, 8-Pin, SMT, 1.6mm Profile).
2.0 PRODUCT NAME AND PART NUMBER.
SIM Card Connector, 8 Pin, Push Push Type: SIM4065.
3.0 PRODUCT SHAPE, DIMENSIONS AND MATERIAL.
Please refer to drawings.
4.0 RATINGS.
Current rating ……………………….
1.0 Amp DC
Voltage rating ………………………
50 Volts AC (RMS) Max.
Operating Temperature Range ……
-40°C to +85°C
5.0 TEST AND MEASUREMENT CONDITIONS.
Product is designed to meet electrical, mechanical and environmental performance requirements
specified in Paragraph 6.0. All tests are performed under the following conditions unless otherwise
specified.
Temperature ………………………… 15°C ~ +35°C
Relative Humidity …………………… 45% ~ 75% R.H.
6.0 PERFORMANCE.
Item
Examination of Product
Test Condition
Requirement
Visual, dimensional and functional
inspection as per quality plan.
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Product shall meet requirements
of product drawing
and specification.
PRODUCT SPECIFICATION
Part
Number
Product
Description
Doc
Number
SIM4065
A
Rev
Date
24/10/14
SIM Card Connector, Push Push Type, 8 Pin, SMT with Card Detect,
1.6mm Profile.
Page
3
SIM4065
Approved
Prepared
AO
Checked
ST
6.1 Electrical Performance.
Item
Test Condition
Requirement
Contact Resistance
Measure and record contact resistance of
mated connector using test current of
10mA max and 20 mV open circuit
voltage in accordance with EIA-364-23A.
Insulation Resistance
Apply 500Volts DC between adjacent
contacts of mated connectors for one
minute in accordance with EIA-364-21C.
Dielectric Strength
Mate connectors and apply500 V AC for 1
minute between adjacent terminal or
ground, in accordance with EIA-364-20B.
Signal 100 mΩ max
Switch 300 mΩ max
1000 MΩ minimum
No creeping discharge or flash
over.
6.2 Mechanical Performance.
Item
Test Condition
Requirement
Durability
The connector should be mated and
unmated for 5000 cycles at a rate of 10
cycles/ minute in accordance with EIARS-364-09A.
Vibration
Subject mated connectors to 10 to 55 to
10 Hz frequency span over 1 minute at a
1.52mm amplitude for a total of 15
minutes. Test to be conducted on 3
mutually perpendicular planes. In
accordance with EIA-364-28.
Mechanical Shock
Apply DC and 1mA to all contacts and
subject the part to a 294 m/s2 half sine
wave acceleration for 11 ms.
Three shocks to be applied in each of the
X, Y and Z planes and in both directions.
A total of 18 shocks and in accordance
with EIA-364-27B.
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No evidence of physical damage.
Contact Resistance
Signal≦100mΩ.
Switch ≦300mΩ at end of test
No evidence of physical damage
Contact Resistance
≦100mΩ
Current discontinuity≦ 1μs
at end of test
No evidence of physical damage
Contact Resistance
≦100mΩ
Current discontinuity≦ 1μs
at end of test.
VJ
PRODUCT SPECIFICATION
Part
Number
Product
Description
Doc
Number
SIM4065
A
Rev
Date
24/10/14
SIM Card Connector, Push Push Type, 8 Pin, SMT with Card Detect,
1.6mm Profile.
Page
4
SIM4065
Approved
Prepared
AO
Checked
ST
VJ
6.3 Environmental Performance and Others.
Item
Test Condition
Requirement
No evidence of physical damage,
discharge, flashes
Contact Resistance
Signal≦100mΩ.
Switch ≦300mΩ at end of test
Insulation Resistance
≧ 1000 MΩ
Mate Connector and perform the
following thermal cycle :-
Thermal Shock
-40+/-3℃for 30 minutes.
+25℃ for 5 minutes.
+85+/-2℃for 30 minutes.
+25℃ for 5 minutes.
Repeat for 5 cycles in accordance with
EIA-364-32C.
Humidity Test
Salt Water Spray
Temperature Life (High)
Solderability
Resistance to Reflow
Soldering Heat.
Mate connector and expose to
temperature of 40±2 with 95% RH for
96 hours then place in ambient
temperature for 1 to 2 hrs. In accordance
with EIA-RS-364-31A.
No evidence of physical damage,
discharge, flashes
Contact Resistance
Signal≦100mΩ.
Switch ≦300mΩ at end of test
Insulation Resistance
≧ 1000 MΩ
Subject mated connectors to 35±2 and
5±1% salt condition for 24 hours. Test in
accordance with EIA-RS-364-26B.
Contact Resistance
Signal≦100mΩ.
Switch ≦300mΩ at end of test
No pin hole, corrosion on contact
area
Subject mated connectors to 85°C ±2°C
for 250 hours in accordance with EIA364-17B.
No evidence of physical damage
Signal≦100mΩ.
Switch ≦300mΩ at end of test
Dip solders tails into molten solder, held
at a temperature of 245±5°C for 5±0.5
second, in accordance with EA-364-52.
95% of immersed area must show
no voids of pin holes.
Mount connector, place in reflow oven
and expose to the temperature profile
shown in fig 1.0
No evidence of physical damage
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PRODUCT SPECIFICATION
Part
Number
Product
Description
Doc
Number
SIM4065
A
Rev
Date
24/10/14
SIM Card Connector, Push Push Type, 8 Pin, SMT with Card Detect,
1.6mm Profile.
Page
5
SIM4065
Approved
Prepared
AO
Checked
Fig. 1. Recommended Reflow Temp. Profile
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ST
VJ
PRODUCT SPECIFICATION
Part
Number
Product
Description
Doc
Number
SIM4065
A
Rev
Date
24/10/14
SIM Card Connector, Push Push Type, 8 Pin, SMT with Card Detect,
1.6mm Profile.
Page
6
SIM4065
Approved
Prepared
AO
ST
Checked
7.0 PRODUCT QUALIFICATION AND TEST SEQUENCE
Test Item
Group
A
B
C
D
E
F
G
Examination of
Product
1,4
1,6
1,10
1,5
1,5
1,3
1,3
Contact Resistance
2,5
2,5
2,7
2,4
2,4
Insulation
Resistance
3,8
Dielectric Strength
4,9
Durability
3
Vibration
4
3
Mechanical shock
Thermal Shock
5
6
Humidity
Salt Water Spray
3
Temperature
Life(high)
3
Solderability
2
Resistance to
Reflow Soldering
Heat.
Sample QTY.
2
5
5
5
5
5
5
5
The Number of Group is Test Sequence (Drop Test Sample QTY 1
C
)
Notes:
Numbers indicate sequence in which tests are performed.
Precondition samples with 10 cycle’s durability.
SAMPLE SELECTION
Samples shall be prepared in accordance with applicable manufactures’ instructions and
shall be randomly selected from current production. Test groups A,B,C,D,E,F &G shall consist of
a minimum of five connectors. A minimum of 30 contacts shall be selected and identified.
Unless otherwise specified, these contacts shall be used for all measurements.
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