TYPE-C-2.0-16PIN-SMT-3-OR

东莞市皓富电子科技有限公司 ＤＯＮＧＧＵＡＮ　ＨＡＯＦＵ　ＥＬＥＣＴＲＩＯＮＣＳ　ＴＥＣＨＮＯＬＯＧＹ　ＣＯ．，ＬＴＤ 东莞市皓富电子科技有限公司 制訂日期：17/06/10 产品规格书 文件編號： 文件履历表 No. Date Document No. Prepared Checked Approved Summary Product specification 产 品 规 格 书 Product Name Part Number. Rev. USB3.1 C TYPE CONNECTOR, / A 1/10 产品规格书 东莞市皓富电子科技有限公司 产品规格书 制訂日期：17/06/10 文件編號： 1；SCOPE（适用范围） 2；REFERENCE DOCUMENTS（参考文件） 3；FEATURE & DIMENSIONS （特征及尺寸） 3.1. PRODUCT DIMENSION（产品尺寸） 3.2. PCB/PANEL LAYOUT （印刷电路板布局） 3.3. MATERIAL（材料） 3.4. MECHANICAL & ELECTRICAL CHARACTERISTIC （机械及电气特性） 3.5. PACKAGING（包装） 3.6. TRANSPORTATION（运输） 3.7. STORAGE（存贮） 4. ENVIRONMENTAL（环境要求） 4.1. SOLDERABILITY（可焊性） 4.2. RESISTANCE TO SOLDER HEAT（耐焊接热） 4.2.1. Wave Soldering （波峰焊） 4.2.1.1. Preheat（预热） 4.2.1.2. Soldering（焊接） 4.2.1.3. Cool Down （冷却） 4.2.2. INFRARED REFLOW（红外线回流焊） 4.2.2.1. Preheat（预热） 4.2.2.2. Soldering（焊接） 4.2.2.3. Cool Down （冷却） 4.3. CLEANING （清洗） 5. PERFORMANCE AND TEST DESCRIPTION （性能及测试） 5.1. REQUIREMENT（要求） 5.2. TEST CONDITION（测试条件） 5.3. SAMPLE SELECTION（样品选择） 5.4. TEST SEQUENCE（测试顺序） 6. QUALITY ASSURANCE PROVISIONS （品质保证） TABLE I：PRODUCT QUALIFICATION TEST SEQUENCE TABLE II：REFLOW SOLDERING PROFILE 2/10 产品规格书 东莞市皓富电子科技有限公司 产品规格书 制訂日期：17/06/10 文件編號： 1. SCOPE（适用范围） This product specification specifies the characteristics and test methods of USB 3.1 series "C type" connectors 本产品规格书规定了 USB 3.1 系列“C 型”连接器产品的特性及测试方法. 2. REFERENCE DOCUMENTS（参考文件） MIL-STD-1344A Test method for electrical connector （电子连接器测试方法） MIL-STD-202F Test method for electrical components （电子零件测试方法） EIA364 Test method for electrical components （电子零件测试方法） JIS C 0051 Test method for electrical components （电子零件测试方法） MIL-G-45204C Specification for gold plating （镀金规格） IEC-512-3 IEC standard for current carrying capacity tests（IEC电流测试标准） QQ-N-290A Specification for nickel plating （镀镍规格） MIL-P-81728A Specification for tin/lead plating （镀锡铅规格） MIL-T-10727B Specification for tin plating （镀锡规格） UL498 UL standard for safety of attachment plug and receptacle（UL安规要求标准） EN/ISO5961 Determination of total lead & cadmium content ( 总铅和总镉含量测定) EN1122 Determination of total lead & cadmium content ( 总铅和总镉含量测定) EN13346 Determination of heavy metals content ( 重金属含量测定) EPA3052 Determination of total lead & cadmium content ( 总铅和总镉含量测定) 3. FEATURE & DIMENSIONS （特征及尺寸） 3.1. PRODUCT DIMENSION （产品尺寸） These connectors shall have the dimensions as shown in customer drawing。 本产品的相关尺寸参见客户图面。 3.2. PCB/PANEL LAYOUT （印刷电路板布局） The recommended PCB layout is shown in customer drawing。 本产品适用的PCB layout参见客户图面。 3.3. MATERIAL（材料） The harmful material can follow the requirement of RoHS. 本产品使用的材料符合 RoHS 指令要求。 3.4. MECHANICAL & ELECTRICAL CHARACTERISTIC （机械及电气特性） The connector shall have the mechanical and electrical performance as described in table I： 本产品的机械及电气特性见附表I。 3.5. PACKAGING （包装） This product adopts tray or REEL package 本产品采用tray 盘或REEL包装， 3/10 产品规格书 东莞市皓富电子科技有限公司 产品规格书 制訂日期：17/06/10 文件編號： 3.6.TRANSPORTATION （运输） Any vehicle can be adopted for the transportation, but moisture-proof and no mechanical damage. 可采用任何运输工具运输，勿淋湿及机械性损伤。 3.7.STORAGE （存贮） Temperature: -25℃~+85℃，Relative humidity: ≤80%，Not to storage in corrosive environments A requalification test shall be conducted immediately while the storage duration exceed 6 months. 温度：-25℃~+85℃；相对湿度：≤80%；勿贮存于腐蚀环境内。贮存期超过6个月后需重新进行品质确 认。 4. ENVIRONMENTAL（环境要求） 4.1. SOLDERABILITY（可焊性） Connector’s solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants. 产品可焊性符合 MIL-STD-202F 标准规定的相关要求，表面不得有污染物. 4.2. RESISTANCE TO SOLDER HEAT （耐焊接热） 4.2.1. Wave Soldering （波峰焊） Consists of three consecutive phases. 包括三个连续的阶段完成； 4.2.1.1. Preheat（预热） Increase in temperature not to exceed 4℃per second. Final preheat temperature will be within 125 ℃of solder temperature. 温度增加不超过4℃ /秒，最终预热温度不超过125℃. 4.2.1.2. Soldering（焊接） Device leads will be exposed to solder wave at 250℃for a maximum of 5 seconds. 设备中的引导 焊接温度最高250℃不超过5秒. 4.2.1.3. Cool Down（冷却） Cool down in ambient air at approximately 20℃to 25℃. 冷却到周围环境温度20℃~ 25℃. 4.2.2. INFRARED REFLOW （红外线回流焊） Three cycles. Each cycle consisting of three consecutive phased. 三个周期，每个周期包括三个连 续的阶段完成； 4.2.2.1. Preheat（预热） Increase in temperature not to exceed 4℃ per second. 温度增加不超过4℃ /秒， 4.2.2.2. Soldering（焊接） Maximum allowable time above reflow temperature of 183 ℃ is 90 seconds. Maximum temperature in this interval is 250℃, not to exceed 10 seconds. 回流焊温度183℃以上的时最长不 超过 90秒. 最高温度250℃时间不超过10秒. 4.2.2.3. Cool Down（冷却） Cool down shall not exceed 6℃ per second. 冷却速度不超过6℃/秒. Note:（注）Device temperature measurements are referenced from the top-center of the package outer surface. 设备 温度量测时以从顶部中间位置测量为准； 4.3. CLEANING （清洗） Connectors resist to cleaning process. Aqueous Cleaning: Three cycles; each cycle consisting of a 4/10 产品规格书 东莞市皓富电子科技有限公司 产品规格书 制訂日期：17/06/10 文件編號： maximum of one minute exposure to 54℃ to 66℃ dematerialized tap water at a maximum pressure of 30 psi; followed by air drying for 60℃to 90 seconds at 93℃ to 121℃. 产品本身可以承受清洗制程。 水洗：包含三个循环，每个循环包括以下：以最大压力30帕，温度 54℃~ 66℃，去除矿物质的水，用水龙头冲洗最多一分钟，然后用温度 93℃~121℃的空气吹60到90秒； 5. PERFORMANCE AND TEST DESCRIPTION （性能及测试） 5.1. REQUIREMENT（要求） Product is designed to meet electrical, mechanical, and environmental performance requirements specified in Table I. 本产品设计符合附表一所列的机械，电气及环境要求. 5.2. TEST CONDITION （测试条件） Unless otherwise specified, all tests shall be performed at ambient environmental conditions. 除非特别 注明，所有测试在室温条件下完成； 5.3. SAMPLE SELECTION （样品选择） Test samples shall be selected at random from current production. No test samples shall be reused. Samples are pre-conditioned with 10cycles of durability. Each group shall be containing 5 test samples. 测试样品从现生产的产品中随机抽取，所有测试过的样品不得重复使用. 样品已预先插拔10次，每组测试 有5个样品； 6. QUALITY ASSURANCE PROVISIONS （品质保证） The company is responsible for the quality of all products sent to customers, and the defective batches are returned or corrected by the supplier 本公司对于出给客户的所有产品品质负责，不良批次的产品退回或由供应商做矫正； 5/10 产品规格书 东莞市皓富电子科技有限公司 制訂日期：17/06/10 产品规格书 TABLE I: Items 1 Confirmation of Product 产品确认 文件編號： PERFORMANCE REQUIREMENTS Requirements Test Methods Product shall be conforming to the Visually dimensions and functionally requirements of applicable product inspected per applicable product drawing drawing. 产品必须满足相关文件的规定 目视尺寸及功能依照客户图面检查 Electrical Requirement Items 2 Requirements Test Methods Low level Contact 1. 40 mΩ (Max) initial for VBUS, The low level contact resistance resistance 低电平接触阻抗 GND and all other contacts. measurement is made from the solder 2. Maximum change (delta) of +10 tail of the receptacle to the soldering mΩ after environmental stresses. 1.电源 PIN、接地 PIN 及其它 PIN point of the plug. 脚接触阻抗均为 40mΩ 最大。 circuit at 100mA. Mated test contacts 2.产品阻抗变化值不超过 10mΩ。 must be in a connector housing. when measured at 20mV Max. open Test reference standard：EIA-364-23B 接触阻抗测量方式从母头的焊脚处 至公头的焊脚处。 在开路最大电流为 100mA 电压为 20mV 情况下测试胶芯插入时端子 之间接触处的阻抗值。 测试参考标准：EIA 364-23B 3 Insulation Resistance 100 MΩ Min. Test between adjacent circuits 绝缘阻抗 100 MΩ 最小 Insulation Resistance of unmated and mated connectors. Test reference standard：EIA 364-21. 测试对插的连接器两个相邻端子之 间的绝缘阻抗值。 测试参考标准：EIA 364-21 4 Dielectric Strength No breakdown shall occur. when 100 Volts AC (RMS) is applied 耐电压 产品不能出现衰竭、损坏现象。 between adjacent contacts of unmated and mated connectors. Test reference standard：EIA-364-20. 使用 100V 交流电压测试公母头插 入与拔出时相邻端子之间的承受电 压情况。 测试参考标准：EIA 364-20 6/10 产品规格书 东莞市皓富电子科技有限公司 制訂日期：17/06/10 产品规格书 5 Contact current rating 温升 1.A current of 3.0 A shall be applied collectively to VBUS pins (pins A4, A9, B4, and B9) 2.1.25 A applied to the VCONN pin (B5 of the plug connector) with the return path through the corresponding GND pins (pins A1, A12, B1, and B12). 3. A minimum current of 0.25 A shall also be applied individually to all the other contacts. 1.VBUS pins 需 通 过 电 流 5.0A(pin A4, A9, B4, and B9 )。 2. VCONN pin(公头B5 pin)及GND pins需通过电流1.25A(pins A1, A12, B1, and B12)。 3.其余pins需通过最小电流0.25A。 文件編號： When the currents are applied to the contacts, the temperature rise shall not exceed 30 °C at any point on the USB Type-C mated plug and receptacle under test, when measured at an ambient temperature of 25 °C. Test reference standard： EIA -364-70 method B 在 相 对 温 度 为 25 ℃ ， 当 电 流 通 过 USB C type公母头连接器时，测试 连接器中端子任一点温度不超过 +30℃。 测试参考标准：EIA 364-70 方法B Mechanical Requirement Items 6 7 8 Insertion Force 插入力 Extraction Force 拔出力 Durability or Insertion/extraction Cycles 耐久或插入拔出次数 Requirements Test Methods Measure the force required to mate connector, At a maximum rate of The initial connector insertion force shall be within the range from 5 N to 20 N。 连接器初始插入力需在 5N~20N 范围内。 12.5mm(0.492'') per minute. The initial connector Extraction force shall be within the range from 8 N to 20 N。 连接器初始拔出力需在 8N~20N 范围内。 12.5mm(0.492'') per minute. The durability rating shall be 10,000 cycles minimum. 耐久测试最小 10000 次。 7/10 Test reference standard：EIA-364-13 测试的力必须是相匹配的连接器， 插入速度不超过每分钟 12.5mm。 测试参考标准：EIA 364-13 Measure the force required to mate connector, At a maximum rate of Test reference standard：EIA-364-13 测试的力必须是相匹配的连接器， 拔出速度不超过每分钟 12.5mm。 测试参考标准：EIA 364-13 The durability test shall be done at a maximum rate of 200 cycles per Hour and no physical damage to any part of the connector and cable assembly shall occur. Test reference standard:EIA-364-09 耐久测试速度不超过每小时 200 个 循环，且测试后的产品及线材本身 任何部位不能出现损坏。 测试参考标准：EIA 364-09 产品规格书 东莞市皓富电子科技有限公司 制訂日期：17/06/10 产品规格书 9 Physical Shock No breakdown shall occur. 物理冲击 产品不能出现损坏现象。 文件編號： No discontinuities of 1μs or Longer duration. when mated USB C type connectors are subjected to 11ms duration 30Gs half-sine shock pluses. Three shocks in each direction applied along three mutually perpendicular planes for a total of 18 shocks. Test reference standard： EIA 364-27 Test Condition H. 匹配USB C TYPE 连接器，中断不 得大于或等于1μs，30Gs的半波脉 冲承受11ms，从三个正交的方向施 加冲击，总冲击次数为18次。 Environmental Requirements Items 10 Humidity 恒温恒湿 Requirements Shall meet visual requirements, show no physical damage. Contact Resistance (Low Level) 40 mΩ max. Dielectric Strength should be OK, Insulation Resistance should be 100 MΩ min. 产品外观良好，无损坏。接触阻抗： 40 mΩ最大；耐电压测试OK, 绝缘阻 抗100MΩ最小。 11 Thermal shock 冷热冲击 Shall meet visual requirements, show no physical damage. Contact Resistance (Low Level) 40 mΩ max. Dielectric Strength should be OK, Insulation Resistance should be 100 MΩ min. Test Methods Temperature: 25~65℃, Relative humidity: 90-95%, Duration: 96Hours, Circulate test: 10 Cycles. Test reference standard: EIA 364-31 温度：25~65℃,相对湿度：9095% ,持续时间：96 小时,循环测 试：10次 测试参考标准：EIA 364-31。 40 mΩ最大；耐电压测试OK, 绝缘阻 Temperature range from -55°C to +85°C .Start from -55°C. After 30 min. change to +85°C, change time is no more than 30 seconds. Total 5 cycles. Test reference standard: EIA 364-32 温度变化范围：-55°C ~ +85°C，从55°C开始，30分钟后换到+85°C；转换 抗100MΩ最小。 时间不超过30秒；共5 个循环。 产品外观良好，无损坏。接触阻抗： 测试参考标准：EIA 364-32 12 Hot air reflow or IR reflow for SMT curing process SMT 热风回流焊 More than 95% of the dipped surface shall be wet with solder 超过95%的焊接面积浸到锡。 8/10 Place subjected connector on the PCB Board and expose them to the reflow oven and apply the following condition： Room 1: preheat temperature 150℃ 170℃ for 100 seconds. Room 2: preheat temperature 170℃– 200℃ for 100 seconds. Room 3: reflow temperature 200℃ 产品规格书 东莞市皓富电子科技有限公司 产品规格书 制訂日期：17/06/10 文件編號： 260℃ for 120-60 seconds. (For 260℃ ONLY 5-10 seconds) 将产品放在PCB板上,然后放入回焊 炉中并用于以下条件： 时间段1：预热温度150℃-170℃ 100秒。 时间段2：预热温度170℃ - 200℃ 100秒。 时间段3：回焊炉温度200℃ - 260 ℃ 100秒。(260℃ 时间仅5~10S) 13 Solderability 可焊性 14 Salt Spray 盐雾测试 The inspected area of each lead must have 95% solder coverage Minimum. 检测焊接端的锡覆盖率需大于95% Solder pot temperature: 250±5℃ Soldering time: 3 to 5 Seconds Test reference standard: EIA 364-52 锡炉温度：250±5°C，焊接时间： 3~5 秒 测试参考标准：EIA 364-52。 Shall meet visual requirements, No detrimental corrosion allowed in contact area and base metal exposed. 产品外观良好，端子及外壳金属无 生锈、腐蚀及露底材不良。 Subject mated connectors to 35+/-2 ℃ and 5+/-1% salt condition for 24 hours. After test, rinse the sample with water and recondition the room temperature for 1 hour. Test reference standard:EIA-364-26B. 测试的连接器需放于温度35± 2°C，盐水浓度(重量比)5±1%的容 器中测试24小时。测试后的产品使 用清水冲洗后放入常温下1小时。 测试参考标准：EIA 364-26。 9/10 产品规格书 东莞市皓富电子科技有限公司 制訂日期：17/06/10 产品规格书 文件編號： TABLE II: REFLOW SOLDERING PROFILE Pb-free reflow profile requirements: Parameter Reference Average temperature gradient in Specification 2.5°C/s preheating Soak time T soak 2-3 minutes Time above 217°C t1 60 s Time above 230°C t2 50 s Time above 250°C t3 5s T peak 260°C (+/-5°C) Peak temperature in reflow Temperature gradient in cooling Max -5°C/s This profile is the minimum requirement for evaluating soldering heat resistance of components. Heat transfer method used for reflow soldering is hot air convection. The actual air temperatures used to achieve the specified profile is higher and largely dependent on the reflow equipment. 10/10 产品规格书 ＤＯＮＧＧＵＡＮ　ＨＡＯＦＵ　ＥＬＥＣＴＲＩＯＮＣＳ　ＴＥＣＨＮＯＬＯＧＹ　ＣＯ．，ＬＴＤ 产品可靠实验计划排程表 产品品名 Part name USB TYPE C 16PIN FEMALE CONN 产品规格书编号 Specification / 计划表编号 Schedule No. 201904001 制定日期 Date 2019/4/1 / 规格书版次 Rev: A0 计划书版次 Rev: A0 试验人 Tester 刘小燕 产品料号 Part No. 序号 项次 1 Group A 2 Group B 实验项目 进度（4月份） 追踪 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 实验 结果 报告编号 OK 20190418001 OK 20190403004 OK 20190418012 OK 20190418013 OK 20190411003 ECD 外观→焊接性→接触阻抗→寿命→振动 →机械冲击→接触阻抗→外观 ACD 外观→沾锡测试→ 盐雾测试→外观 ECD ACD ECD 3 Group C 外观→焊接性→耐扭测试→外观 ACD ECD 4 Group D 外观→焊接性→温升测试→外观 ACD 外观→焊接性→绝缘阻抗耐压测试→冷 ECD 5 Group E 热冲击→温湿度循环→绝缘阻抗→耐压 测试→外观 ACD ECD 6 Group F 外观→焊接性→接触阻抗温度寿命→接 触阻抗→外观 ACD OK 20190411004 7 Group G 外观→焊接性→接触阻抗混合气体测试 ECD →接触阻抗→外观 ACD OK 20190415006 备注： ECD为预计完成时间 Andy 核准： APPROVED: ACD 为实际完成时间 审查： CHECKE: Mark 制定： Liu XiaoYan OPERATOR: 备注 ＤＯＮＧＧＵＡＮ　ＨＡＯＦＵ　ＥＬＥＣＴＲＩＯＮＣＳ　ＴＥＣＨＮＯＬＯＧＹ　ＣＯ．，ＬＴＤ 　Ｇｒｏｕｐ　Ａ　ＴＥＳＥ　ＲＥＰＯＲＴ Report No.20190418001 ********************************************************************************************************************************************************** QC Department Applicant: Visual inspection→Weldability→CR →Insertion&withdraw → Durability→Insertion&withdraw → Mechanical shock→Random Vibration→CR→Visual inspection Test item: USB TYPE C 16PIN FEMALE CONNECTOR Product: Part No.: 5PCS Quantity: 2019/4/1 Sample Received: 2019-04-01 to 2019-04-17 Testing Period: Temperature.22+-2℃, R.H.58+-3% Measuring Environment: According to general USB TYPE C16PIN'S product specifications. Testing conditions: 1.The Connector of The Male And Female to Flug. 2.CR:Contact:U=20mV;I=100mA Initial=40mΩ max 3.Insertion force& Withdrawal force :Mate and un-mate connectors at a rate of 25.4mm/min. recorder after mate and un-mate 3 times.Mate and un-mate connectors at a rate of 12.5mm/min.The initial connector extraction force Shall be within the range of 8Nto20N Measured after a preconditioning of Five insertion extraction cycles,afterAn additional twenty-five insertion /Extraction cycles, Insertion force:5N~20N,Withdrawal Force :8N~20N. 4.Durability:Mate and un-mating up to 10000 cycles repeatedly at cycle rate of 500±50 cycles per hour by machine.After durability test: No physical damage Insertion force: 5N~20N Withdrawal force:6N~20N 5.Mechanical shock:Comply with method EIA 364-27 Subjected to 6ms duration 30Gshalf-sine shock pulses 6 axes.Appearance: no damage Discontinuity 1.0 microsecond Max 6.Random Vibration:Comply with method EIA 364-28 test condition V test letter A subjected mated connectors to 5.35GRMS. 15 minutes in each of three mutually perpendicular planes.Appearance: no damage 6 axes .Appearance: no damage Discontinuity 1.0 microsecond Max Discontinuity 1.0 microsecond Max Sample No.:1,2,3,4,5. Testing Equipment: Name Mated&unmated force tester Micro-Ohmmeter Model 1220s TH2512B Testing Results: 1.Visual inspection Sample No.: Specifition 1 2 3 4 5 Judgement Test Beore No Damage OK OK OK OK OK OK Test After No Damage OK OK OK OK OK OK 2.Low Level Contact Resistance Test （Durability+Mechanical shock+Random VibrationTest Before&Test After）Data: (unit:mΩ) Sample No. Specifition PIN No.: Max. 40mΩ max pin1-pin8 Test pin9-pin16 Before 18.04 19.34 17.82 18.75 18.94 19.34 17.46 18.56 18.75 20.12 19.19 20.33 20.64 17.14 18.14 19.16 pin1-pin8 17.45 19.33 18.93 18.21 19.49 16.64 18.74 18.59 pin9-pin16 18.54 19.47 17.57 19.64 20.41 19.85 17.87 19.87 40mΩ max pin1-pin8 Test pin9-pin16 Before 18.75 19.49 16.64 18.74 18.93 18.21 19.49 17.57 18.14 19.19 20.33 20.12 19.19 20.33 19.87 20.14 pin1-pin8 18.74 18.93 18.21 19.33 18.93 18.21 18.98 19.68 pin9-pin16 20.12 19.19 20.33 19.47 17.57 19.64 17.67 17.84 40mΩ max pin1-pin8 Test pin9-pin16 Before 19.33 18.93 18.21 18.21 19.49 16.64 18.74 18.59 18.54 19.47 17.57 19.64 20.41 19.85 17.87 19.87 pin1-pin8 18.21 19.49 16.64 18.74 18.75 20.12 19.19 19.19 pin9-pin16 20.41 20.64 17.14 18.14 19.19 20.33 20.64 18.93 40mΩ max pin1-pin8 Test pin9-pin16 Before 18.75 19.49 16.64 18.74 18.93 18.21 19.49 17.57 19.58 20.41 19.85 20.12 19.19 20.33 19.87 20.14 pin1-pin8 19.19 20.33 20.64 19.33 18.93 18.21 18.98 19.68 pin9-pin16 18.93 18.21 19.49 19.47 17.57 19.64 17.67 17.84 40mΩ max pin1-pin8 Test pin9-pin16 Before 18.75 19.49 16.64 18.74 18.93 18.21 19.49 17.57 19.58 20.41 19.85 17.87 19.19 20.33 19.87 20.14 pin1-pin8 19.19 18.93 18.21 19.49 18.93 18.21 18.98 19.68 pin9-pin16 18.93 18.21 19.49 19.47 17.57 19.64 17.67 17.84 Min. Avg Judgement 20.64 17.14 18.86 OK 20.41 16.64 18.79 OK 20.33 16.64 19.07 OK 20.33 17.57 18.93 OK 20.41 16.64 18.84 OK 20.64 16.64 19.11 OK 20.41 16.64 19.21 OK 20.64 17.57 19.01 OK 20.41 16.64 19.07 OK 19.68 17.57 18.78 OK 1 40mΩ max Test After 2 40mΩ max Test After 3 40mΩ max Test After 4 40mΩ max Test After 5 40mΩ max Test After 3.Insertion and Withdrawal force:(Unit:N) Sample No.: Specifition 1 2 3 4 5 Test Before Insertion force:5N~20N 9.25 9.87 11.41 10.15 9.87 Judgement OK Test After Insertion force:5N~20N 9.37 9.97 10.40 8.45 11.42 OK TestBefore 6times Withdrawal Force:8N~20N. 12.01 13.72 14.94 14.54 12.01 OK TestBefore 32times Withdrawal Force:8N~20N. 12.67 14.61 14.92 14.85 13.66 OK Test After Withdrawal Force:6N~20N. 12.04 12.31 11.88 8.04 12.78 OK 4. Electrical discontinuity greater then 1 μsec（Mechanical shock+Random VibrationTest After） Specifition Sample No.: Electrical disc ontinuity