RS621PXF

RS621P, RS622P, RS624P 7MHz,500uV Offset, Rail-to-Rail I/O CMOS Operational Amplifier FEATURES DESCRIPTION  HIGH GAIN BANDWIDTH:7MHz  RAIL-TO-RAIL INPUT AND OUTPUT ±0.5mV Max Vos INPUT VOLTAGE RANGE: -0.1V to +5.6V with Vs = 5.5V   SUPPLY RANGE: +2.5V to +5.5V   SHUTDOWN: RS621S/RS622S SPECIFIED UP TO +125°C  MicroSIZE The RS62XP families of products offer low voltage operation and rail-to-rail input and output, as well as excellent speed/power consumption ratio, providing an excellent bandwidth (7MHz) and slew rate of 3.7V/us. The op-amps are unity gain stable and feature an ultra-low input bias current. The RS621P, RS622P and RS624P has lower offset, which is guaranteed not upper than ±0.5mV at 25°C with Vs = 5V, Vcm = Vs/2. The devices are ideal for sensor interfaces, active filters and portable applications. The RS62X families of operational amplifiers are specified at the full temperature range of −40°C to +125°C under single or dual power supplies of 2.5V to 5.5V. PACKAGES: SOT23-5 APPLICATIONS  SENSORS  PHOTODIODE AMPLIFICATION   ACTIVE FILTERS TEST EQUIPMENT  DRIVING A/D CONVERTERS PIN CONFIGURATIONS 5 1 V+ + IN RS621P 5 1 V+ + V+IN 2 + 3 V- - 4 -IN - IN SOT23-5 2 - 3 4 OUT NC 1 -IN 2 +IN 3 V- 4 8 NC 7 V+ + OUT RS621BP - RS621P 6 OUT 5 NC SOT23-5 SOIC-8,MSOP-8 RS624P RS622P OUT A -IN A +IN A V- 8 1 7 2 3 4 + A 6 B+ 5 OUT A 1 -IN A 2 14 OUT D 13 +IN A -IN D 3 12 +IN D V+ 4 11 V- +IN B 5 10 +IN C -IN B 6 9 -IN C OUT B 7 8 OUT C V+ OUTB A - + D + - -IN B +IN B SOIC-8,MSOP-8,TDFN-8,TSSOP-8 Note: NC indicates no internal connection - + B + C SOIC-14,TSSOP-14 REV B.4 1 www.run-ic.com RS621P, RS622P, RS624P ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage, V+ to V-...............................................7.0V (2) Input Terminals, Voltage …………... – 0.5 to (V+) + 0.5V (2) Current …………………....…..... ±10mA Storage Temperature ……….…………… −65°C to +150°C Operating Temperature ……….………… −40°C to +125°C Junction Temperature................................................150°C Package Thermal Resistance @ TA = +25°C SOT23-5, SOT23-6………………….………………200°C/W MSOP-8, SOIC-8 , TSSOP-8..……….………….... 150°C/W SOIC-14, TSSOP-14………….……….……………100°C/W Lead Temperature (Soldering, 10s) ……………........260°C ESD Susceptibility HBM …......................................................................5000V MM ……………………….........………………...……….400V ESD SENSITIVITY CAUTION ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. PACKAGE/ORDERING INFORMATION PRODUCT RS621P RS622P RS624P TEMPERATURE PACKAGE PACKAGE RANGE LEAD MARKING RS621PXK -40℃~125℃ SOIC-8 RS621 Tape and Reel,2500 RS621PXF -40℃~125℃ SOT23-5 621 Tape and Reel,3000 RS621BPXF -40℃~125℃ SOT23-5 621B Tape and Reel,3000 RS621PXM -40℃~125℃ MSOP-8 RS621 Tape and Reel,3000 RS622PXK -40℃~125℃ SOIC-8 RS622 Tape and Reel,2500 RS622PXM -40℃~125℃ MSOP-8 RS622 Tape and Reel,3000 RS622PXT -40℃~125℃ TDFN-8 RS622 Tape and Reel,3000 RS622PXQ -40℃~125℃ TSSOP-8 RS622 Tape and Reel,3000 RS624PXP -40℃~125℃ SOIC -14 RS624 Tape and Reel,2500 RS624PXQ -40℃~125℃ TSSOP-14 RS624 Tape and Reel,3000 ORDERING NUMBER 2 PACKAGE OPTION www.run-ic.com RS621P, RS622P, RS624P ELECTRICAL CHARACTERISTICS (At TA = +25C, Vs=5V, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted.) PARAMETER CONDITIONS TJ RS621P, RS622P,RS624P MIN TYP MAX UNIT 5.5 V 600 800 uA POWER SUPPLY Vs IQ 25°C Operating Voltage Range Quiescent Current/Amplifier PSRR Power-Supply Rejection Ratio 2.5 25°C 25°C Vs= 2.5V to 5.5V Vcm =(V-)+0.5V –40°C to 125°C 78 93 dB 72 INPUT Vos Input Offset Voltage Vos TC Input Offset Voltage Drift IB Input Bias Current Ios Input Offset Current Vcm Common-Mode Voltage Range CMRR Common-Mode Rejection Ratio 25°C Vcm=Vs/2 ±0.1 ±0.5 2 -40°C to 125°C uV/°C 25°C 1 10 pA 25°C 1 10 pA 5.6 V Vs=5.5V 25°C -0.1 Vs = 5.5V, Vcm =-0.1V to 4V 25°C 74 –40°C to 125°C 68 25°C 63 –40°C to 125°C 60 25°C 96 –40°C to 125°C 83 25°C RL = 10kΩ, Vo = 0.05V to 4.95V –40°C to 125°C 98 Vs = 5.5V, Vcm = -0.1V to 5.6V mV 92 83 dB OUTPUT AOL Open-Loop Voltage Gain RL = 2KΩ RL = 10kΩ 102 106 dB 85 25°C 25°C 40 7 mV 25°C 50 mA Slew Rate Gain-Bandwidth Product 25°C 3.7 V/us 25°C 7 MHz Phase Margin 25°C 64 ° 0.5 us 0.5 us Output Swing From Rail Iout RL =2KΩ, Vo = 0.15V to 4.85V Output Short-Circuit Current FREQUENCY RESPONSE SR GBP Φm ts Settling Time, 0.1% Overload Recovery Time VIN • Gain ≥ Vs NOISE en Input-Referred Voltage Noise f = 1 kHz 25°C 11 nV/√Hz f = 10 kHz 25°C 7.5 nV/√Hz 3 www.run-ic.com RS621P, RS622P, RS624P TYPICAL CHARACTERISTICS At TA = +25C, Vs=5V, RL = 10kΩconnected to VS/2, VOUT = VS/2, unless otherwise noted. COMMON−MODE REJECTION RATIO vs FREQUENCY OPEN−LOOP GAIN AND PHASE vs FREQUENCY Phase 100 120 80 100 60 80 40 60 20 40 0 20 -20 10 1K 100K 120 140 100 CMRR(dB) 120 Open-Loop Gain(dB) 160 Gain Phase Margin (°) 140 80 60 40 0 10M 20 1 10 Frequency(Hz) INPUT VOLTAGE NOISE SPECTRAL DENSITY vs FREQUENCY Voltage Noise (nV/√Hz) 1000 10K 100 PSRR(dB) 100 10 80 60 40 20 1 10 100 1K 10K 1 100K 10 100 1K 10K Frequency(KHz) Vs=5V Frequency(Hz) QUIESCENT CURRENT vs TEMPERATURE QUIESCENT CURRENT vs TEMPERATURE 0.8 0.8 Quiescent Current(mA) Quiescent Current(mA) 1K POWER−SUPPLY REJECTION RATIO vs FREQUENCY 120 | | 100 Frequency(KHz) Vs=5V 0.7 0.6 0.5 0.7 0.6 0.5 0.4 0.4 -40 -20 0 -40 -20 20 40 60 80 100 120 140 0 20 40 60 80 100 120 140 Temperature(℃) Vs=5V Temperature(℃) Vs=2.7V 4 www.run-ic.com RS621P, RS622P, RS624P TYPICAL CHARACTERISTICS At TA = +25C, Vs=5V, RL = 10kΩconnected to VS/2, VOUT = VS/2, unless otherwise noted. SOURCE CURRENT vs TEMPERATURE 60 58 56 54 52 50 48 46 44 42 40 Source Current(mA) Sink Current(mA) SINK CURRENT vs TEMPERATURE -40 -20 0 70 68 66 64 62 60 58 56 54 52 50 48 46 44 42 40 20 40 60 80 100 120 140 -40 -20 0 Temperature(℃) INPUT BIAS CURRENT vs TEMPERATURE 20 40 60 80 100 120 140 Temperature(℃) SMALL−SIGNAL STEP RESPONSE 10K 50mV/div 100 10 1 0.1 -40 -20 0 20 40 60 200ns/div 80 100 120 140 Temperature(℃) POSITIVE OVERLOAD RECOVERY CL=100PF 200mV/div LARGE−SIGNAL STEP RESPONSE 0V VIN 1V/div VOUT 0V 400ns/div VS=±2.5V G=-100 1V/div Input Bias Current(pA) CL=100PF 1K 500ns/div 5 www.run-ic.com RS621P, RS622P, RS624P TYPICAL CHARACTERISTICS At TA = +25C, Vs=5V, RL = 10kΩconnected to VS/2, VOUT = VS/2, unless otherwise noted. 200mV/div NEGATIVE OVERLOAD RECOVERY VIN 0V 1V/div 0V VS=±2.5V G=-100 VOUT 500ns/div 6 www.run-ic.com RS621P, RS622P, RS624P APPLICATION NOTES The RS621P, RS622P, RS624P are high precision, rail-to-rail operational amplifiers that can be run from a single-supply voltage 2.5V to 5.5V (±1.25V to ±2.75V). Supply voltages higher than 7V (absolute maximum) can permanently damage the amplifier. V1 RS624P RS624P Rail-to-rail input and output swing significantly increases dynamic range, especially in low-supply applications. VOUT RS624P V2 Good layout practice mandates use of a 0.1uF capacitor place closely across the supply pins. Figure2. Amplifier instrumentation amplifier LAYOUT GUIDELINS Attention to good layout practices is always recommended. Keep traces short. When possible, use a PCB ground plane with surface-mount components placed as close to the device pins as possible. Place a 0.1uF capacitor closely across the supply pins. These guidelines should be applied throughout the analog circuit to improve performance and provide benefits such as reducing the EMI susceptibility. +Vs 10uF 0.1uF Vin Vip Vout RS621P 10uF 0.1uF -Vs Figure1. Amplifier with Bypass Capacitors INSTRUMENTATION AMPLIFIER In the three-op amp, instrumentation amplifier configuration shown in Figure2, 7 www.run-ic.com RS621P, RS622P, RS624P PACKAGE OUTLINE DIMENSIONS SOT23-5 D 1.90 b 2.59 E1 E 0.99 0.69 0.95 e e1 RECOMMENDED LAND PATTERN (Unit: mm) 0.2 A A2 L A1 Symbol c θ Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e 0.950(BSC) 0.037(BSC) e1 1.800 2.000 0.071 0.079 L 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° 8 www.run-ic.com RS621P, RS622P, RS624P MSOP-8 b e E E1 4.8 1.02 D 0.65 0.41 RECOMMENDED LAND PATTERN (Unit: mm) A2 c A A1 L Symbol Dimensions In Millimeters θ Dimensions In Inches Min Max Min Max A 0.820 1.100 0.032 0.043 A1 0.020 0.150 0.001 0.006 A2 0.750 0.950 0.030 0.037 b 0.250 0.380 0.010 0.015 c 0.090 0.230 0.004 0.009 D 2.900 3.100 0.114 0.122 e 0.650(BSC) 0.026(BSC) E 2.900 3.100 0.114 0.122 E1 4.750 5.050 0.187 0.199 L 0.400 0.800 0.016 0.031 θ 0° 6° 0° 6° 9 www.run-ic.com RS621P, RS622P, RS624P TSSOP-8 e b 5.6 E1 E 1.78 D 0.65 0.42 RECOMMENDED LAND PATTERN (Unit: mm) A2 A1 Symbol H C A θ L Dimensions In Millimeters Min Max A Dimensions In Inches Min Max 1.200 0.047 A1 0.050 0.150 0.002 0.006 A2 0.800 1.050 0.031 0.041 b 0.190 0.300 0.007 0.012 c 0.090 0.200 0.004 0.008 D 2.900 3.100 0.114 0.122 E 4.300 4.500 0.169 0.177 E1 6.250 6.550 0.246 0.258 e L 0.650(BSC) 0.500 H θ 0.026(BSC) 0.700 0.020 0.25(TYP) 1° 0.028 0.01(TYP) 7° 10 1° 7° www.run-ic.com RS621P, RS622P, RS624P TSSOP-14 e b 5.6 E1 E 1.78 D 0.65 0.42 RECOMMENDED LAND PATTERN (Unit: mm) A2 A1 Symbol H C A θ L Dimensions In Millimeters Min Max A Dimensions In Inches Min Max 1.200 0.047 A1 0.050 0.150 0.002 0.006 A2 0.800 1.050 0.031 0.041 b 0.190 0.300 0.007 0.012 c 0.090 0.200 0.004 0.008 D 4.860 5.100 0.191 0.201 E 4.300 4.500 0.169 0.177 E1 6.250 6.550 0.246 0.258 e L 0.650(BSC) 0.500 H θ 0.026(BSC) 0.700 0.020 0.25(TYP) 1° 0.028 0.01(TYP) 7° 11 1° 7° www.run-ic.com RS621P, RS622P, RS624P SOIC-8 b e 5.2 E E1 2.2 D 1.27 0.6 RECOMMENDED LAND PATTERN (Unit: mm) A2 c A A1 L Symbol Dimensions In Millimeters θ Dimensions In Inches Min Max Min Max A 1.350 1.750 0.053 0.069 A1 0.100 0.250 0.004 0.010 A2 1.350 1.550 0.053 0.061 b 0.330 0.510 0.013 0.020 c 0.170 0.250 0.007 0.010 D 4.800 5.000 0.189 0.197 e 1.270(BSC) 0.050(BSC) E 5.800 6.200 0.228 0.244 E1 3.800 4.000 0.150 0.157 L 0.400 1.270 0.016 0.050 θ 0° 8° 0° 8° 12 www.run-ic.com RS621P, RS622P, RS624P SOIC-14 e b 5.2 1.27 E E1 0.6 D 1.27 RECOMMENDED LAND PATTERN (Unit: mm) A2 A1 c A θ L Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 1.350 1.750 0.053 0.069 A1 0.100 0.250 0.004 0.010 A2 1.350 1.550 0.053 0.061 b 0.310 0.510 0.012 0.020 c 0.100 0.250 0.004 0.010 D 8.450 8.850 0.333 0.348 e 1.270(BSC) 0.050(BSC) E 5.800 6.200 0.228 0.244 E1 3.800 4.000 0.150 0.157 L 0.400 1.270 0.016 0.050 θ 0° 8° 0° 8° 13 www.run-ic.com RS621P, RS622P, RS624P TDFN-3x3-8L E b D E1 L e D1 BOTTOM VIEW A1 A2 A TOP VIEW SIDE VIEW Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A2 0.203 0.008 b 0.300 0.400 0.012 0.016 D 2.900 3.100 0.114 0.122 D1 2.510 2.610 0.099 0.103 E 2.900 3.100 0.114 0.122 E1 1.550 1.650 0.061 0.065 e L 0.650 TYP 0.350 0.026 TYP 0.450 14 0.014 0.018 www.run-ic.com