SM5S26A

SM5S Series Surface Mount Transient Voltage Suppressors Working Voltage: 10 to 43 V Peak Pulse Power: 3600 W Features ● ● Optimized glass passivated chip TJ = 175 °C capability suitable for high reliability and automotive requirement ● 3600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle):0.01 % ● Meet ISO 7637-2 5a/5b and ISO 16750 load dump test (varied by test condition) AEC-Q101 qualified Low leakage current Low forward voltage drop Uni-directional polarity Excellent clamping capability Very fast response time RoHS compliant ● ● ● ● ● ● ● DO-218AB Mechanical Data ● ● ● Case: DO-218AB Molding compound: UL94V-0 flammability Polarity: Heatsink is anode Maximum Ratings(TA=25℃ unless otherwise noted) Parameter (1) Peak power dissipation with a 10/1000μs waveform Peak power dissipation with a 10/10,000μs waveform Symbol PPP Value 3600 Unit W PPP 2800 W Peak pulse current with a 10/1000μs waveform Power dissipation on infinite heatsink at TL = 25 °C IPP See Next Table A PD 5.0 W Peak forward surge current 8.3 ms single half sine-wave IFSM 500 A TJ, TSTG - 55 to +175 °C (1) Operating junction and storage temperature range Note: (1)Non-repetitive current pulse per Fig.2 and derated above TA= 25 °C per Fig.1 www.dowosemi.cn P. 1 SM5S Series AVERAGE FORWARD CURRENT, (A) AMBIENT TEMPERATURE , (℃) 100 0 Tr=10μs 100 25 100 175 0 75 100 Peak Pulse Current , (% ) Peak Pulse Derating in Percentage of Peak Power or Current, (%) Ratings and Characteristics Curves (TA=25℃ unless otherwise noted) 50 25 0 Peak Value (Ipp) Half Value = Ipp 2 50 10/1000 μsec. Waveform td 0 0 25 50 75 100 125 150 175 200 0 1 2 Time , (ms) Ambient Temperature ,TA (℃) Fig. 1 - Pulse Derating Curve 6.0 1 4 10 2800 0 100 1100 2.0 0 6600 5 4.0 0.0 0 ## 76 50 33 23 13 10 10000 5 Peak Power (W) Steady State Power Dissipation, (W) ## 3 0 0.2 0.5 1 1.5 2 3 4 Fig. 2 - Pulse Waveform 8.0 0 25 TJ = 25 °C Pulse Width (td) is defined as the point where the peak current decays to 50 % of Ipp 25 50 75 100 125 150 175 200 1000 10 5200 100 1900 10 100 Pulse Width ,td (ms) Lead Temperature , TL (℃) Fig. 4 - Peak Pulse Power Rating Curve Fig. 3 - Steady State Power Derating Curve Package Outline Dimensions (millimeters) Recommended Mounting Pad Layout 3.3 3.0 3.5 11.0 9.5 www.dowosemi.cn 15.8 P. 2 SM5S Series Surface Mount Tape and Reel Packaging G ZONE 1 N A ZONE1 B D C T Dimensions in Millimeters (inches) TAPE SIZE A MAX. 24 mm (0.945) 330 ± 2.0 (13.0 ± 0.079) 178 ± 2.0 (7.0 ± 0.079) B MIN. C 13.5 ± 0.50 1.5 (0.059) (0.53 ± 0.02) D MIN. N MIN. G MAX. T MAX. 20.2 (0.795) 50 (1.97) 26.4 (1.039) 30.4 (1.197) Recommended Soldering Parameters IR-Reflow Condition Temp. min 150 Temp. max 200 Time(min to max) 60-180 Ramp up rate (150-200℃) Reflow ℃ ℃ sec 220 ℃ Peak Temp. 245 ℃ Time(Liq. to Peak) 60-150 sec