AZC099-04S-MS

www.msksemi.com AZC099-04S-MS Semiconductor SOT-23-6 PIN Configuration Compiance MAIN APPLICATIONS USB 2.0&3.0 power and data line protection Digital video interface (DVI) Notebook computers Video graphics cards Monitors and flat panel displays 10/100/1000 ethernet SIM ports ATM interfaces PROTECTION SOLUTION TO MEET IEC61000-4-2 (ESD) ±20kV (air), ±20kV (contact) IEC61000-4-4 (EFT) 40A (5/50ns) IEC61000-4-5 (Lightning) 5A (8/20µs) ABSOLUTE MAXIMUM RATINGS (TA=25℃, RH=45%-75%, unless otherwise noted) Parameter Peak pulse power dissipation on 8/20µs waveform ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Symbol Value Unit PPP 100 W VESD +/- 20 +/-20 kV Lead soldering temperature TL 260 (10 sec.) ℃ Operating junction temperature range TJ -55 to +125 ℃ TSTG -55 to +150 ℃ Storage temperature range www.msksemi.com AZC099-04S-MS Semiconductor Compiance ELECTRICAL CHARACTERISTICS (TA=25℃) Parameter Symbol Conditions Min Typ VRWM Reverse working voltage VBR Reverse breakdown voltage IT=1mA Unit 5.0 V 6.0 Reverse leakage current IR VRWM=5V Forward voltage VF IT=10mA Clamping voltage (I/O pin to Ground) VC Junction capacitance Max V 1 µA 0.8 1.0 V IPP=1A, tP=8/20µs 9.5 11 VC IPP=5A, tP=8/20µs 12.5 15 CJ VRWM=0V, f=1MHz Any I/O pin to Ground VRWM=0V, f=1MHz Between I/O pins 0.65 0.8 0.3 0.5 V pF RATINGS AND V-I CHARACTERISTICS CURVES (TA=25℃, unless otherwise noted) FIG.1:V- I curve characteristics (Uni-directional) IF FIG.2: Pulse waveform (8/20µs) Percent of IPPM I front time: T1 = 1.25×T = 8×(1±20%)µs time to half value: T2 = 20×(1±20%)µs Peak value 100 90 Half value V VC VBR VRWM IRVF IT 50 IPP 10 0 0 FIG.3: Pulse derating curve T2 t(µs) T T1 10 20 30 40 FIG.4: ESD clamping (20kV contact) PPP derating in percentage(%) 100 Percent of I PPM 100 90 80 30ns 60 40 60ns 20 0 0 25 50 TA(℃) 75 100 125 150 175 10 0 0 t(ns) tr 0.7 to 1ns 30 60 www.msksemi.com AZC099-04S-MS Semiconductor Compiance PACKAGE MECHANICAL DATA Symbol A A1 A2 b c D E1 E e e1 L θ Dimensions In Millimeters Min. Max. 1.050 1.250 0.000 0.100 1.050 1.150 0.300 0.500 0.100 0.200 2.820 3.020 1.500 1.700 2.650 2.950 0.950(BSC) 1.800 2.000 0.300 0.600 0° 8° Dimensions In Inches Min. Max. 0.041 0.049 0.000 0.004 0.041 0.045 0.012 0.020 0.004 0.008 0.111 0.119 0.059 0.067 0.104 0.116 0.037(BSC) 0.071 0.079 0.012 0.024 0° 8° REEL SPECIFICATION P/N AZC099-04S-MS PKG SOT-23-6 QTY 3000 www.msksemi.com AZC099-04S-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. 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