NJM8080G-TE2

NJM8080 DUAL AUDIO OPERATIONAL AMPLIFIER FEATURES DESCRIPTION ● Supply Voltage ±2V to ±18V ● Low Input Noise Voltage 5nV/√ Hz typ. at f=1kHz ● Wide Gain Bandwidth Product 15 MHz typ. ● Low Distortion 0.0005% typ. ● Slew Rate 5V/μs typ. ● Bipolar Technology ● Package Outline SOP8 MSOP8 (TVSP8)* *meet JEDEC MO-187-DA / thin type SSOP8 ● Internal ESD Protection Human Body Model (HBM) ±2000V typ. ● Wide Temperature Range -40°C to 125°C The NJM8080 is dual operational amplifier designed for audio applications. NJM8080 finely refines to every detail from Si-wafer to circuit layout, stick in a thorough improvement in sound quality. The NJM8080 features high resolution and crispy-clear high frequency sound, which can fully perform the digital sound source with loss-less. NJM8080 features low noise, wide gain-bandwidth, low distortion and high output current, and various reliabilities and conveniences are improved. NJM8080 can widely be used as the standard audio operational amplifier. ■ RELATED PRODUCT APPLICATIONS ● Home Audio ● Car Audio ● Active Filters ● Servo Control Amplifiers ● Headphone Amplifiers PRODUCT NAME NJM8068 FEATURES 3.5nV/√Hz, 0.001%, 6.8V/μs, 19MHz (Low noise, low distortion audio Op-Amp) ■ EQUIVALENT CIRCUIT V+ -INPUT +INPUT OUTPUT V- Ver.6.0 http://www.njr.com/ -1- NJM8080 ■ PIN CONFIGURATIONS PRODUCT NAME NJM8080G NJM8080RB1 NJM8080V Package SOP8 MSOP8 (TVSP8) SSOP8 (Top View) Pin Functions A OUTPUT 1 8 V+ A -INPUT 2 7 B OUTPUT A +INPUT 3 6 B -INPUT V- 4 5 B +INPUT ■ PRODUCT NAME INFORMATION NJM8080 Part Number G (TE2) Package Taping Form ■ ORDER INFORMATION PRODUCT NAME PACKAGE NJM8080G NJM8080RB1 RoHS HALOGENFREE TERMINAL FINISH WEIGHT (mg) MARKING MOQ (pcs) SOP8 Yes Yes Pure Sn 8080 88 2500 MSOP8 (TVSP8) Yes Yes Sn2Bi 8080 18 2000 SSOP8 Yes Yes Sn2Bi 8080 42 2000 NJM8080V ■ ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL + Supply Voltage - V /V (1) Differential Input Voltage VID (2) RATING UNIT ±18 V ±36 - V - V + V Input Voltage VIN V -0.3 to V +36 Output Terminal Input Voltage VO V -0.3 to V +0.3 (3) - (4) Power Dissipation SOP8 MSOP8 (TVSP8) SSOP8 Storage Temperature Range Tstg Maximum Junction Temperature Tjmax 150 SYMBOL VALUE PD 2-Layer / 4-Layer 690 / 1000 510 / 680 430 / 540 -65 to 150 mW ºC ºC ■ THERMAL CHARACTERISTICS PACKAGE Junction-to-Ambient Thermal Resistance SOP8 MSOP8 (TVSP8) SSOP8 Junction-to-Top of Package Characterization Parameter UNIT (4) Θja 2-Layer / 4-Layer 181 / 125 245 / 184 291 / 231 (4) 2-Layer / 4-Layer °C/W SOP8 49 / 43 Ψjt °C/W MSOP8 (TVSP8) 51 / 45 SSOP8 46 / 45 (1) Differential voltage is the voltage difference between +INPUT and -INPUT. +. (2) Input voltage is the voltage should be allowed to apply to the input terminal independent of the magnitude of V The normal operation will establish when any input is within the “Common-Mode Input Voltage Range” of electrical characteristics. (3) Power dissipation is the power that can be consumed by the IC at Ta=25ºC, and is the typical measured value based on JEDEC condition. (4) 2-Layer: Mounted on glass epoxy board. (76.2×114.3×1.6 mm: based on EIA/JDEC standard, 2-layer FR-4) 4-Layer: Mounted on glass epoxy board. (76.2×114.3×1.6 mm: based on EIA/JDEC standard, 4-layer FR-4), internal Cu area: 74.2 x 74.2 mm Ver.6.0 http://www.njr.com/ -2- NJM8080 ■ POWER DISSIPATION vs. AMBIENT TEMPERATURE Power Dissipation vs. Temperature Power Dissipation vs. Temperature 4-Layer 1100 1100 1000 1000 Power Dissipation PD [mW] Power Dissipation PD [mW] 2-Layer 900 SOP8 800 700 MSOP8 TVSP8 (TVSP8) 600 500 400 300 200 100 SOP8 900 800 MSOP8 (TVSP8) 700 600 500 400 300 200 SSOP8 100 SSOP8 0 0 0 25 50 75 100 125 150 0 25 Ambient Temperature [°C] 50 75 100 125 150 Ambient Temperature [°C] RECOMMENDED OPERATING CONDITIONS PARAMETER Supply Voltage Operating Temperature Range SYMBOL + - CONDITIONS VALUE Ta=25°C V /V Topr UNIT ±2 to ±18 V -40 to 125 °C ■ ELECTRICAL CHARACTERISTICS (V+/V-=±15V, Ta=25°C, unless otherwise noted.) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT - 0.3 3 mV - 100 500 nA INPUT/OUTPUT CHARACTERISTICS Input Offset Voltage Input Bias Current VIO RS≤10kΩ IB Input Offset Current IIO - 5 200 nA Input Resistance RIN - 0.5 - MΩ Open-Loop Voltage Gain AV RL≥2kΩ,VO=±10V 90 110 - dB Maximum Output Voltage VOM RL≥2kΩ ±12 ±13.5 - V Common-Mode Input Voltage Range VICM ±12 ±13.5 - V Common-Mode Rejection Ratio CMR RS≤10kΩ 80 110 - dB SVR RS≤10kΩ 80 110 - dB - 6 9 mA POWER SUPPLY Supply Voltage Rejection Ratio Supply Current ISUPPLY AC CHARACTERISTICS Slew Rate Gain Bandwidth Product Total Harmonic Distortion + Noise Equivalent Input Noise Voltage Ver.6.0 SR RL≥2kΩ - 5 - V/μs GBW f=10kHz - 15 - MHz AV=20dB,VO=5V,RL=2kΩ,f=1kHz - 0.0005 - % f=1kHz - 5 - nV/√Hz THD+N en http://www.njr.com/ -3- NJM8080 ■ TYPICAL CHARACTERISTICS Gain/Phase vs. Frequency + Gain/Phase vs. Frequency - + V /V =±15V, Gv=40dB, RL=2kΩ, CL=10pF - V /V =±15V, Gv=40dB, RL=2kΩ, Ta=25ºC 50 Gain 40 Gain Ta=25ºC 10 0 -30 Ta=-40ºC 0 -60 Ta=-40ºC -10 -90 Ta=25ºC -20 Voltage Gain [dB] Phase 20 Phase [deg] Voltage Gain [dB] CL=330pF Ta=125ºC 30 -120 CL=10pF -30 0 Phase 100k -120 CL=330pF -60 10k Maximum Output Voltage vs. Output Current + 100k -150 1M 10M Frequency [Hz] -180 100M Maximum Output Voltage vs. Load Resistance - + V /V =±15V - V /V =±15V, Gv=open 15 15 Ta=-40ºC 10 Maximum Output Voltage [V] +VOM Maximum Output Voltage [V] -90 CL=680pF -180 100M 1M 10M Frequency [Hz] -60 CL=10pF CL=100pF -20 -150 -40 10k 0 CL=680pF -40 Ta=125ºC -30 CL=100pF 20 Phase [deg] 40 Ta=125ºC Ta=85ºC 5 Ta=25ºC 0 Ta=25ºC Ta=85ºC -5 Ta=125ºC -10 -VOM +VOM Ta=125ºC 10 Ta=85ºC 5 Ta=25ºC Ta=-40ºC 0 Ta=-40ºC -5 Ta=25ºC Ta=85ºC -10 Ta=125ºC -V -VOM OM Ta=-40ºC -15 -15 1 10 Output Current [mA] 100 100 + - - V /V =±2V, GV=20dB, RL=2kΩ, Ta=25°C V /V =±15V, GV=20dB, RL=2kΩ, Ta=25ºC 1 0.1 THD+N [%] 0.01 THD+N [%] 100k THD+N vs. Output Voltage THD+N vs. Output Voltage + 1k 10k Load Resistance[Ω] f=20kHz 0.1 f=20Hz f=1kHz f=20kHz 0.001 f=1kHz f=20Hz 0.0001 0.1 Ver.6.0 1 Output Voltage [Vrms] 10 0.01 0.01 http://www.njr.com/ 0.1 Output Voltage [Vrms] 1 -4- NJM8080 ■ TYPICAL CHARACTERISTICS Voltage Noise vs. Frequency Maximum Output Voltage Swing vs. Frequency + + - 30 Equivalent Input Noise Voltage [nV/Hz] 30 Maximum Output Voltage Swing VOPP [Vpp] - V /V =±15V, GV=40dB, RF=2kΩ, Ta=25ºC V /V =±15V, RL=2kΩ, Ta=25ºC 25 20 15 10 5 25 20 15 10 5 0 0 1k 10k 100k Frequency[Hz] 1M 1 10M 10 100 1k Frequency [Hz] RL=open RL=open 8 8 7 7 Ta=-40ºC Ta=25ºC 6 Supply Current [mA] Supply Current [mA] + 5 4 3 Ta=85ºC Ta=125ºC 2 - V /V =±18V 6 + - V /V =±15V 5 4 + - V /V =±2V 3 2 1 1 0 0 0 ±2 -50 ±4 ±6 ±8 ±10 ±12 ±14 ±16 ±18 + Supply Voltage V /V [V] -25 0 25 50 75 100 125 150 Ambient Temperature [ºC] Input Offset Voltage vs. Supply Voltage Input Offset Voltage vs. Temperature 3 + Input Offset Voltage [mV] 3 Input Offset Voltage [mV] 100k Supply Current vs. Temperature Supply Current vs. Supply Voltage - V /V =±2V 2 + - V /V =±15V 1 0 + - V /V =±18V -1 2 Ta=25ºC Ta=-40ºC 1 0 Ta=85ºC Ta=125ºC -1 -2 -2 -50 Ver.6.0 10k -25 0 25 50 75 100 125 150 Ambient Temperature [ºC] 0 ±2 http://www.njr.com/ ±4 ±6 ±8 ±10 ±12 ±14 ±16 ±18 + Supply Voltage V /V [V] -5- NJM8080 ■ TYPICAL CHARACTERISTICS Input Offset Voltage vs. Common-Mode Input Voltage + Input Offset Voltage vs. Common-Mode Input Voltage - + V /V =±15V V /V=-±2V 3 Input Offset Voltage [mV] Input Offset Voltage [mV] 3 2 Ta=-40ºC Ta=85ºC 1 0 Ta=25ºC Ta=125ºC -1 -2 -15 -10 -5 0 5 10 Common-Mode Input Voltage [V] Ta=85ºC 2 1 Ta=-40ºC Ta=25ºC -1 -2 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 Common-Mode Input Voltage [V] 15 Input Bias Current vs. Temperature 350 115 Open-Loop Voltage Gain [dB] Input Bias Current [nA] 120 300 + - V /V =±15V + - V /V =±2V 200 150 100 + - V /V =±18V 50 0 V+/V-=±15V, RL=2kΩ to GND 110 105 100 95 90 85 80 -50 -25 0 25 50 75 100 125 150 Ambient Temperature [ºC] -50 -25 + + - - V /V =±9V±18V 120 Supply Voltage Rejection Ratio [dB] 120 Common-Mode Rejection Ratio [dB] 0 25 50 75 100 125 150 Ambient Temperature [°C] SVR vs. Temperature CMR vs. Temperature V /V =±15V, VCM=-12.2V~12.2V 115 110 105 100 95 90 85 115 110 105 100 95 90 85 80 80 -50 Ver.6.0 2.0 Open-Loop Voltage Gain vs. Temperature VICM=0V 400 250 Ta=125ºC 0 -25 0 25 50 75 100 125 150 Ambient Temperature [ºC] -50 -25 http://www.njr.com/ 0 25 50 75 100 125 150 Ambient Temperature [ºC] -6- NJM8080 ■ TYPICAL CHARACTERISTICS Maximum Output Voltage vs. Supply Voltage Maximum Output Voltage vs. Temperature RL=2kΩ to GND Gv=open, RL=2kΩ, RL to GND 18 Maximum Output Voltage [V] 15 12 + +VOM - V /V =±18V + - V /V =±15V 9 6 + - V /V =±2V 3 0 -3 + - V /V =±2V -6 -9 + + - V /V =±15V - V /V =±18V -VOM -12 Maximum Output Voltage [V] 18 12 6 Ta=25ºC Ta=-40ºC 0 Ta=85ºC Ta=125ºC -6 -12 -15 -18 -18 -50 -25 0 25 50 75 100 125 150 Ambient Temperature [ºC] ±2 ±4 ±6 ±8 ±10 ±12 ±14 ±16 ±18 + Supply Voltage V /V [V] Pulse Response + - Voltage [0.5V/div] V /V =±15V, RL=2kΩ, Ta=25ºC Vin CL=10pF CL=330pF CL=680pF Time [1μs/div] Ver.6.0 http://www.njr.com/ -7- NJM8080 ■ TEST CIRCUITS ● ISUPPLY ● VIO, CMR, SVR RG=50Ω, RF=50kΩ V+ RF A V+ RG VO RG V- RF V- VS=V+-V- ● VOH, VOL VOH; Vin+ = 1V, Vin- = -1V VOL; Vin+ = -1V, Vin- = 1V V+ VO RL V- Vin+ Vin- ● SR RL=2kΩ 90% V+ Vo VO 50Ω Ver.6.0 V- 90% ΔV ΔV 10% Δt Δt 10% RL http://www.njr.com/ -8- NJM8080 SOP8 Unit: mm ■ PACKAGE DIMENSIONS DETAIL F D T e/2 5 8 E E1 1 4 U h ×45 ° 6 ×e ∞0 M U M θ A2 CCC Z A A1 Z S EA T I N G PLANE 8 ×b bbb M D ESCR IPTI ON TOT AL T HICKN ESS S YMBOL A MIN .053 INC H NC M MAX .0 69 ST AND O FF A1 .004 .0 10 0.10 0.2 5 MOLD THI CKNES S LEAD WIDT H A2 b . 049 . 014 .019 1. 25 0. 35 0.49 L/ F THI CKNE SS C .007 .0 10 0.19 0.2 5 D .189 .1 97 4.80 5.0 0 E1 .15 0 . 157 3.80 4. 00 E .228 .2 44 5.80 BODY SIZE LE AD PI TCH e .050 BSC 6.2 0 . 015 .049 0 .40 1.25 h . 010 .02 0 0 .25 0.50 0° 5° θ2 2° 7° 7° 15 ° 0° 5° 12 ° 2° 7° 15 ° 7° LE AD ED GE O FFSE T L EAD OFFS ET ∞O b bb .010 .010 0.25 0.25 CO PLAN ARIT Y CC C . 004 0.10 Ver.6.0 θ1 1.2 7 BS C L θ θ1 Z U S T S MI LLIM ETER M IN NC M MAX 1 .35 1.7 5 θ2 C 12 ° http://www.njr.com/ [0.25] L DETAIL F -9- NJM8080 SOP8 Unit: mm ■ EXAMPLE OF SOLDER PADS DIMENSIONS 0.72 5.72 1.27 1.27 3.81 Ver.6.0 http://www.njr.com/ - 10 - NJM8080 MSOP8 (TVSP8) JEDEC MO-187-DA/THIN TYPE Unit: mm ■ PACKAGE DIMENSIONS 2. 9 ± 0 . 1 0 ∼10ﾟ 1 0.55 ± 0.1 4.0 ± 0.2 5 2.8 ± 0.1 8 4 0. 1 2 7 +0.05 -0.03 0 . 65 0 . 08 0 . 2 ± 0. 0 5 0 . 05 M 0.1 ± 0.05 1.0max 0 . 4 75 ± 0 .1 ■ EXAMPLE OF SOLDER PADS DIMENSIONS 0.65 3.5 1 .0 0.23 1.95 Ver.6.0 http://www.njr.com/ - 11 - NJM8080 SSOP8 Unit: mm ■ PACKAGE DIMENSIONS .3 3.5 +0 -0 .1 0 ∼10 ° 8 0. 5 ± 0 .2 6.4 ± 0 .3 4.4 ± 0. 2 5 4 1 .15 ± 0.1 0.65 0.1 0.22 ±0.1 0.1 M 0.15 +0.1 -0.05 0.1 ± 0.1 1 0.9max ■ EXAMPLE OF SOLDER PADS DIMENSIONS 0.65 5.9 0 1. 0 0.35 1.95 Ver.6.0 http://www.njr.com/ - 12 - NJM8080 SOP8 Unit: mm ■ PACKING SPEC REEL DIMENSIONS / TAPING DIMENSIONS 8 12 330 F e e d d i r e c t i on 8 12.4 TAPING STATE Insert direction Sealing with covering tape (TE2) Feed direction Empty tape Devices Empty tape Trailer 60pcs 2500pcs/reel Leader 60pcs PACKING STATE Label Label ESD Label Ver.6.0 http://www.njr.com/ - 13 - NJM8080 MSOP8 (TVSP8) MEET JEDEC MO-187-DA/THIN TYPE Unit: mm ■ PACKING SPEC TAPING DIMENSIONS Fe ed d ir ec ti on P2 P0 φD0 B W1 W F E T A T2 φD1 P1 SYMBOL A B D0 D1 E F P0 P1 P2 T T2 W W1 DIMENSION 4.4 3.2 1.5 +0.1 0 1.5 +0.1 0 1.75±0.1 5.5±0.05 4.0±0.1 8.0±0.1 2.0±0.05 0.30±0.05 1.75 (MAX.) 12.0±0.3 9.5 REMARKS BOTTOM DIMENSION BOTTOM DIMENSION THICKNESS 0.1max REEL DIMENSIONS W1 SYMBOL A B C D E W W1 B D A C E DIMENSION φ254±2 φ100±1 φ 13±0.2 φ 21±0.8 2±0.5 13.5±0.5 2.0±0.2 W TAPING STATE Insert direction Sealing with covering tape (TE1) Devices Empty tape Feed direction more than 20pitch 2000pcs/reel Empty tape Covering tape more than 20pitch reel more than 1round PACKING STATE Label Label Put a reel into a box Ver.6.0 http://www.njr.com/ - 14 - NJM8080 SSOP8 Unit: mm ■ PACKING SPEC TAPING DIMENSIONS F e e d d i r e ct i o n P2 P0 φ D0 SYMBOL A B D0 D1 E F P0 P1 P2 T T2 W W1 W1 B W F E T P1 A φ D1 T2 DIMENSION 6.7 3.9 1.55±0.05 1.55±0.1 1.75±0.1 5.5±0.05 4.0±0.1 8.0±0.1 2.0±0.05 0.3±0.05 2.2 12.0±0.3 9.5 REMARKS BOTTOM DIMENSION BOTTOM DIMENSION THICKNESS 0.1max REEL DIMENSIONS W1 C SYMBOL A B C D E W W1 B A D E DIMENSION φ254±2 φ100±1 φ 13±0.2 φ 21±0.8 2±0.5 13.5±0.5 2±0.2 W TAPING STATE Insert direction Sealing with covering tape (TE1) Empty tape Feed direction more than 20pitch Devices 2000pcs/reel Empty tape Covering tape more than 20pitch reel more than 1round PACKING STATE Label Label Put a reel into a box Ver.6.0 http://www.njr.com/ - 15 - NJM8080 ■ RECOMMENDED MOUNTING METHOD INFRARED REFLOW SOLDERING PROFILE f 260°C e 230°C 220°C a d b 180°C c d e f g 150°C Temperature ramping rate Pre-heating temperature Pre-heating time Temperature ramp rate 220°C or higher time 230°C or higher time Peak temperature Temperature ramping rate 1 to 4°C/s 150 to 180°C 60 to 120s 1 to 4°C/s shorter than 60s shorter than 40s lower than 260°C 1 to 6°C/s The temperature indicates at the surface of mold package. Room Temp. a Ver.6.0 b c g http://www.njr.com/ - 16 - NJM8080 [ CAUTION ] 1. New JRC strives to produce reliable and high quality semiconductors. New JRC's semiconductors are intended for specific applications and require proper maintenance and handling. To enhance the performance and service of New JRC's semiconductors, the devices, machinery or equipment into which they are integrated should undergo preventative maintenance and inspection at regularly scheduled intervals. Failure to properly maintain equipment and machinery incorporating these products can result in catastrophic system failures 2. The specifications on this datasheet are only given for information without any guarantee as regards either mistakes or omissions. The application circuits in this datasheet are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights. All other trademarks mentioned herein are the property of their respective companies. 3. To ensure the highest levels of reliability, New JRC products must always be properly handled. The introduction of external contaminants (e.g. dust, oil or cosmetics) can result in failures of semiconductor products. 4. New JRC offers a variety of semiconductor products intended for particular applications. It is important that you select the proper component for your intended application. You may contact New JRC's Sale's Office if you are uncertain about the products listed in this catalog. 5. Special care is required in designing devices, machinery or equipment which demand high levels of reliability. This is particularly important when designing critical components or systems whose failure can foreseeably result in situations that could adversely affect health or safety. In designing such critical devices, equipment or machinery, careful consideration should be given to amongst other things, their safety design, fail-safe design, back-up and redundancy systems, and diffusion design. 6. The products listed in the catalog may not be appropriate for use in certain equipment where reliability is critical or where the products may be subjected to extreme conditions. You should consult our sales office before using the products in any of the following types of equipment. Aerospace Equipment Equipment Used in the Deep Sea Power Generator Control Equipment (Nuclear, steam, hydraulic, etc.) Life Maintenance Medical Equipment Fire Alarms / Intruder Detectors Vehicle Control Equipment (Airplane, railroad, ship, etc.) Various Safety Devices 7. New JRC's products have been designed and tested to function within controlled environmental conditions. Do not use products under conditions that deviate from methods or applications specified in this catalog. Failure to employ New JRC products in the proper applications can lead to deterioration, destruction or failure of the products. New JRC shall not be responsible for any bodily injury, fires or accident, property damage or any consequential damages resulting from misuse or misapplication of its products. Products are sold without warranty of any kind, either express or implied, including but not limited to any implied warranty of merchantability or fitness for a particular purpose. 8. Warning for handling Gallium and Arsenic (GaAs) products (Applying to GaAs MMIC, Photo Reflector). These products use Gallium (Ga) and Arsenic (As) which are specified as poisonous chemicals by law. For the prevention of a hazard, do not burn, destroy, or process chemically to make them as gas or power. When the product is disposed, please follow the related regulation and do not mix this with general industrial waste or household waste. 9. The product specifications and descriptions listed in this catalog are subject to change at any time, without notice. Ver.6.0 http://www.njr.com/ - 17 -