DATA SHEET
POSITIVE TEMPERATURE COEFFICIENT
AC/DC POWER SUPPLY
SMD0805 series
Product specification– March 27, 2022 V.3
RoHS compliant & Halogen free
Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
2
9
SMD0805
Positive Temperature Coefficient (PTC) Data Sheet
Description
The 0805 series provides miniature surface mount resettable overcurrent protection
with holding current from 0.05A to 1.1A. This series is suitable for ultra portable
applications where space is at a premium and the device current is low.
Features
■ RoHS compliant and lead-free
■ Fast response to fault current
■ UL/CUL/ TUV/ RoHS/ Halogen Free
■ Low profile
■ Compatible with high temperature solders
■ Compact design saves board space
Applications
■ USB hubs, ports and peripherals
■ Set-top-box and HDMI
■ Game console port protection
■ Motherboard USB & IEEE 1394 protection
■ Optical disk drives
■ General electronics
Part Number Code and Marking
SMD 0805 B
TF T /
Special Voltage Rating (Optional)
Thickness Version (Optional)
Lead-Free
Holding Current Rating
Delimiter
Device Dimensions: Length/Width (Unit: 1/100 inch)
Surface Mount Device
Part Number
Marking
Part Number
Marking
SMD0805B005TF
-
SMD0805B050TF
5
SMD0805B010TF
1
SMD0805B075TF
7
SMD0805B010TF/24
H
SMD0805B100TFT
I
SMD0805B020TF
2
SMD0805B110TF
E
SMD0805B035TF
3
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Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
3
9
SMD0805
Dimensions and PAD-SIZE
C
A
BK Logo
B
Part identification
D
A
E
B
C
D
E
Part
Number
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
SMD0805B005TF
2.00
2.20
1.20
1.50
0.45
0.95
0.20
0.55
0.05
0.45
SMD0805B010TF
2.00
2.20
1.20
1.50
0.50
1.00
0.20
0.55
0.05
0.45
SMD0805B010TF/24
2.00
2.20
1.20
1.50
0.45
0.95
0.20
0.55
0.05
0.45
SMD0805B020TF
2.00
2.20
1.20
1.50
0.50
1.00
0.20
0.55
0.05
0.45
SMD0805B035TF
2.00
2.20
1.20
1.50
0.50
1.00
0.20
0.55
0.05
0.45
SMD0805B050TF
2.00
2.20
1.20
1.50
0.35
0.85
0.20
0.55
0.05
0.45
SMD0805B075TF
2.00
2.20
1.20
1.50
0.75
1.25
0.20
0.55
0.05
0.45
SMD0805B100TFT
2.00
2.20
1.20
1.50
0.60
1.40
0.20
0.55
0.05
0.45
SMD0805B110TF
2.00
2.20
1.20
1.50
0.60
1.40
0.20
0.55
0.05
0.45
Recommended Pad Layout (mm)
1.50typ.
1.20typ.
1.00typ.
1.00typ.
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Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
4
9
SMD0805
Electrical Characteristics
Part
Number
Ihold
(A)
Itrip
(A)
Vmax
(Vdc)
Imax
(A)
Pd typ.
(W)
SMD0805B005TF
0.05
0.15
30
40
SMD0805B010TF
0.10
0.30
15
SMD0805B010TF/24
0.10
0.30
SMD0805B020TF
0.20
SMD0805B035TF
Maximum
Time To Trip
Resistance
Time
(Sec.)
Current
(A)
Rmin
(Ω)
R1max
(Ω)
0.5
1.5
0.25
3.60
20.0
100
0.5
1.50
0.50
1.00
6.00
24
100
0.5
1.5
0.5
1.50
6.00
0.50
9
100
0.5
0.02
8.00
0.65
3.50
0.35
0.75
6
100
0.5
0.10
8.00
0.25
1.20
SMD0805B050TF
0.50
1.00
6
100
0.5
0.10
8.00
0.15
0.85
SMD0805B075TF
0.75
1.50
6
40
0.6
0.20
8.00
0.09
0.35
SMD0805B100TFT
1.00
1.95
6
40
0.6
0.30
8.00
0.04
0.23
SMD0805B110TF
1.10
2.00
6
100
0.8
0.30
8.00
0.03
0.21
Note on Electrical Characteristics
■ Vocabulary
·Ihold = Hold current: maximum current device will pass without tripping in 23℃ still air.
·Itrip = Trip current: minimum current at which the device will trip in 23℃ still air.
·Vmax = Maximum voltage device can withstand without damage at rated current (Imax)
·Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax)
·Pd typ. = Typical power dissipated from device when in the tripped state at 23℃ still air.
·Rmin = Minimum resistance of device in initial (un-soldered) state.
·R1max = Maximum resistance of device at 23℃ measured one hour after tripping or reflow soldering of 260℃ for 20 sec.
■ Value specified is determined by using the PWB with 0.090”*1.5oz copper traces.
■ Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.
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Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
SMD0805
5
9
Polymeric PTC Selecting Guide
■ Determine the following operating parameters for the circuits:
·Normal operating current (Ihold)
·Maximum interrupt current (Imax)
·Maximum circuit voltage (Vmax)
·Normal operating temperature surrounding device (min℃/max℃)
■ Select the device from factor and dimension suitable for the application
■ Compare the maximum rating for Vmax and Imax of the PPTC device with the circuit in application and make sure
the circuit’s requirement does not exceed the device rating.
■ Check that PPTC device’s trip time (time-to-trip) will protect the circuit.
■ Verify that the circuit operating temperature is within the PPTC device’s normal operating temperature range.
■ Verify that performance and suitability of the chosen PPTC device in the application.
! WARNING
■ Mechanical Stress
·PPTC devices will undergo a thermal expansion during fault condition. If PPTC devices are installed or placed in an application
where the space between PPTC devices and the surrounding materials (e.g., covering materials, packaging materials, encapsulate
materials and the like) is insufficient, it will cause an inhibiting effect upon the thermal expansion. Pressing, twisting, bending and
other kinds of mechanical stress will also adversely affect the performance of the PPTC devices, and shall not be used or applied.
■ Chemical Pollutants
·Silicone-based oils, oils, solvents, gels, electrolytes, fuels, acids, and the like will adversely affect the properties of PPTC devices,
and shall not be used or applied.
■ Electronic and Thermal Effect
·PPTC devices are secondary protection devices and are used solely for sporadic, accidental over-current or over-temperature
error condition, and shall NOT be used if or when constant or repeated fault conditions (such fault conditions may be caused by,
among others, incorrect pin-connection of a connector) or over-extensive trip events may occur.
·PPTC devices are different from fuses and, when a fault condition occurs, will go into high-resistance state and do not open
circuit, in which case the voltage at such PPTC devices may reach a hazardous level.
·Operation over the maximum rating or other forms of improper use may cause failure, arcing, flame and/or other damage to
the PPTC devices.
·Conductive material contamination, such as metal particle, may induce shortage, flame or arcing.
·Due to the inductance, the operation circuits may generate a circuit voltage (Ldi/dt) above the rated voltage of PPTC devices,
which shall not be used under such circumstances.
■ General
·Customers shall evaluate and test the properties of PPTC devices independently to verify and ensure that their individual
applications will be met.
·The performance of PPTC devices will be adversely affected if they are improperly used under electronic, thermal and/or
mechanical procedures and/or conditions non-conformant to those recommended by manufacturer.
·Customers shall be responsible for determining whether it is necessary to have back-up, failsafe and/or fool-proof protection
To avoid or minimize damage that may result from extra-ordinary, irregular function or failure of PPTC devices.
·Any and all responsibilities and liabilities are disclaimed if any item under this notice of warning is not complied with.
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Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
6
9
SMD0805
Thermal Derating Curve
Percentage of Rated Current
200.00
150.00
100.00
50.00
0.00
-40.00
0.00
40.00
80.00
120.00
Device Ambient Temperature (℃)
Thermal Derating Chart
Recommended Hold Current (A) at Ambient Temperature (℃)
Ambient Operation Temperature
Part
Number
-40℃
-20℃
0℃
23℃
40℃
50℃
60℃
70℃
85℃
SMD0805B005TF
0.077
0.069
0.061
0.050
0.042
0.038
0.033
0.028
0.021
SMD0805B010TF
0.14
0.12
0.11
0.10
0.08
0.07
0.06
0.05
0.03
SMD0805B010TF/24
0.14
0.12
0.11
0.10
0.08
0.07
0.06
0.05
0.03
SMD0805B020TF
0.28
0.25
0.23
0.20
0.17
0.14
0.12
0.10
0.07
SMD0805B035TF
0.47
0.44
0.39
0.35
0.30
0.27
0.24
0.20
0.14
SMD0805B050TF
0.68
0.62
0.55
0.50
0.40
0.37
0.33
0.29
0.23
SMD0805B075TF
1.00
0.90
0.79
0.75
0.63
0.57
0.53
0.41
0.34
SMD0805B100TFT
1.35
1.25
1.10
1.00
0.82
0.74
0.65
0.55
0.42
SMD0805B110TF
1.45
1.35
1.20
1.10
0.92
0.84
0.75
0.65
0.52
Average Time-Current Curve
A
100
B
C
D
E F G
A-SMD0805B005TF
B-SMD0805B010TF
SMD0805B010TF/24
Time to Trip (s)
10
C-SMD0805B020TF
D-SMD0805B035TF
E-SMD0805B050TF
1
F-SMD0805B075TF
G-SMD0805B100TFT
SMD0805B110TF
0.1
0.01
0.1
1
10
Fault Current (A)
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Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
7
9
SMD0805
Soldering Parameters
Critical Zone
TL to TP
tP
TP
Ramp-up
TL
tL
Temperature
TS max
TS min
Ramp-down
tS
Preheat
25
t 25℃ to Peak
Time
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TS max to TP)
3℃/second max.
Preheat
-Temperature Min (TS min)
-Temperature Max (TS max)
-Time (min to max) (TS min to TS max)
150℃
200℃
60-180 seconds
Time maintained above:
-Temperature (TL)
-Time (tL)
217℃
60-150 seconds
Peak Temperature (TP)
260℃
Time within 5℃ of actual Peak Temperature (tP)
Ramp-down Rate
Time 25℃ to Peak Temperature
Storage Condition
20-40 seconds
6℃/second max.
8 minutes max.
0℃~35℃, ≤70%RH
·Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free
·Recommended maximum paste thickness is 0.25mm (0.010 inch)
·Device can be cleaned using standard industry methods and solvents.
Note 1: All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
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Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
8
9
SMD0805
Environmental Specifications
Operating / Storage temperature
-40℃ to +85℃
Maximum Device Surface Temperature in Tripped State
125℃
Passive Aging
+85℃, 1000 hours
±50% typical resistance change
Humidity Aging
+85℃, 85%RH, 1000 hours
±50% typical resistance change
Thermal Shock
MIL-STD-202, Method 107G
+85℃/-40℃ 20 times
-50% typical resistance change
Solvent Resistance
MIL-STD-202, Method 215
No change
Vibration
MIL-STD-883C, Method 2007.1, Condition A
No change
Moisture Level Sensitivity
Level 1, J-STD-020C
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material: Matte Tin (Sn))
Terminal Solderability
Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3.
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Circuit Protection
POSITIVE TEMPERATURE COEFFICIENT
Product Specification
9
9
SMD0805
Packaging
Part Number
Part Number
Part Number
Quantity
SMD0805B005TF
4000
SMD0805B050TF
4000
SMD0805B010TF
4000
SMD0805B075TF
4000
SMD0805B010TF/24
4000
SMD0805B100TFT
3000
SMD0805B020TF
4000
SMD0805B110TF
3000
SMD0805B035TF
4000
◎ 8mm tape on 7 inch reel per EIA-481 (equivalent to IEC286, part 3)
Tape
Dimensions (mm)
Symbol
P2
P1
D0
T
B100TFT
B110TF
W
8.00±0.30
8.00±0.30
F
3.50±0.05
3.50±0.05
E
1.75±0.10
1.75±0.10
D0
1.55±0.05
1.55±0.05
D1
1.00(MIN)
1.00±0.10
P0
4.00±0.10
4.00±0.10
P1
4.00±0.10
4.00±0.10
P2
2.00±0.05
2.00±0.05
A0
1.60±0.10
1.65±0.10
B0
2.30±0.10
2.35±0.10
T
0.25±0.10
0.25±0.10
K0
0.90±0.10
1.15±0.10
Leader min.
390
390
Trailer min.
160
160
B0
W
F
E
P0
B005TF,B010TF
B010TF/24
B020TF,B035TF
B050TF,B075TF
D1
K0
A0
Reel
C
Φ178.0±1.0
D
Φ60.2±0.5
H
11.0±0.5
W
9.0±1.5
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