WMM7037AT2

WMM7037AT2 WMM7037AT2 Top port analog silicon Microphone Http//:www.willsemi.com Descriptions The WMM7037AT2 is a miniature, high performance, low power, top port silicon microphone. The WMM7037AT2 consists of an acoustic sensor, a low noise input buffer, and an output amplifier. These devices are suitable for protable electronic devices where excellent wideband audio performance and RF immunity are required applications. The WMM7037AT2 is manufactured in a compact 3.76mm*2.95mm*1.10mm, 4-pin LGA package. Product appearance Pin configuration (Bottom view) Features Matched Sensitivity Low current Small package MaxRF protection Ultra-Stable Performance Standard SMD Reflow Omnidirectional PIN1 Device code Applications ● Cellphones ● Smart phones ● Laptop computers ● Sensors ● Digital still cameras ● Portable music recorders Will Semiconductor Ltd. WILL MEMS Marking(Top view) Order information Device WMM7037AT2-4/TR 1 Package LGA 3.76*2.95*1.10 Shipping 5000/Reel&Tape Dec, 2016_V1.0 WMM7037AT2 Absolute maximum ratings Parameter VDD to Ground OUT to Ground Input Current to Any Pin Temperature Range Absolute Maximum Rating -0.5, +5.0 -0.3, VDD + 0.3 ±5 -40 to +100 Units V V mA °C Stresses exceeding these “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation at these or any other conditions beyond those indicated under “Acoustic & Electrical Specifications” is not implied. Exposure beyond those indicated under “Acoustic & Electrical Specifications” for extended periods may affect device reliability. ACOUSTIC & ELECTRICAL SPECIFICATIONS TEST CONDITIONS: 23 ±2°C, 55±20% R.H., VDD(min) < VDD < VDD(max), no load, unless otherwise indicated Parameter Supply Voltage Supply Current Sensitivity Signal to Noise Ratio Total Harmonic Distortion Symbol VDD IDD S SNR THD Acoustic Overload Point AOP DC Output Output impedance Directivity ZOUT Conditions 94dB SPL @1KHz 94dB SPL @1KHz, A-weighted 94dB SPL @1KHz, S=Typ, VDD=2.2V 3%THD @1KHz, S=Typ, VDD=2.2V 10%THD @1KHz, S=Typ, VDD=2.2V VDD=2.2V @1KH Min 1.5 -43 124 126 - Typ Max Units 3.6 V 80 100 uA -42 -41 dBV/Pa 59 dB(A) 0.2 0.5 % 128 dB SPL 130 0.76 V 200  Omnidirectional Typical specifications are measured at VDD = 2.2V. Will Semiconductor Ltd. WILL MEMS 2 Dec, 2016_V1.0 WMM7037AT2 Frequency response curve Will Semiconductor Ltd. WILL MEMS 3 Dec, 2016_V1.0 WMM7037AT2 Application informations Note: All GND pins must be connected to ground. Capacitors near the microphone should not contain Class 2 dielectrics. Will Semiconductor Ltd. WILL MEMS 4 Dec, 2016_V1.0 WMM7037AT2 MECHANICAL SPECIFICATIONS Item Dimension Tolerance Length(L) 3.76 ±0.10 Width(W) 2.95 ±0.10 Height(H) 1.10 ±0.10 Acoustic Port (AP) Ø 0.50 ±0.05 Pin# Pin Name Description 1 VDD Power Supply 2 GND GND 3 GND GND 4 OUTPUT Output Signal Notes: ● Dimensions are in millimeters unless otherwise specified. ● Tolerance is ±0.10mm unless otherwise specified. Will Semiconductor Ltd. WILL MEMS 5 Dec, 2016_V1.0 WMM7037AT2 EXAMPLE LAND PATTERN EXAMPLE SOLDER STENCIL PATTERN Will Semiconductor Ltd. WILL MEMS 6 Dec, 2016_V1.0 WMM7037AT2 PACKAGING & MARKING DETAIL Model Number WMM7037AT2 Reel Diameter 13’’ Quantity Per Reel 5,000 Notes: ● Dimensions are in millimeters unless otherwise specified. ● Vacuum pickup only in the pick area indicated in Mechanical Specifications. ● Tape & reel per EIA-481. ● Labels applied directly to reel and external package. Will Semiconductor Ltd. WILL MEMS 7 Dec, 2016_V1.0 WMM7037AT2 REFERENCED REFLOW PROFILE Profile Feature Pb-Free Average Ramp-up rate (TSMAX to TP) Preheat Temperature Min (TSMIN) Temperature Max (TSMAX) Time (TSMIN to TSMAX) (tS) Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within 5°C of actual Peak Temperature (tP) Ramp-down rate (TP to TSMAX) Time 25°C to Peak Temperature 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds 260°C 20-40 seconds 6°C/second max 8 minutes max Note: All temperatures refer to topside of the package, measured on the package body surface. Will Semiconductor Ltd. WILL MEMS 8 Dec, 2016_V1.0 WMM7037AT2 ADDITIONAL NOTES (A) Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened ESD moisture sensitive bag under maximum environmental conditions of 30°C, 70% R.H. (B) MSL (moisture sensitivity level) Class 2. (C) Maximum of 3 reflow cycles is recommended. (D) In order to minimize device damage: Do not board wash or clean after the reflow process. Do not brush board with or without solvents after the reflow process. Do not directly expose to ultrasonic processing, welding, or cleaning. Do not insert any object in port hole of device at any time. Do not apply over 30 psi of air pressure into the port hole. Do not pull a vacuum over port hole of the microphone. Do not apply a vacuum when repacking into sealed bags at a rate faster than 0.5 atm/sec. Will Semiconductor Ltd. WILL MEMS 9 Dec, 2016_V1.0 WMM7037AT2 RELIABILITY SPECIFICATIONS Test Description Thermal Shock 100 cycles air-to-air thermal shock from -40oC to +125oC with 15 minute soaks. High Temperature Storage Low Temperature Storage Vibration ESD-HBM ESD-LID/GND ESD-MM Reflow Mechanical Shock 168 hours at +105oC environment 168 hours at -40oC environment 4 cycles of 20 to 2,000 Hz sinusoidal sweep with 20g peak acceleration lasting 12 minutes in X, Y, and Z directions. 3 discharges of ±2 kV direct contact to I/O pins. 3 discharges of ±8 kV direct contact to lid while unit is grounded. 3 discharges of ±2 kV direct contact to I/O pins. 5 reflow cycles with peak temperature of +260oC 3 pulses of 3,000g in the X, Y, and Z direction Note: After reliability tests are performed, the sensitivity of the microphones shall not deviate more than 3 dB from its initial value. Will Semiconductor Ltd. WILL MEMS 10 Dec, 2016_V1.0 WMM7037AT2 SPECIFICATION REVISIONS Revision V1.0 Will Semiconductor Ltd. WILL MEMS Specification Changes Initial Release 11 Date 01/12/16 Dec, 2016_V1.0