WCM2012F2SF-900T04-TC

Form No: Specification for Approval Date: 2021/12/21 Customer : TAI-TECH P/N: 立创 WCM2012F2SF-900T04-TC CUSTOMER P/N: DESCRIPTION: QUANTITY: REMARK: Customer Approval Feedback 西 北 臺 慶 科 技 股 份 有 限 公司 TAI-TECH Advanced Electronics Co., Ltd Sales Dep. 代理商： ■ 深圳市天诚科技有限公司 Shenzhen TsaSun Technology Co., Ltd. Room 209, 2/F, Block A, Tengfei Industrial Building, No.6, Taohua Road, Futian District, Shenzhen TEL: 0755-8335 8885 / 0755-8335 9885 E-mail: sales@tsasun.com www.tsacoil.com □ 西北臺慶科技股份有限公司 TAI-TECH Advanced Electronics Co., Ltd Headquarter: NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI, TAO-YUAN HSIEN, TAIWAN, R.O.C. TEL: +886-3-4641148 FAX: +886-3-4643565 http://www.tai-tech.com.tw E-mail: sales@tai-tech.com.tw APPROVED CHECKED 夏暁曼 夏暁曼 R&D Center APPROVED CHECKED DRAWN 羅宜春 梁周虎 卜文娟 □ 臺慶精密電子(昆山)有限公司 TAI-TECHADVANCEDELECTRONICS(KUNSHAN)CO., LTD SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN, JIANG-SU, CHINA TEL: +86-512-57619396 FAX: +86-512-57619688 E-mail: hui@tai-tech.com.tw TA734003 TAI-TECH P1 Wire Wound Type Common Mode Filter WCM2012F2SF-900T04 1.Features 1. High common mode impedance at high frequency effects excellent noise suppression performance. 2. WCM2012F2SF series realizes small size and low profile. 2.0x1.2x1.2 mm. 3. 100% Lead(Pb) & Halogen-Free and RoHS compliant. Halogen Pb Halogen-free Pb-free 2.Dimension C A 2 當破損面積＜0.3mm ,產品列入允收品範圍 E W B 產品破損寬度 A(mm) B(mm) C(mm) D1(mm) D2(mm) E(mm) 2012F2SF 2.0±0.2 1.2±0.2 1.2±0.2 0.55±0.1 0.46±0.1 0.15±0.1 900 T 04 G H I D D Series 3.Part Numbering WCM 2012 A B F 2 S F C D E F - A: Series B: Dimension C: Material Ferrite D: Number of Lines 2=2 lines E: Type S=One Circuit Type , N=Unshielded F: Lead free G: Impedance 900=90Ω H: Packaging T=Taping and Reel, B=Bulk I: Rated Current 04=400mA 4.Specification WCM2012F2SF-900T04 DC Common mode Impedance Test Frequency Resistance (MHz) (Ω) (Ω) max. 90±25% 100 Rated Current (mA) 0.30 Rated Volt. Withstand (Vdc) Volt. (Vdc) 400 50 WCM2012F2SF-900 1000 IMPEDANCE(Ohm) TAI-TECH Part Number Common Mode 100 10 Normal Mode 1 0.1 1 10 100 FREQUENCY(MHz) www.tai-tech.com.tw 1000 10000 125 IR (Ω) min. 10M TAI-TECH P2 5.Schematic Diagram 6.Reliability and Test Condition Item Performance Test Condition Electrical Characteristics Test Z(common mode) HP-4291A+HP-16092A DCR HP-4338B Refer to standard electrical characteristics list. I.R. Zentech 702A(Ultra High Resistance Meter) Applied the DC current to coils the impedance change should be less than ±25% to initial value and temperature rise should not be more than 30℃. Rated Current Operating Temperature -40℃~+125℃ Storage Temperature -40℃~+125℃,50~60%RH (Product without taping) Temperature Rise Test 30℃ max.(Δt) 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer Mechanical Performance Test Preheating Dipping Natural cooling 235°C Solderability Test ANSI /J-STD-002C Method B More than 90% of terminal electrode should be covered with solder. 150°C 60 second 4±1 second After fluxing,component shall be dipped in a melted solder bath at 235±5℃ for 4±1seconds. Preheating Dipping Natural cooling 260°C Solder Heat Resistance MIL-STD-202 Method210F Condition B Component Adhesion (Push test) Component Adhesion (Pull test) 1.Components should have not evidence of electrical and mechannical damage. 2. Impedance:within ±25% of initial value. Series No. F(Kg) WCM3216F2S 0.8(min.) WCM2012F2S 0.5(min.) WCM3216F2N 0.8(min.) WCM2012F2N 0.5(min.) Series No. F(Kg) WCM3216F2S 0.8(min.) WCM2012F2S 0.5(min.) WCM3216F2N 0.8(min.) WCM2012F2N 0.5(min.) www.tai-tech.com.tw 150°C 60 second 10±0.5 second Preheat:150℃ 60secs. Solder:Sn-Cu0.5 Solder temperature: 260±5℃ Flux:rosin. Dip time:10±0.5 secs. The device should be reflow soldered(255±5℃ for 10sec.)to a tinned copper substrate.A dynometer force gauge should be applied the side of the component.The device must with-ST-F Kg without ailure of the termination attached to component. F 1.Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. 2.Terminal shall not be remarkably damaged. TAI-TECH P3 Item Performance Test Condition Reliability Test Temperature:125±2℃ . Duration:1000±12hrs. Measured at room temperature after placing for 2 to 3hrs. Temperature:-40±2℃ Time: 500±12hr. Recovery: 4 to 24hrs of recovery under the standard condition after the removal from test chamber. High Temperature Life Test (Unload Test) MIL-PRF-27 Low Temperature Life Test (Unload Test) Thermal shock (Unload Test) MIL-STD-202G METHOD 107G Test condition A-3 1. Appearance:No damage. 2. Impedance:within ±25% of initial value. No disconnection or short circuit. Step Temperature(℃) Times(min.) 1 -55+0/-2℃ 15±1 2 Room Temp. 5 3 +85+2/-0℃ 15±1 4 Room Temp. 5 Condition for 1 cycle Step1:- 55+0/-2℃ 15±1 min. Step2:Room temperature 5 min. Step3:+85+2/-0℃ 15±1 min. Step4: Room temperature 5 min. Number of cycles:100 Temperature:40±2℃ Humidity:90~ 95% Time:500±12hr. Recovery:4 to 24hrs of recovery under the standard condition after the removal from test chamber. Humidity Resistance Test (Unload Test) MIL-STD-202G METHOD 103B Test condition C Frequency: 10-55-10Hz for 15 min. Humidity Resistance Test (Unload Test) MIL-STD-202G METHOD 103B Test condition C Amplitude: 1.52mm Appearance: Cracking, shipping and any other defects harmful to the Directions and times: characteristics should not be allowed. X, Y, Z directions for 15 min. Impedance: within±30% This cycle shall be performed 12 times in each of three mutually perpendicular directions (Total 9hours). www.tai-tech.com.tw TAI-TECH P4 7.Soldering and Mounting 7-1. Recommended PC Board Pattern WCM2012F2S/F2N WCM3216F2S/F2N L 2.60 3.70 H 1.25 1.60 G1 1.10 1.90 G2 0.45 0.40 1 2 4 3 G2 H G1 L PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 7-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. TAI-TECH terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 7-2.1 Lead Free Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. 7-2.2 Soldering Iron(Figure 3): Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150℃ ‧355℃ tip temperature (max) ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧1.0mm tip diameter (max) ‧Limit soldering time to 4~5 sec. Iron Soldering Reflow Soldering SOLDER ING 20~40s TEMPERATURE(°C) TP(260° C / 40s max.) 217 60~150s 200 150 PRE-H EATING NA TURAL CO OLING 60~180s SOLDERING within 4~5s TEMPERATURE(° C) PRE-HE ATING N ATUR AL C OOLING 350 150 Gradual cooling Over 60s 480s max. 25 TIME(sec.) TIME( sec.) Reflow times: 3 times max. Iron Soldering times: 1 times max. Fig.1 Fig.2 www.tai-tech.com.tw TAI-TECH P5 8.Packaging Information 8-1. Reel Dimension C B D 13 . 2±0.5 5± 0. 5 A R1 R1 0. 5 Type A(mm) B(mm) 7”x8mm 9.0±0.5 60±2 C(mm) D(mm) 13.5±0.5 178±2 R 0.5 .9 120 ° 7"x8mm 7"x12mm 8-2. Tape Dimension / 8mm 5+ 1. D: 1 0. t P .1 ±0 :1 D1 F:3.5±0.05 W:8.0±0.1 A A Ao Bo Po:4±0.1 E:1.75±0.1 P2:2±0.05 Ko Series Ĩize WCM2012F2S 201212 2.35±0.1 1.50±0.1 1.45±0.1 4.0±0.1 0.22±0.05 WCM3216F2S 321620 3.50±0.1 1.88±0.1 2.10±0.1 4.0±0.1 0.22±0.05 WCM2012F2N 201209 2.50±0.1 1.60±0.1 1.25±0.1 4.0±0.1 0.22±0.05 WCM3216F2N 321615 3.50±0.1 1.88±0.1 1.80±0.1 4.0±0.1 0.22±0.05 Bo(mm) Ao(mm) Ko(mm) P(mm) SECTION A-A 8-3. Packaging Quantity Chip size Chip/Reel Inner Box Middle Box Carton WCM2012F2S/F2N 2000/3000 10000/15000 50000/75000 100000/150000 WCM3216F2S/F2N 2000 10000 50000 100000 8-4. Tearing Off Force F Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. 165° to180° Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice ‧Storage Conditions To maintain the solderability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 70% RH. 3. Recommended products should be used within 6 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw t(mm)