S606C-30

厂商：
T-GLOBAL
封装：
-
描述：
S606C-30

数据手册：

下载S606C-30.pdf

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数据手册
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S606C-30 数据手册

TG-S606C Thermal Compound Version 1.280318 Thermal Compound TG-S606C is a silicone based thermal grease that has been designed for high performance CPUs and similar applications. It has a thermal conductivity of 5 W/ mK, superior wetting characteristics, resulting in a very low thermal resistance and excellent long term reliability. Features Good thermal conductivity Easy to assemble High stability Does not harden with time Applications Electronic components: IC, CPU, MOS LED, M/B, P/S, Heat Sink LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc. DDR II Module, DVD Applications, Hand-set applications, etc. Properties REACH Compliant ROHS Compliant Property S606C Unit Test Method Colour Grey - Visual Thermal Conductivity 5 W/mK ASTM D5470 Weight Loss 10¹² Ohm-cm ASTM D257 Standard Packaging Size Packaging Weight (gr) Pot 30g Pot 50g Pot 1 kg Storage TG-S606C has a self-life of eighteen (18) months from the date of manufacture, as indicated by the lot number, when stored in the original, unopened contained at, or below 25˚C. T-Global Technology Limited 1 & 2 Cosford Business Park, Central Park, Lutterworth, Leicestershire LE17 4QU U.K. Tel: +44 (0)1455 553 510 Email: sales@tglobaltechnology.com Web: www.tglobaltechnology.com Skype: tglobal.technology VAT #: GB 116 662 714 NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own test to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated in T-Global Technology Europe and North America’s invoice, quotation, or order acknowledgment. We disclaim any and all liabilities incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.

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S606C-30

PDF文档中的物料型号为TG-S606C，是一种基于硅的导热膏，专为高性能CPU和类似应用设计。

它具有5 W/mK的热导率、优越的润湿特性，从而导致非常低的热阻和出色的长期可靠性。

器件简介： - 特点：良好的热导性、易于组装、高稳定性、随时间不硬化。

- 应用：电子元件（IC、CPU、MOS）、LED、主板、电源、散热器、LCD、电视、笔记本电脑、PC、电信设备、无线集线器等。

引脚分配和参数特性： - 颜色：灰色 - 热导率：5 W/mK - 重量损失：<0.5% - 密度：2.3 g/cm³ - 工作温度范围：-40°C至180°C - 体积电阻率：>10²Ω-cm

功能详解和应用信息： - 符合REACH和RoHS标准，适用于多种电子设备。

封装信息： - 包装规格：30g罐装、50g罐装、1kg罐装。

存储条件： - TG-S606C自生产日期起有18个月的自寿命，需存放在原包装中，温度不超过25°C。

制造商信息： - T-Global Technology Limited，位于英国。

免责声明： - 信息基于最佳知识提供，但使用条件多样，建议用户自行测试产品适用性。