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HL-PC-2012H392BC-L

HL-PC-2012H392BC-L

  • 厂商:

    HONGLITRONIC(鸿利光电)

  • 封装:

    0805

  • 描述:

    HL-PC-2012H392BC-L

  • 数据手册
  • 价格&库存
HL-PC-2012H392BC-L 数据手册
Under Development Mass production RoHS Specification 规 格 书 Customer Name: 客户名称: Customer P/N: 客户品号: Factory P/N: HL-PC-2012H392BC-L 公司品号: Sending Date: 送样日期: Client approval Hongli approval 客户审核 鸿利智汇审核 Approval Audit Approval Audit Confirmation 核准 确认 核准 确认 制作 揭秒业 □ Qualified 接受 □ Disqualified 不接受 DATE: 日期: Adr:No.1,Xianke Yi Road,Huadong Town,Huadu District,Guangzhou,China 地址:中国广州市花都区花东镇先科一路1号 Tel/电话:020-37705135 Fax/传真:020-37705136 Web/网址:www.honglitronic.com 注:1.此规格书以中英文方式书写,若有冲突以中文版本为准文本. 2.此规格书的最终解释权归鸿利智汇集团股份有限公司 3.此规格书的有效期限为两年,自盖章或签字之日起计算,期满时双方可以续签协议,但应采用书面形式 SPEC NO:B-12-A-1699 REV NO: A/6 DATE: AUG/10/2017 PAGE: 1 OF 7 ● Under Development Mass production HL-PC-2012H392BC-L Features( 特征) Extremely wide viewing angle.(宽的发光角度) Suitable for all SMT assembly and solder process.(适用于所有的SMT组装和焊接工艺) Available on tape and reel.(适用于载带及卷轴) Moisture sensitivity level: Level 4.(防潮等级 Level 4) Package:4000pcs/reel..(包装每卷4000PCS) RoHS compliant. (RoHS 认证) Description(描述) ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES The Blue source color devices are made with InGaN on Substrate Light Emitting Diode 蓝光LED由InGaN三种元素芯片激发而成 注意:操作时应注意静电敏感 释放设备装置 Applications(应用) ■ Optical indicator(光学指示) Package Dimensions(封装尺寸) ■ Indoor display(室内显示) ■ Backlight for LCD, switch and Symbol, display (LCD背光、转换器,开关和标志,显示器等) ■ General use(一般应用) Recommended Soldering Pattern (建议焊盘尺寸图) 3.00 [0.12] 1.20 [0.05] 0.90 [0.04] Notes:(备注) 1. Mark the size of the unit is mm.marked in brackets(标注尺寸单位为毫米,括号内标注为英寸) 2. All dimensions allow tolerance ±0.1mm(所有尺寸允许公差±0.1mm ) SPEC NO:B-12-A-1699 REV NO: A/6 DATE: AUG/10/2017 PAGE: 2 OF 7 ● Under Development Mass production HL-PC-2012H392BC-L Selection Guide(选择指南) HL-PC-2012H392BC-L Lens Type 胶体类型 Dice Part No. 型号 Luminous intensity(mcd) 光强@ 10mA Blue (InGaN ) Viewing Angle 角度 Min Typ 2θ1/2 -- 110 140° Water Clear Note:(备注) The 2θ1/2 measurement error ±10 degrees( 角度测试误差为±10° ) 2. the above luminous intensity measurement allowance tolerance ±10%. 上述发光强度的测试允许公差为±10% Electrical / Optical Characteristics at Ta=25°C 电性与光学特性 Parameter(参数) Symbol (符号) Min. (最小) Typ. (平均) Max. (最大) Units (单位) Test Conditions 测试条件 Forward Voltage 正向电压 VF 2.6 -- 3.4 V IF=10mA Dominate Wavelength 主波长 λd -- 469 -- nm IF=10mA Absolute Maximum Ratings at Ta=25°C 绝对最大额定值 Parameter(参数) Symbol(符号) Rating(值) Units(单位) Power Dissipation(功耗) Pd 68 mW Forward Current(正向电流) IF 20 mA Peak Forward Current [1](峰值正向电流) IFP 100 mA Operating Temperature(操作温度) Topr -40 ~ +85 ℃ Storage Temperature(保存温度) Tstg -40 ~ +100 ℃ Note:(备注) 1. 1/10 Duty cycle, 0.1ms pulse width.(脉宽0.1ms,周期1/10) 2. The above forward voltage measurement allowance tolerance is ± 0.1V.(以上所示电压测量误差±0.1V) SPEC NO:B-12-A-1699 REV NO: A/6 DATE: AUG/10/2017 PAGE: 3 OF 7 ● Under Development Mass production HL-PC-2012H392BC-L Typical optical characteristics curves 典型光学特性曲线 Ambient Temperature vs. Forward Current Forward Current VS. Relative Intensity 正向电流与相对光强特性曲线 环境温度与正向电流特性曲线 60 Forward Current(mA) 50 40 30 20 10 0 0 20 40 60 80 Ambient Temperature 100 Ta(℃) Forward Voltage VS. Forward Current Ambient Temperature VS. Relative Intensity 环境温度与相对光强特性曲线 正向电压与正向电流特性曲线 Relative Luminous Intensity 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 Ambient Temperature Relative spectral emission 60 80 Ta(℃) Radiation diagram 相对光谱分布特性曲线 辐射图特性曲线 Relative luminous intensity 1.0 0.8 0.6 0.4 0.2 0.0 380 460 540 620 700 780 Wavelength(nm) SPEC NO:B-12-A-1699 REV NO: A/6 DATE: AUG/10/2017 PAGE: 4 OF 7 ● Under Development Mass production HL-PC-2012H392BC-L Reliability Test Items And Conditions 信赖性测试项目及条件 Test Items 项目 Ref.Standard 参考标准 Test Condition 测试条件 Time 时间 Quantity 数量 Ac/Re 接收/拒收 Reflow 回流焊 JESD22-B106 Temp:260℃max T=10 sec 3 times. 22Pcs. 0/1 Temperature Cycle 温度循环 JESD22-A104 100℃±5℃ 30 min. ↑↓5 min -40℃±5℃ 30 min. 100 Cycles 22Pcs. 0/1 High Temperature Storage 高温保存 JESD22-A103 Temp:100℃±5℃ 1000Hrs. 22Pcs. 0/1 Low Temperature Storage 低温保存 JESD22-A119 Temp:-40℃±5℃ 1000Hrs. 22Pcs. 0/1 Life Test 常温通电 JESD22-A108 Ta=25℃±5℃ IF=10mA 1000Hrs. 22Pcs. 0/1 High Temperature High Humidity 高温高湿保存 JESD22-A101 85℃±5℃/ 85%RH 1000Hrs. 22Pcs. 0/1 Criteria For Judging Damage 失效判定标准 Test Items 项目 Symbol 符号 Test Condition 测试条件 Criteria For Judgement 判定标准 Min. 最小 Max. 最大 Forward Voltage 正向电压 VF IF=10mA -- U.S.L*)x1.1 Luminous Flux 光通量 lm IF=10mA L.S.L*)x0.7 -- U.S.L: Upper standard level 规格上限 L.S.L: Lower standard level 规格下限 *The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 数据工作表中所示的技术信息仅限于典型特征和电路实例引用的产品.它既不构成工业特性的保证,也不构成任何许 可的授权 SPEC NO:B-12-A-1699 REV NO: A/6 DATE: AUG/10/2017 PAGE: 5 OF 7 ● Under Development Mass production HL-PC-2012H392BC-L SMT Reflow Soldering Instructions SMT回流焊说明 1.Reflow soldering should not be done more than two times. 回流焊不可以做两次以上 2.When soldering , do not put stress on the LEDs during heating 当焊接时,不要在材料受热时用力压胶体表面 Soldering iron 烙铁焊接 1.When hand soldering, keep the temperature of iron below less 300℃ less than 3 seconds 当手工焊接时,烙铁的温度必须小于300℃,时间不可超过3秒 2.The hand solder should be done only one times 手工焊接只可焊接一次 Repairing 修补 Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed in advance whether the characteristics of LEDs will or will not be damaged by repairing. LED回流焊后不应该修复,当修复是不可避免时,必须使用双头烙铁(如下 图),但必须事先确认此种方式会或不会损坏LED本身的特性。 Cautions 注意事项 The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle, the pressure on the silicone resin should be proper. LED封装为硅胶,故LED胶体表面较软,用力按压胶体表面会影响LED可靠性,因此应有预防措施避免在封装的零件上的 强大压力,当使用吸嘴时,胶体表面的压力应是恰当的。 3.Do not stack together assembled PCBs containing LEDs. Impact may scratch the silicone lens or damage the internal circuitry 4.Not suitable to operate in acidic environment, PH
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