CWS0905H-250T-S

Sunlord Specifications for Common Mode Chokes Page 1 of 8 S P E C I F I C AT I O N S Customer Product Name Common Mode Chokes Sunlord Part Number CWS0905H-Series Customer Part Number [ New Released, Revised] SPEC No.: CWS210012 Rev. Effective Date Changed Contents Change reasons Approved By 01 Mar.16, 2021 New release / Simei Yu 【This SPEC is total 8 pages including specifications and appendix.】 【ROHS Compliant Parts】 Approved By Checked By Issued By Shenzhen Sunlord Electronics Co., Ltd. Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110 Tel: 0086-755-29832333 Fax: 0086-755-82269029 E-Mail: sunlord@sunlordinc.com 【For Customer approval Only】 Qualification Status: Full Approved By Comments: Verified By Restricted Date: Rejected Re-checked By Checked By Sunlord Specifications for Common Mode Chokes Page 2 of 8 1. Scope This specification applies to CWS0905H-SERIES Common Mode Chokes 2. Product Description and Identification (Part Number) 1) Description Common Mode Chokes, CWS0905H-102T, 1000±50% uH@100KHz, 5mV, 0.31Ω, 800mA 2) Product Identification (Part Number) CWS 0905 H -102 T ① ② ③ ④ ⑤ ①Type ②External Dimensions (mm) CWS Common Mode Chokes 0905 ④Inductance [uH] ③Configuration H Max.operating temperature Example Example 102 1000 ⑤Packing Tape Package T 3. Electrical Characteristics Please refer to Appendix A（Page 6） 1) Operating temperature (Including self-generated heat): -40℃~+125℃ 2) Storage temperature and humidity range (product with packing ): 0℃~+40℃, RH 70% Max. 4. Shape and Dimensions 1.Dimensions and recommended PCB pattern for reflow soldering: PAD Layout b XXX a d c Symbol A B C D E F a b c d CWS0905H 9.20±0.3 6.00±0.3 5.00±0.3 2.54±0.3 1.00Ref 5.70Ref 1.20 2.00 7.50 2.54 Marking: " ˙XXX "。 2. Material List Symbol a b c d e Components Core Wire Base Adhesive Terminal Material Ferrite core Enamelled copper wire Plastic Epoxy resin Sn/Ag/Cu Sunlord 5. Specifications for Common Mode Chokes Page 3 of 8 Test and Measurement Procedures 5.1 Test Conditions 5.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65±20% c. Air Pressure: 86 KPa to 106 KPa 5.1.2 If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2℃ b. Relative Humidity: 65±5% c. Air Pressure: 86KPa to 106 KPa 5.2 Visual Examination a. Inspection Equipment: 20 X magnifier 5.3 Electrical Test 5.3.1 DC Resistance (DCR) a. Refer to Appendix A. b. Test equipment (Analyzer): HIOKI3540 or equivalent. 5.3.2 Rated Current a. Refer to Appendix A. b. Test equipment: Agilent E3633A, NF ZM2355, R2M-2H3 or equivalent.. c. DC current (A) that will cause an approximate ΔT of 40 °C(reference ambient temperature is 25 °C) 5.4 Reliability Test Item 5.4.1 Terminal Strength Requirements No removal or split of the termination or other defects shall occur. Test Methods and Remarks ① ② ③ ④ 5.4.2 Resistance to Flexure ① No visible mechanical damage. ② Impedance change: within ±30%. The test samples shall be soldered to the board by the reflow. Then apply force to X and Y directions. Applied force: 5N . Keep time: 5s Speed: 1.0 mm/s. d. e. f. g. The test samples shall be soldered to the board by the reflow. Then apply force in the direction of the arrow. Flexure: 2mm Pressurizing Speed: 0.5mm/sec. Keep time: ≧5 sec. 20 10 R10 Board Flexure 45±2mm 45±2mm Test Sample 5.4.3 Vibration ① ② No visible mechanical damage. Impedance change: within ±30%. ① The test samples shall be soldered to the board by the reflow. Then it shall be submitted to below test conditions. Fre. Range 10~55Hz Total 1.5mm(May not exceed 2 Amplitude acceleration 196 m/s ) Sweeping 10Hz to 55Hz to 10Hz for 1 min. Method Time For 2 hours on each X,Y,Z axis. ② Recovery: At least 2 hours of recovery under the standard condition after the test, followed by the measurement within 24 hours. Sunlord Specifications for Common Mode Chokes 95% or more of mounting terminal side ① shall be covered with fresh solder. ② ③ ④ 5.4.4 Solderability ⑤ 5.4.5 Resistance Soldering Heat i. toii. No visible mechanical damage. ① Impedance change : within ± 30%. ② ③ 5.4.6 Thermal Shock ① ② Page 4 of 8 The test samples shall be dipped in flux, and the immersed in molten solder. Solder Temperature: 240±5℃ Keep time: 3±0.5s Immersion depth: all sides of mounting terminal shall by immersed. Flux: 25% Rosin and 75% ethanol in weight. The test sample shall be exposed to reflow oven as below. 230±5℃ 40s Peak tem. at 260±5℃ 5s Reflow time: 2times. Recovery: At least 2 hours of recovery under the standard condition after the test , followed by the measurement within 24 hours. No visible mechanical damage. ① The test samples shall be soldered to the board by Impedance change : within ± 30%. the reflow. Then it shall be placed at specified temperature for specified time by step 1 to step 4 as shown in below table in sequence. Step Temperature(℃) Duration(min) 1 -25 30±3 2 Room temperature Within 3 3 +85 30±3 4 Room temperature Within 3 ② ③ 5.4.7 Damp heat ① ② Item 5.4.8 Loading Number of cycle: 100cycles. Recovery: At least 2 hours of recovery under the standard condition after the test , followed by the measurement within 24 hours. No visible mechanical damage. ① The test samples shall be soldered to the board by Impedance change : within ± 30% the reflow. Then it shall be submitted to below test conditions. Temperature 60±2℃ Humidity 90~95%RH Time 96hour ② Recovery: At least 2 hours of recovery under the standard condition after the test , followed by the measurement within 24 hours. Requirements ① Under ② Damp Heat 5.4.9 ① Resistance to Low ② Temperature No visible mechanical damage. Impedance change : within ± 30% Test Methods and Remarks ① The test samples shall be soldered to the board by the reflow. Then it shall be submitted to below test conditions. Temperature 60±2℃ Humidity 90~95%RH Applied current Rated current Time 96hour ② Recovery: At least 2 hours of recovery under the standard condition after the test , followed by the measurement within 24 hours. No visible mechanical damage. ① The test samples shall be soldered to the board by Impedance change : within ± 30% the reflow. Then it shall be submitted to below test conditions. Temperature -25±3℃ Time 96hour ② Recovery: At least 2 hours of recovery under the standard condition after the test , followed by the measurement within 24 hours. Sunlord Specifications for Common Mode Chokes 5.4.10 ① Resistance to High ② Temperature 5.4.11 ① Loading at ② High Temperature (Life Test) Packaging 6.1 Tape Carrier Packaging: Packaging code: T (1) Tape carrier packaging are specified in attached figure Fig.6.1-1~2 (2) Tape carrier packaging quantity: a. Reel Drawings (Unit: mm) Fig.6.1-1 c. Taping Dimensions (Unit: mm) P2 P0 P D0 F E B0 652 652 652 652 W 6. Page 5 of 8 No visible mechanical damage. ① The test samples shall be submitted to below test Impedance change : within ± 30%. conditions. Temperature 85±3℃ Time 96hour ② Recovery: At least 2 hours of recovery under the standard condition after the test , followed by the measurement within 24 hours. No visible mechanical damage. ① The test samples shall be soldered to the board by Impedance change : within ± 30%. the reflow. Then it shall be submitted to below test conditions. Temperature 85±3℃ Applied current Rated current Time 96hour ② Recovery: At least 2 hours of recovery under the standard condition after the test , followed by the measurement within 24 hours. A0 D1 K0 Tape dimensions (mm) Type CWS0905H W P P0 P2 D0 D1 E F A0 B0 K0 16 12 4.0 2.0 1.5 1.5 1.75 7.5 6.3 9.6 5.3 Sunlord Specifications for Common Mode Chokes Page 6 of 8 Fig.6.1-2 Standard Quantity Type CWS0905H Reel(Pcs) Middle Carton(Pcs) Big Carton(Pcs) 1000 3000 15000 c. Peeling off force: 10gf to 130gf in the direction show below. Top tape or cover tape 1650~ 1800 Fig. 6.1-3 Base tape 7. 8. Recommended Soldering Technologies 7.1 Re-flowing Profile: △ 1~2 ℃/sec. Ramp △ Pre-heating: 150~190℃/90±30 sec. △ Time above 240℃: 20~40sec △ Peak temperature: 260℃ Max./5sec; △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.2 times for Re-flowing Max: 260℃ 260℃ 240℃ 200℃ 20~40sec. 190℃ 150℃ Gradual Cooling 90±30sec. Supplier Information a) Supplier: Shenzhen Sunlord Electronics Co., Ltd. b) Manufacturer: Shenzhen Sunlord Electronics Co., Ltd. c) Manufacturing Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China Zip: 518110 Appendix A: Electrical Characteristics(@ 25℃) Inductance Test Condition Part Number Inductance Units uH Symbol L - 10±30% 10±30% 25±30% 25±30% 40±30% 40±30% 51±30% 51±30% 250±50% 500±50% 1000±50% 2000±50% 4700±50% 6500±50% 10000±50% 20000±50% 1KHz, 100mV 1KHz, 100mV 1KHz, 100mV 1KHz, 100mV 1KHz, 100mV 1KHz, 100mV 1KHz, 100mV 1KHz, 100mV 100KHz, 5mV 100KHz, 5mV 100KHz, 5mV 100KHz, 5mV 100KHz, 5mV 10KHz, 50mV 10KHz, 50mV 10KHz, 50mV Test Condition CWS0905H-100T CWS0905H-100T-S CWS0905H-250T CWS0905H-250T-S CWS0905H-400T CWS0905H-400T-S CWS0905H-510T CWS0905H-510T-S CWS0905H-251T CWS0905H-501T CWS0905H-102T CWS0905H-202T CWS0905H-472T CWS0905H-652T CWS0905H-103T CWS0905H-203T Note: "S" is divided winding, and others are parallel winding. Rated Current：∆T≦40℃Typ DCR Max Rated Current Max Leakage Inductance Typ Ω mA nH Maximum Impedance Typ. Ω Zcom 0.08 0.08 0.12 0.12 0.25 0.25 0.16 0.16 0.13 0.15 0.31 0.42 0.75 0.95 1.20 2.60 1600 1600 1000 1000 900 900 1000 1000 1200 1000 800 600 500 400 350 200 1MHz, 1mA 55 850 60 1500 80 2250 85 3150 60 75 90 130 180 280 320 490 920 920 2800 2800 3100 3100 5500 5500 1800 3300 6000 9200 20000 18400 25000 50000 Sunlord Curve: Specifications for Common Mode Chokes Page 7 of 8 Sunlord Specifications for Common Mode Chokes Page 8 of 8