SMD1812P300SLR/24

Product: SMD1812P300SLR/24 Revision: Preliminary 0.4 Date: November 01, 2018 Page: 1 of 5 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan Polymeric PTC Resistor TEL: +886-3-5643931 FAX: +886-3-5644624 ġ Device Specification (Preliminary) ELECTRICAL CHARACTERISTICS Part Number SMD1812P300SLR/24 Ihold (A) 3.00 Itrip (A) 6.00 Vmax (Vdc) 24 Imax (A) 50 Pd typ (W) 2.00 Maximum Time To Trip Current Time (A) (Sec.) 15.00 2.00 Resistance Rmin () 0.001 R1max () 0.030 Note: Ihold = Hold current: maximum current device will pass without tripping in 23°C still air. Itrip = Trip current: minimum current at which the device will trip in 23°C still air. Vmax = Maximum voltage device can withstand without damage at rated current (I max) Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) Pd typ = Typical power dissipated from device when in the tripped state at 23°C still air. Rmin = Minimum resistance of device in initial (un-soldered) state. R1max = Maximum resistance of device at 23°C measured one hour after tripping or reflow soldering of 260°C for 20 sec. *Value specified were determined using the PWB with 0.030”*1.5oz copper traces. *Customer should verify the device performance in their specified conditions. Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. Recognitions: Pending Marking Figure Recommended Pad Layout (mm) A C Polytronics / Polystar Logo P- Part Identification Marking 3.45 B D E 1.78 3.15 1.78 Note: Polystar is Polytronics’s manufacturing site in China. The Polystar ID marking shall appear on smallest package. PHYSICAL DIMENSIONS (mm) Part Number SMD1812P300SLR/24 A Min. 4.37 B Max. 4.73 Min. 3.07 C Max. 3.41 ˖Specifications are subject to change without notice. Min. 1.50 D Max. 2.50 Min. 0.30 E Max. 1.20 Min. 0.15 Max. 0.65 Thermal Derating Curve 200 PercentageofRatedCurrent 150 100 50 0 40 0 40 80 120 Device'sAmbientTemperature(oC) Thermal Derating Chart Recommended Hold Current (A) at Ambient Temperature (ºC) Ambient Operation Temperature Part Number -40 ºC -20 ºC 0 ºC 23 ºC 40 ºC 50 ºC 60 ºC 70 ºC 85 ºC 4.95 4.35 3.75 3.00 2.45 2.15 1.85 1.55 1.05 SMD1812P300SLR/24 Average Time-Current Curve 10.00 TimetoTrip(Sec.) 1.00 0.10 0.01 1 10 100 FaultCurrent(Amp.)  㖗䫠ⷩ䦸⭟ⷌ㥔⛹⌧ⷌ㥔㝘⛂巖 24-1 噆 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 http://www.pttc.com.tw Page: 2 of 5 2018/11/01 Revision: Preliminary 0.4 Soldering Parameters Profile Feature Average Ramp-Up Rate (Tsmax to TP) Preheat -Temperature Min (Tsmin) -Temperature Max (Tsmax) -Time (Tsmin to Tsmax) Time maintained above: -Temperature (TL) -Time (tL) Peak Temperature (TP) Time within 5ºC of actual Peak Temperature (tP) Ramp-Down Rate Time 25ºC to Peak Temperature Storage Condition Pb-Free Assembly 3ºC/second max. 150ºC 200ºC 60-180 seconds 217ºC 60-150 seconds 260ºC 20-40 seconds 6 ºC /second max. 8 minutes max. 0ºC ~35ºC, ʀ70%RH y Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free y Recommended maximum paste thickness is 0.25mm (0.010 inch) y Devices can be cleaned using standard industry methods and solvents. Note 1: All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Environmental Specifications Operating Temperature -40ºC to +85 ºC Maximum Device Surface Temperature in Tripped State 125ºC Moisture Sesitivity Level Level 1, J-STD-020C  㖗䫠ⷩ䦸⭟ⷌ㥔⛹⌧ⷌ㥔㝘⛂巖 24-1 噆 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 http://www.pttc.com.tw Page: 3 of 5 2018/11/01 Revision: Preliminary 0.4 Packaging Quantity and Marking Recommended Pad Layout (mm.) 3.45 3.15 1.78 1.78 Part Number Marking Quantity SMD1812P300SLR/24 J30 800 ˖ 12 mm tape on 7 inch reel per EIA-481 (equivalent to IEC286, part 3) Physical Specifications Terminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) Lead Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3. Part Number System SMD 1812 P  SLR /  Special Voltage Rating (Optional) Super Low Resistance Holding Current Rating Polytronics Symbol Device Dimensions: Length/Width (Unit: 1/100 inch) Surface Mount Device  㖗䫠ⷩ䦸⭟ⷌ㥔⛹⌧ⷌ㥔㝘⛂巖 24-1 噆 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 http://www.pttc.com.tw Page: 4 of 5 2018/11/01 Revision: Preliminary 0.4 Tape Specifications: EIA-481 (mm.) W F E1 D0 D1 P0 P1 P2 A0 B0 T K0 Reel Dimensions: EIA-481 (mm.) 12.00 ± 0.30 C D H W 5.50 ± 0.05 1.75 ± 0.10 1.50 + 0.10 / - 0 Ø178.0 ± 1.0 Ø60.2 ± 0.5 16.0 ± 0.5 13.2 ± 1.5 1.50 + 0.10 / - 0 4.00 ± 0.10 8.00 ± 0.10 2.00 ± 0.05 3.55 ± 0.10 4.88 ± 0.10 0.30 ± 0.05 2.45 ± 0.10 Leader min. 390 Trailer min. 160 „ Mechanical Stress y PPTC devices will undergo a thermal expansion during fault condition. If PPTC devices are installed or placed in an application where the space between PPTC devices and the surrounding materials (e.g., covering materials, packaging materials, encapsulate materials and the like) is insufficient, it will cause an inhibiting effect upon the thermal expansion. Pressing, twisting, bending and other kinds of mechanical stress will also adversely affect the performance of the PPTC devices, and shall not be used or applied. „ Chemical Pollutants y Silicone-based oils, oils, solvents, gels, electrolytes, fuels, acids, and the like will adversely affect the properties of PPTC devices, and shall not be used or applied. „ Electronic and Thermal Effect y PPTC devices are secondary protection devices and are used solely for sporadic, accidental over-current or over-temperature error condition, and shall NOT be used if or when constant or repeated fault conditions (such fault conditions may be caused by, among others, incorrect pin-connection of a connector) or over-extensive trip events may occur. y PTTC devices are different from fuses and, when a fault condition occurs, will go into high-resistance state and do not open circuit, in which case the voltage at such PPTC devices may reach a hazardous level. y Operation over the maximum rating or other forms of improper use may cause failure, arcing, flame and/or other damage to the PPTC devices. y Conductive material contamination, such as metal particle, may induce shortage, flame or arcing. y Due to the inductance, the operation circuits may generate a circuit voltage (Ldi/dt) above the rated voltage of PPTC devices, which shall not be used under such circumstances. „ General y Customers shall evaluate and test the properties of PPTC devices independently to verify and ensure that their individual applications will be met. y The performance of PPTC devices will be adversely affected if they are improperly used under electronic, thermal and/or mechanical procedures and/or conditions non-conformant to those recommended by manufacturer. y Customers shall be responsible for determining whether it is necessary to have back-up, failsafe and/or fool-proof protection to avoid or minimize damage that may result from extra-ordinary, irregular function or failure of PPTC devices. y Any and all responsibilities and liabilities are disclaimed if any item under this notice of warning is not complied with. y Polytronics shall not be liable for any claims or damages arising out of products used in automotive applications, unless otherwise agreed by Polytronics.  㖗䫠ⷩ䦸⭟ⷌ㥔⛹⌧ⷌ㥔㝘⛂巖 24-1 噆 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 http://www.pttc.com.tw Page: 5 of 5 2018/11/01 Revision: Preliminary 0.4