TXB0104
www.ti.com
SCES650F – APRIL 2006 – REVISED MAY 2012
4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
WITH AUTOMATIC DIRECTION SENSING AND ±15-kV ESD PROTECTION
Check for Samples: TXB0104
FEATURES
1
•
2
•
•
•
•
•
1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on
B Port (VCCA ≤ VCCB)
VCC Isolation Feature – If Either VCC Input Is at
GND, All Outputs Are in the High-Impedance
State
OE Input Circuit Referenced to VCCA
Low Power Consumption, 5-μA Max ICC
Ioff Supports Partial-Power-Down Mode
Operation
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– A Port
– 2500-V Human-Body Model (A114-B)
– 1500-V Charged-Device Model (C101)
– B Port
– ±15-kV Human-Body Model (A114-B)
– 1500-V Charged-Device Model (C101)
TERMINAL ASSIGNMENTS
(GXU/ZXU Package)
GXU/ZXU PACKAGE
(TOP VIEW)
A
B
C
4
A4
GND
B4
4
3
A3
OE
B3
3
2
A2
VCCA
B2
2
1
A1
VCCB
B1
A
B C
1
A1
2
13
B1
A2
3
12
B2
A3
4
11
B3
A4
5
10
B4
NC
GND
6
9
7
8
NC
OE
A1
A2
A3
A4
NC
1
14
OE
VCCB
RUT PACKAGE
(TOP VIEW)
VCCA
13 B1
2
3
Exposed
Center
Pad
4
5
6
12 B2
11 B3
10 B4
9 NC
7
8
1
12
11 VCCB
A1 2
10 B1
A2 3
9 B2
A3 4
8 B3
A4 5
6
7 B4
GND
14
OE
1
GND
VCCA
VCCB
D OR PW PACKAGE
(TOP VIEW)
VCCA
RGY PACKAGE
(TOP VIEW)
A.
N.C. − No internal connection
B.
For RGY, if the exposed center pad is used, it must only be connected as a secondary ground or left electrically open.
C.
Pull up resistors are not required on both sides for Logic I/O.
D.
If pull up or pull down resistors are needed, the resistor value must be over 50 kΩ.
E.
50 kΩ is a safe recommended value, if the customer can accept higher Vol or lower Voh, smaller pull up or pull down
resistor is allowed, the draft estimation is Vol = Vccout × 4.5k/(4.5k + Rpu) and Voh = Vccout × Rdw/(4.5k + Rdw).
F.
If pull up resistors are needed, please refer to the TXS0104 or contact TI.
G.
For detailed information, please refer to application note SCEA043.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2012, Texas Instruments Incorporated
TXB0104
SCES650F – APRIL 2006 – REVISED MAY 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
YZT PACKAGE
(TOP VIEW)
TERMINAL ASSIGNMENTS
(YZT Package)
3
2
1
D
A4
GND
B4
C
A3
OE
B3
B
A2
VCCA
B2
A
A1
VCCB
B1
3 2 1
D
C
B
A
DESCRIPTION/ORDERING INFORMATION
This 4-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB
accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation
between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the
high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor;
the minimum value of the resistor is determined by the current-sourcing capability of the driver.
The TXB0104 is designed so that the OE input circuit is supplied by VCCA.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 85°C
ORDERABLE PART NUMBER
NanoFree™ — WCSP (DSBGA)
0.23-mm Large Bump – YZT
(Pb-free) 0.625-mm max height
Reel of 3000
TXB0104YZTR
___2K_
UFBGA – GXU
Reel of 2500
TXB0104GXUR
YE04
UFBGA – ZXU (Pb-Free)
Reel of 2500
TXB0104ZXUR
YE04
QFN – RGY
Reel of 1000
uQFN – RUT
Reel of 3000
Tube of 50
SOIC – D
Reel of 2500
TSSOP – PW
(1)
(2)
(3)
2
TOP-SIDE MARKING (3)
Reel of 2000
TXB0104RGYR
TXB0104RGYRG4
TXB0104RUTR
YE04
2KR
TXB0104D
TXB0104DG4
TXB0104DR
TXB0104
TXB0104DRG4
TXB0104PWR
TXB0104PWRG4
YE04
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
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TXB0104
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SCES650F – APRIL 2006 – REVISED MAY 2012
PIN DESCRIPTION
PIN NO.
BALL NO.
NAME
FUNCTION
D, PW,
OR RGY
RUT
GXU/
ZXU
YZT
1
1
B2
B2
VCCA
2
2
A1
A3
A1
Input/output 1. Referenced to VCCA.
3
3
A2
B3
A2
Input/output 2. Referenced to VCCA.
4
4
A3
C3
A3
Input/output 3. Referenced to VCCA.
5
5
A4
D3
A4
Input/output 4. Referenced to VCCA.
6
–
–
–
NC
No connection. Not internally connected.
7
6
B4
D2
GND
8
12
B3
C2
OE
3-state output-mode enable. Pull OE low to place all outputs in 3-state mode.
Referenced to VCCA.
A-port supply voltage 1.2 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB.
Ground
9
–
–
–
NC
No connection. Not internally connected.
10
7
C4
D1
B4
Input/output 4. Referenced to VCCB.
11
8
C3
C1
B3
Input/output 3. Referenced to VCCB.
12
9
C2
B1
B2
Input/output 2. Referenced to VCCB.
13
10
C1
A1
B1
Input/output 1. Referenced to VCCB.
14
11
B1
A2
VCCB
B-port supply voltage 1.65 V ≤ VCCB ≤ 5.5 V.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VCCA
VCCB
MIN
MAX
–0.5
4.6
–0.5
6.5
A port
–0.5
4.6
B port
–0.5
6.5
A port
–0.5
4.6
B port
-0.5
6.5
A port
–0.5
VCCA + 0.5
B port
–0.5
VCCB + 0.5
Supply voltage range
UNIT
V
VI
Input voltage range
VO
Voltage range applied to any output in the high-impedance or
power-off state
VO
Voltage range applied to any output in the high or low state (2)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
Continuous current through VCCA, VCCB, or GND
Tstg
(1)
(2)
Storage temperature range
–65
V
V
V
±50
mA
±100
mA
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The value of VCCA and VCCB are provided in the recommended operating conditions table.
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TXB0104
SCES650F – APRIL 2006 – REVISED MAY 2012
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THERMAL IMPEDANCE RATINGS
UNIT
D package (1)
θJA
(1)
(2)
Package thermal impedance
113
(2)
°C/W
47
RUT package
TBD
YZT package
90
(2)
VCCA
VCCB
VCCB
Supply voltage
MIN
MAX
1.2
3.6
1.65
5.5
Data inputs
1.2 V to 3.6 V
1.65 V to 5.5 V
VCCI × 0.65 (3)
VCCI
OE
1.2 V to 3.6 V
1.65 V to 5.5 V
VCCA × 0.65
5.5
Data inputs
1.2 V to 5.5 V
1.65 V to 5.5 V
0
VCCI × 0.35 (3)
OE
1.2 V to 3.6 V
1.65 V to 5.5 V
0
VCCA × 0.35
0
3.6
1.2 V to 3.6 V
1.65 V to 5.5 V
0
5.5
1.2 V to 3.6 V
1.65 V to 5.5 V
40
1.65 V to 3.6 V
40
4.5 V to 5.5 V
30
VIH
High-level input voltage
VIL
Low-level input voltage
VO
Voltage range applied to any A-port
output in the high-impedance
B-port
or power-off state
Δt/Δv
Input transition
rise or fall rate
A-port inputs
4
129
PW package (1)
The package thermal impedance is calculated in accordance with JESD 51-7.
The package thermal impedance is calculated in accordance with JESD 51-5.
VCCA
(1)
(2)
(3)
GXU/ZXU package (1)
RGY package
RECOMMENDED OPERATING CONDITIONS (1)
TA
86
B-port inputs
1.2 V to 3.6 V
Operating free-air temperature
–40
85
UNIT
V
V
V
V
ns/V
°C
The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND.
VCCA must be less than or equal to VCCB and must not exceed 3.6 V.
VCCI is the supply voltage associated with the input port.
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SCES650F – APRIL 2006 – REVISED MAY 2012
ELECTRICAL CHARACTERISTICS (1)
(2)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCCA
VCCB
1.2 V
IOH = –20 μA
VOLA
IOL = 20 μA
VOHB
IOH = –20 μA
1.65 V to 5.5 V
VOLB
IOL = 20 μA
1.65 V to 5.5 V
Ioff
IOZ
MIN
–40°C to 85°C
TYP MAX
MIN MAX
1.1
VOHA
II
TA = 25°C
1.4 V to 3.6 V
V
VCCA – 0.4
1.2 V
0.9
1.4 V to 3.6 V
0.4
VCCB – 0.4
V
V
μA
VI = VCCI or GND
1.2 V to 3.6 V
1.65 V to 5.5 V
±1
±2
A port
VI or VO = 0 to 3.6 V
0V
0 V to 5.5 V
±1
±2
B port
VI or VO = 0 to 5.5 V
0 V to 3.6 V
0V
±1
±2
A or B port
OE = GND
1.2 V to 3.6 V
1.65 V to 5.5 V
±1
±2
1.2 V
1.65 V to 5.5 V
1.4 V to 3.6 V
1.65 V to 5.5 V
5
3.6 V
0V
2
VI = VCCI or GND,
IO = 0
0V
5.5 V
1.65 V to 5.5 V
VI = VCCI or GND,
IO = 0
1.4 V to 3.6 V
1.65 V to 5.5 V
5
3.6 V
0V
–2
0V
5.5 V
ICCA + ICCB
VI = VCCI or GND,
IO = 0
1.2 V
1.65 V to 5.5 V
1.4 V to 3.6 V
1.65 V to 5.5 V
VI = VCCI or GND,
IO = 0,
OE = GND
1.2 V
1.65 V to 5.5 V
ICCZA
1.4 V to 3.6 V
1.65 V to 5.5 V
VI = VCCI or GND,
IO = 0,
OE = GND
1.2 V
1.65 V to 5.5 V
ICCZB
1.4 V to 3.6 V
1.65 V to 5.5 V
1.2 V to 3.6 V
1.65 V to 5.5 V
1.2 V to 3.6 V
1.65 V to 5.5 V
Ci
Cio
(1)
(2)
OE
A port
B port
μA
μA
0.06
1.2 V
ICCB
V
0.4
OE
ICCA
UNIT
μA
–2
3.4
μA
2
3.5
10
μA
0.05
5
μA
3.3
5
3
4
5
6
11
14
μA
pF
pF
VCCI is the supply voltage associated with the input port.
VCCO is the supply voltage associated with the output port.
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TXB0104
SCES650F – APRIL 2006 – REVISED MAY 2012
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TIMING REQUIREMENTS
TA = 25°C, VCCA = 1.2 V
Data rate
tw
Pulse duration
Data inputs
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
VCCB = 5 V
TYP
TYP
TYP
TYP
20
20
20
20
Mbps
50
50
50
50
ns
UNIT
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
MIN
Data rate
tw
Pulse duration
VCCB = 2.5 V
± 0.2 V
MAX
MIN
MAX
40
Data inputs
VCCB = 3.3 V
± 0.3 V
MIN
MAX
40
25
VCCB = 5 V
± 0.5 V
MIN
40
25
40
25
UNIT
MAX
25
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
MIN
Data rate
tw
Pulse duration
VCCB = 2.5 V
± 0.2 V
MAX
MIN
MAX
60
Data inputs
17
VCCB = 3.3 V
± 0.3 V
MIN
VCCB = 5 V
± 0.5 V
MAX
60
MIN
60
17
60
17
UNIT
MAX
17
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
MIN
Data rate
tw
Pulse duration
VCCB = 3.3 V
± 0.3 V
MAX
MIN
MAX
100
Data inputs
VCCB = 5 V
± 0.5 V
MIN
100
10
100
10
UNIT
MAX
10
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V
± 0.3 V
MIN
Data rate
tw
6
Pulse duration
VCCB = 5 V
± 0.5 V
MAX
MIN
100
Data inputs
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10
UNIT
MAX
100
10
Mbps
ns
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SCES650F – APRIL 2006 – REVISED MAY 2012
SWITCHING CHARACTERISTICS
TA = 25°C, VCCA = 1.2 V
FROM
(INPUT)
TO
(OUTPUT)
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
VCCB = 5 V
TYP
TYP
TYP
TYP
A
B
6.9
5.7
5.3
5.5
B
A
7.4
6.4
6
5.8
A
1
1
1
1
B
1
1
1
1
A
18
15
14
14
B
20
17
16
16
trA, tfA
A-port rise and fall times
4.2
4.2
4.2
4.2
ns
trB, tfB
B-port rise and fall times
2.1
1.5
1.2
1.1
ns
tSK(O)
Channel-to-channel skew
0.4
0.5
0.5
1.4
ns
20
20
20
20
Mbps
PARAMETER
tpd
ten
OE
tdis
OE
Max data rate
UNIT
ns
μs
ns
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
B
ten
OE
tdis
OE
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
B
1.4
12.9
1.2
10.1
1.1
10
0.8
9.9
A
0.9
14.2
0.7
12
0.4
11.7
0.3
13.7
A
1
1
1
1
B
1
1
1
1
ns
μs
A
5.9
31
5.7
25.9
5.6
23
5.7
22.4
B
5.4
30.3
4.9
22.8
4.8
20
4.9
19.5
A-port rise and fall times
1.4
5.1
1.4
5.1
1.4
5.1
1.4
5.1
ns
trB, tfB
B-port rise and fall times
0.9
4.5
0.6
3.2
0.5
2.8
0.4
2.7
ns
tSK(O)
Channel-to-channel skew
trA, tfA
Max data rate
0.5
0.5
40
40
0.5
40
0.5
40
ns
ns
Mbps
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
B
ten
OE
tdis
OE
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
B
1.6
11
1.4
7.7
1.3
6.8
1.2
6.5
A
1.5
12
1.3
8.4
1
7.6
0.9
7.1
A
1
1
1
1
B
1
1
1
1
A
5.9
31
5.1
21.3
5
19.3
5
17.4
B
5.4
30.3
4.4
20.8
4.2
17.9
4.3
16.3
ns
μs
ns
trA, tfA
A-port rise and fall times
1
4.2
1.1
4.1
1.1
4.1
1.1
4.1
ns
trB, tfB
B-port rise and fall times
0.9
3.8
0.6
3.2
0.5
2.8
0.4
2.7
ns
tSK(O)
Channel-to-channel skew
Max data rate
0.5
60
0.5
60
0.5
60
0.5
60
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ns
Mbps
7
TXB0104
SCES650F – APRIL 2006 – REVISED MAY 2012
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SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
B
ten
OE
tdis
OE
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
MIN
MAX
B
1.1
A
1.2
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
6.3
1
5.2
0.9
4.7
6.6
1.1
5.1
0.9
4.4
A
1
1
1
B
1
1
1
A
5.1
21.3
4.6
15.2
4.6
13.2
B
4.4
20.8
3.8
16
3.9
13.9
ns
μs
ns
trA, tfA
A-port rise and fall times
0.8
3
0.8
3
0.8
3
ns
trB, tfB
B-port rise and fall times
0.7
2.6
0.5
2.8
0.4
2.7
ns
tSK(O)
Channel-to-channel skew
0.5
ns
0.5
Max data rate
0.5
100
100
100
Mbps
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
B
ten
OE
tdis
OE
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
B
0.9
4.7
0.8
4
A
1
4.9
0.9
3.8
MAX
A
1
1
B
1
1
A
4.6
15.2
4.3
12.1
B
3.8
16
3.4
13.2
ns
μs
ns
trA, tfA
A-port rise and fall times
0.7
2.5
0.7
2.5
ns
trB, tfB
B-port rise and fall times
0.5
2.1
0.4
2.7
ns
tSK(O)
Channel-to-channel skew
Max data rate
8
VCCB = 3.3 V
± 0.3 V
0.5
100
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0.5
100
ns
Mbps
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SCES650F – APRIL 2006 – REVISED MAY 2012
OPERATING CHARACTERISTICS
TA = 25°C
VCCA
1.2 V
1.2 V
1.5 V
1.8 V
2.5 V
2.5 V
3.3 V
2.5 V
5V
3.3 V
to
5V
VCCB
PARAMETER
TEST CONDITIONS
5V
CpdA
CpdB
CpdA
CpdB
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
CL = 0, f = 10 MHz,
tr = tf = 1 ns,
OE = VCCA
(outputs enabled)
CL = 0, f = 10 MHz,
tr = tf = 1 ns,
OE = GND
(outputs disabled)
1.8 V
1.8 V
1.8 V
UNIT
TYP
TYP
TYP
TYP
TYP
TYP
TYP
7.8
10
9
8
8
8
9
12
11
11
11
11
11
11
38.1
28
28
28
29
29
29
25.4
19
18
18
19
21
22
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.03
0.01
0.01
0.01
0.01
0.01
0.01
0.04
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Product Folder Links: TXB0104
pF
pF
9
TXB0104
SCES650F – APRIL 2006 – REVISED MAY 2012
www.ti.com
PRINCIPLES OF OPERATION
Applications
The TXB0104 can be used in level-translation applications for interfacing devices or systems operating at
different interface voltages with one another.
Architecture
The TXB0104 architecture (see Figure 1) does not require a direction-control signal to control the direction of
data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0104 can maintain a high or low,
but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts
flowing the opposite direction.
The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns
on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly,
during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up
the high-to-low transition. The typical output impedance during output transition is 70 Ω at VCCO = 1.2 V to 1.8 V,
50 Ω at VCCO = 1.8 V to 3.3 V, and 40 Ω at VCCO = 3.3 V to 5 V.
VCCA
VCCB
One
Shot
T1
4k
One
Shot
T2
A
B
One
Shot
T3
4k
T4
One
Shot
Figure 1. Architecture of TXB0104 I/O Cell
Input Driver Requirements
Typical IIN vs VIN characteristics of the TXB0104 are shown in Figure 2. For proper operation, the device driving
the data I/Os of the TXB0104 must have drive strength of at least ±2 mA.
10
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TXB0104
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SCES650F – APRIL 2006 – REVISED MAY 2012
IIN
VT/4 kW
VIN
–(VD – VT)/4 kW
A. VT is the input threshold voltage of the TXB0104 (typically VCCI/2).
B. VD is the supply voltage of the external driver.
Figure 2. Typical IIN vs VIN Curve
Power Up
During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not
damage the device, so any power supply can be ramped up first. The TXB0104 has circuitry that disables all
output ports when either VCC is switched off (VCCA/B = 0 V).
Enable and Disable
The TXB0104 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the
high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the
outputs acutally get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the
one-shot circuitry to become operational after OE is taken high.
Pullup or Pulldown Resistors on I/O Lines
The TXB0104 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0104 have low
dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be
kept higher than 50 kΩ to ensure that they do not contend with the output drivers of the TXB0104.
For the same reason, the TXB0104 should not be used in applications such as I2C or 1-Wire where an opendrain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI TXS01xx
series of level translators.
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Product Folder Links: TXB0104
11
TXB0104
SCES650F – APRIL 2006 – REVISED MAY 2012
www.ti.com
PARAMETER MEASUREMENT INFORMATION
2 × VCCO
From Output
Under Test
50 kW
From Output
Under Test
15 pF
15 pF
1 MW
Open
50 kW
TEST
tPZL/tPLZ
tPHZ/tPZH
LOAD CIRCUIT FOR
ENABLE/DISABLE
TIME MEASUREMENT
LOAD CIRCUIT FOR MAX DATA RATE,
PULSE DURATION PROPAGATION
DELAY OUTPUT RISE AND FALL TIME
MEASUREMENT
S1
S1
2 × VCCO
Open
VCCI
Input
VCCI/2
VCCI/2
0V
tPLH
tPHL
tw
Output
VCCO/2
0.9 y VCCO
0.1 y VCCO
VOH
tf
tr
VCCI
VCCO/2
VOL
Input
VCCI/2
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
A.
B.
C.
D.
E.
F.
G.
VCCI/2
CL includes probe and jig capacitance.
All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
The outputs are measured one at a time, with one transition per measurement.
tPLH and tPHL are the same as tpd.
VCCI is the VCC associated with the input port.
VCCO is the VCC associated with the output port.
All parameters and waveforms are not applicable to all devices.
Figure 3. Load Circuits and Voltage Waveforms
12
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TXB0104
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SCES650F – APRIL 2006 – REVISED MAY 2012
REVISION HISTORY
Changes from Revision E (February 2010) to Revision F
•
Page
Added notes to pin out graphics. .......................................................................................................................................... 1
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Product Folder Links: TXB0104
13
PACKAGE OPTION ADDENDUM
www.ti.com
26-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TXB0104D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TXB0104
TXB0104DG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TXB0104
TXB0104DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TXB0104
TXB0104DRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TXB0104
TXB0104GXUR
ACTIVE
BGA
MICROSTAR
JUNIOR
GXU
12
2500
TBD
SNPB
Level-1-240C-UNLIM
-40 to 85
YE04
TXB0104PWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
YE04
TXB0104PWRG4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
YE04
TXB0104RGYR
ACTIVE
VQFN
RGY
14
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
YE04
TXB0104RGYRG4
ACTIVE
VQFN
RGY
14
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
YE04
TXB0104RUTR
ACTIVE
UQFN
RUT
12
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
2KR
TXB0104YZTR
ACTIVE
DSBGA
YZT
12
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
(2K ~ 2K7)
TXB0104ZXUR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZXU
12
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
YE04
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-Oct-2013
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TXB0104 :
• Automotive: TXB0104-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Nov-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TXB0104DR
Package Package Pins
Type Drawing
SOIC
TXB0104GXUR
BGA MI
CROSTA
R JUNI
OR
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
GXU
12
2500
330.0
8.4
2.3
2.8
1.0
4.0
8.0
Q2
TXB0104PWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
TXB0104RGYR
VQFN
RGY
14
3000
330.0
12.4
3.75
3.75
1.15
8.0
12.0
Q1
TXB0104RUTR
UQFN
RUT
12
3000
180.0
8.4
1.95
2.3
0.75
4.0
8.0
Q1
TXB0104YZTR
DSBGA
YZT
12
3000
180.0
8.4
1.49
1.99
0.75
4.0
8.0
Q2
TXB0104ZXUR
BGA MI
CROSTA
R JUNI
OR
ZXU
12
2500
330.0
8.4
2.3
2.8
1.0
4.0
8.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Nov-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TXB0104DR
SOIC
D
14
2500
367.0
367.0
38.0
TXB0104GXUR
BGA MICROSTAR
JUNIOR
GXU
12
2500
338.1
338.1
20.6
TXB0104PWR
TSSOP
PW
14
2000
367.0
367.0
35.0
TXB0104RGYR
VQFN
RGY
14
3000
367.0
367.0
35.0
TXB0104RUTR
UQFN
RUT
12
3000
202.0
201.0
28.0
TXB0104YZTR
DSBGA
YZT
12
3000
182.0
182.0
17.0
TXB0104ZXUR
BGA MICROSTAR
JUNIOR
ZXU
12
2500
338.1
338.1
20.6
Pack Materials-Page 2
D: Max = 1.89 mm, Min = 1.83 mm
E: Max = 1.39 mm, Min = 1.33 mm
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