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Product Brief Intel® Edison Intel® Edison Development Platform Introduction The Intel® Edison development platform is designed to lower the barriers to entry for a range of inventors, entrepreneurs, and consumer product designers to rapidly prototype and produce “Internet of Things” (IoT) and wearable computing products. Intel® Edison Board for Arduino* Supports Arduino Sketch, Linux, Wi-Fi, and Bluetooth. Board I/O: Compatible with Arduino Uno (except 4 PWM instead of 6 PWM): • 20 digital input/output pins, including 4 pins as PWM outputs. • 6 analog inputs. • 1 UART (Rx/Tx). • 1 I2C. Intel® Edison Breakout Board Slightly larger than the Intel® Edison module, the Intel® Edison Breakout Board has a minimal set of features: • 1 ICSP 6-pin header (SPI). • Exposes native 1.8 V I/O of the Edison module. • Micro USB device connector OR (via mechanical switch) dedicated standard size USB host Type-A connector. • USB OTG with USB Micro Type-AB connector. • 0.1 inch grid I/O array of through-hole solder points. • Micro USB device (connected to UART). • USB OTG power switch. • SD card connector. • USB to device UART bridge with USB micro Type-B connector. • DC power jack (7 to15 VDC input). • Battery charger. • DC power supply jack (7 to 15 VDC input). Intel® IoT Analytics Platform • Provides seamless Device-toDevice and Device-to-Cloud communication. • Ability to run rules on your data stream that trigger alerts based on advanced analytics. • Foundational tools for collecting, storing, and processing data in the cloud. • Free for limited and noncommercial use. Intel® Edison Development Platform PHYSICAL Form factor Dimensions C/M/F Connector Operating temperature Board with 70-pin connector 35.5 × 25.0 × 3.9 mm (1.4 × 1.0 × 0.15 inches) max Blue PCB with shields / No enclosure Hirose DF40 Series (1.5, 2.0, or 3.0 mm stack height) 32 to 104°F (0 to 40°C) EXTERNAL INTERFACES Total of 40 GPIOs, which can be configured as: 1 interface SD card UART 2 controllers (1 full flow control, 1 Rx/Tx) I2C 2 controllers 1 controller with 2 chip selects SPI I2S 1 controller GPIO Additional 12 (with 4 capable of PWM) 1 OTG controller USB 2.0 Clock output 32 kHz, 19.2 MHz MAJOR EDISON COMPONENTS SoC RAM Flash storage WiFi Bluetooth 22 nm Intel® SoC that includes a dual-core, dual-threaded Intel® Atom™ CPU at 500 MHz and a 32-bit Intel® Quark™ microcontroller at 100 MHz 1 GB LPDDR3 POP memory (2 channel 32bits @ 800MT/sec) 4 GB eMMC (v4.51 spec) Broadcom* 43340 802.11 a/b/g/n; Dual-band (2.4 and 5 GHz) Onboard antenna Bluetooth 4.0 POWER Input Output Power 3.3 to 4.5 V 100 ma @3.3 V and 100 ma @ 1.8 V Standby (No radios): 13 mW Standby (Bluetooth 4.0): 21.5 mW (BTLE in Q4-14) Standby (Wi-Fi): 35 mW FIRMWARE + SOFTWARE CPU OS Development environments MCU OS Development environments Yocto Linux* v1.6 Arduino* IDE Eclipse supporting: C, C++, and Python Intel XDK supporting: Node.JS and HTML5 RTOS MCU SDK and IDE Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined”. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725 or by visiting Intel’s website at http://www.intel.com/design/literature.htm. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. Intel, the Intel logo, Atom, Pentium, Quark, and Xeon are trademarks of Intel Corporation in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2015 Intel Corporation. All rights reserved. Please Recycle 331179-002