ITG-3200EVB Application Note
Document Number: EB-ITG-3200-00-01.1
Revision: 1.1
Release Date: 03/18/2010
ITG-3200 3-Axis Gyro Evaluation Board
Application Note Rev 1.1
A printed copy of this document is NOT UNDER
REVISION CONTROL unless it is dated and stamped
in red ink as, “REVISION CONTROLLED COPY.”
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, CA 94089, USA
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: http//www.invensense.com
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©2010 InvenSense, Inc. All rights reserved.
ITG-3200EVB Application Note
Document Number: EB-ITG-3200-00-01.1
Revision: 1.1
Release Date: 03/18/2010
1. Revision History
0B
Date
12/07/2009
03/18/2010
Revision
1.0
1.1
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, CA 94089, USA
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: http//www.invensense.com
Description
Initial release
Added assembly drawing,
revised schematic, revised
BOM, other edits for
readability.
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©2010 InvenSense, Inc. All rights reserved.
ITG-3200EVB Application Note
Document Number: EB-ITG-3200-00-01.1
Revision: 1.1
Release Date: 03/18/2010
CONTENTS
1.
0BREVISION HISTORY ....................................................................................................................................... 2
2.
1BPURPOSE ..................................................................................................................................................... 4
3.
2.1
7BUsage ................................................................................................................................................ 4
2.2
8BRelated Documents ........................................................................................................................... 4
2BITG-3200 3-AXIS EVB OVERVIEW ................................................................................................................ 4
9B3.1 ITG-3200 Key Function and Pin-outs ....................................................................................................... 5
4.
5.
6.
3BSIGNAL PATHS AND CONFIGURABLE CONNECTIONS ........................................................................................ 6
4.1
10BITG-3200 Functional Block Diagram ................................................................................................. 6
4.2
1BITG-3200 Evaluation Board Schematic ............................................................................................. 7
4.3
12BBill of Materials (Parts Stuffing List) for ITG-3200 EV Board ............................................................ 8
4.4
13BAssembly Drawing for ITG-3200 EV Board ....................................................................................... 9
4.5
14BPower Supply Connections ............................................................................................................. 10
4.6
15BITG-3200 EVB Connector Signals Description................................................................................ 10
4.7
16BSerial Bus Levels, Speeds and Terminations.................................................................................. 12
4.8
17BSolder-Across “M” Jumpers ............................................................................................................. 12
4.9
18BTable 5. Solder-Across “M” Jumpers – what they do and how to connect ...................................... 12
4BDATA GATHERING OPTIONS ........................................................................................................................ 13
5.1
19BConnection to ARM7 Interface EVB ................................................................................................ 13
5.2
20BUse of ITG-3200 without ARM EVB board ...................................................................................... 13
5BSPECIAL INSTRUCTIONS .............................................................................................................................. 13
6.1
7.
21BElectrostatic Discharge Sensitivity................................................................................................... 13
6BMECHANICAL DIMENSIONS .......................................................................................................................... 14
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©2010 InvenSense, Inc. All rights reserved.
ITG-3200EVB Application Note
Document Number: EB-ITG-3200-00-01.1
Revision: 1.1
Release Date: 03/18/2010
2. Purpose
1B
This document describes the hardware and circuitry on the ITG-3200 3-Axis Evaluation Board (EVB). It
includes applying the EVB to a larger system, understanding the key signals and circuit functions, hardware
jumper settings, and port connectors.
2.1 Usage
7B
This evaluation board provides three axes of motion processing, comprised of:
X- , Y-, and Z-Axis gyros with ±2,000 °/sec full-scale range;
16-bit digital data measured using on-chip ADCs, transmitted over I2C interface.
The Evaluation board may be used independently with the I2C serial communications interface.
Alternatively, it may be connected to InvenSense’s ARM Evaluation Board (INV-ARMEVB) for connectivity
to a host Windows PC using the USB interface.
2.2 Related Documents
8B
The following documents are recommended for a more comprehensive understanding of the components
and systems described in this Application Note.
ITG-3200 Product Specification
ITG-3200 EVB Schematic Diagram (included in this document)
3. ITG-3200 3-Axis EVB Overview
2B
The ITG-3200 3-Axis EVB contains the ITG-3200 3-axis digital gyroscope and its interface circuitry. It
contains removable and ‘solder-across’ jumper points that permits several circuit configurations.
Referring to Figure 1, the EVB is populated on its top side only for ease of measurement access. The 20-pin
(10 x 2-pin) Main header connector is designed to interface with the InvenSense INV-ARM EVB, which is a
host microcontroller board useful for adapting the ITG-3200 3-Axis EVB to a personal computer via its USB
port.
Figure 1. Top side of the ITG-3200 3-Axis EVB
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©2010 InvenSense, Inc. All rights reserved.
ITG-3200EVB Application Note
Document Number: EB-ITG-3200-00-01.1
Revision: 1.1
Release Date: 03/18/2010
The 10-pin (5 x 2-pin) Factory extension header is intended for connecting additional devices to the EVB,
such as a digital-output compass, etc. The 3-pin power selection header is used to select which voltage
supply is interfaced to the ITG-3200.
The Power select jumper allows the ITG-3200 VDD to be supplied either directly from a 3.3V DC input on
the main header, or by a local 3.0V voltage regulator.
3.1 ITG-3200 Key Function and Pin-outs
9B
The ITG-3200EVB is a fully-tested evaluation board, providing a quick evaluation of the ITG-3200 X-, Y-,
and Z-axis angular rate gyroscope. The ITG-3200 uses InvenSense’s proprietary MEMS technology with
vertically driven vibrating masses to produce a functionally complete, low-cost motion sensor. All required
conditioning electronics are integrated into a single chip measuring 4 x 4 x 0.9mm. It incorporates X-, Y-,
and Z-axis low-pass filters and an EEPROM for on-chip factory calibration of the sensor. Factory trimmed
scale factors eliminate the need for external active components and end-user calibration. A built-in
Proportional-To-Absolute-Temperature (PTAT) sensor provides temperature compensation information.
The product is lead-free and Green Compliant. Refer to the ITG-3200 Product Specification for a complete
description.
RESV-G
INT
CPOUT
REGOUT
RESV
RESV
VLOGIC
AD0
SCL
RESV
RESV
SDA
Figure 2. Top View Pin-Out and Sense Orientation of the ITG-3200
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©2010 InvenSense, Inc. All rights reserved.
ITG-3200EVB Application Note
Document Number: EB-ITG-3200-00-01.1
Revision: 1.1
Release Date: 03/18/2010
4. Signal Paths and Configurable Connections
3B
4.1 ITG-3200 Functional Block Diagram
10B
The ITG-3200 consists of a MEMS gyroscope, a data-acquisition and digital signal processing section, and a
data interface which is compatible to I2C. The data interface is a slave.
VDD and GND are the main supply voltage connections, and VLOGIC is an input which sets the data interface
logic-high level. This allows VDD to be different than the IO voltage. Thus, for example, VDD could be 2.6VDC
while the data interface could connect to a 1.8V I2C bus, by using a VLOGIC of 1.8V. REGOUT is for
connecting the (nominally) 1.7V internal voltage regulator to a bypass capacitor. CPOUT is for connecting a
charge pump capacitor to the internal charge pump.
INT is the ITG-3200 interrupt and may be software configured to a variety of modes. AD0 is the LSB of the I2C
device address, so that when it is tied logic-low, the ITG-3200 address is 68h, and when logic-high (VLOGIC)
the ITG-3200 address is 69h.
Refer to the ITG-3200 product specification for power-on-timing waveforms for VDD and VLOGIC.
Optional
1
CLOCK
ITG-3200
Clock
X Gyro
Signal
Conditioning
ADC
Y Gyro
Interrupt
Status
Register
Config
Register
Signal
Conditioning
ADC
Interrupt
9
2
I C Serial
Interface
Sensor
Register
Z Gyro
Signal
Conditioning
ADC
Temp
Sensor
Charge
Pump
20
CPOUT
12
23
24
INT
AD0
SCL
SDA
FIFO
ADC
Factory Cal
Bias & LDO
13
VDD
8
VLOGIC
18
GND
10
REGOUT
Figure 3: ITG-3200 Functional Block Diagram
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2
1
Document Number: EB-ITG-3200-00-01.1
ITG-3200EVB Application Note Revision: 1.1
Release Date: 03/18/2010
I2C V_logic
Voltage Select
LDO_V_OUT
D
4.2 ITG-3200
Evaluation Board
Schematic
M1
D
1B
1
2
3
V_LOGIC
BP1
0.1uF
M3
R1
10K/0402
M6
R2
2K/0402
U1
ITG-3200, 24-Lead QFN (4mm x 4mm x 0.9mm)
RESV1
RESV2
6
7
RESV3
22
RESV-G_U1
12
11
13
18
SELECTED_VDD
Voltage
Select
BP2 M7
0.1uF
21
19
VLOGIC
AD0
SDA
SCL
RESV
INT
RESV-G
CLKIN
CPOUT
REGOUT
VDD
GND
RESV
RESV
NC
NC
NC
NC
RESV4
RESV5
RESV
RESV
R9
0/0402
VCC
M5
NC
NC
NC
NC
8
9
24
23
VCC
R3
2K/0402
V_LOGIC
AD0
SDA
SCL
1
1
20
10
TP1
TEST POINT
CP_OUT
REG_OUT
2
3
4
5
BP3
0.1uF
C1
2200pF/50V/0402
C
17
16
15
14
C
M4
JP2
HEADER 3, 80mil, 180D, Male
3
2
1
VCC
LDO_V_OUT
SCL
SDA
AD0
RESV-G
RESV-G
2
4
6
8
10
JP8
HEADER 14X2, Male, 90D, 2.54mmx2.54mm
JP7
HEADER 3, 80mil, 180D, Male
1
3
5
7
9
11
13
15
17
19
21
23
25
27
RESV1
RESV2
RESV5
INT
RESV4
CLK_IN
CP_OUT
R11
0/0402
LDO_V_OUT
RESV-G
VCC
B
2
4
6
8
10
12
14
16
18
20
22
24
26
28
1
3
5
7
9
JP6
HEADER 5X2, Male, 180D, 2.0mmx2.0mm
R10
0/0402
V_LOGIC
RESV3
LDO_EN
REG_OUT
SCL
SDA
AD0
B
R4
10K/0402
TP2
TEST-POINT
1
User Header
R5
1M
R6
0/0402
R7
100K/0402
VCC
R8
2R2/0603
VCC
BP4
0.1uF
C2
0.47uF/0603
U2
YB1210ST25R300
SOT235
1
5
2 Vin OUT
3 GND
4
BYPASS
EN
NC
3V0
LDO_V_OUT
C3
0.47uF/0603
BP5
0.1uF
C4
0.033uF/0402
A
A
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1197 BORREGAS AVE.
Phone: 408-988-7339
Fax: 408-988-8104
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SUNNYVALE, CA 94089
Creating a new Generation of Embedded Motion Sensors
Title
ITG-3200 EVB
5
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InvenSense,
Inc.
All
rights reserved.
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Size
Document Number
Custom
Date:
2
Thursday, March 18, 2010
Rev
Sheet
1
1
of
1
B
Document Number: EB-ITG-3200-00-01.1
Revision: 1.1
Release Date: 03/18/2010
ITG-3200EVB Application Note
4.3 Bill of Materials (Parts Stuffing List) for ITG-3200 EV Board
12B
Parts Stuffing BOM for ITG-3200 EV Board. Also refer to Assembly Drawing for ITG-3200 EV Board
Table 1. Parts stuffing list the ITG-3200 EVB. Only the top side requires component assembly
Item
Quantity
Reference
Part
PCB Footprint
1
5
BP1,BP2,BP3,BP4,BP5
0.1uF
402 smt
2
1
C1
2200pF/50V
402 smt
3
2
C2,C3
0.47uF/0603
603 smt
4
1
C4
0.033uF
402 smt
5
2
JP2,JP7
HEADER 3 pin, 80mil, 180D, Male
3-pin 2mm header
6
2
P2,P7
PLUG 80mil 2-pin Short circuit plug
Plugs to JP2, JP7
7
1
JP6
HEADER 5X2 pin, Male, 180D, 2.0mmx2.0mm
SIP2X5N2
8
1
JP8
HEADER 10X2 pin, Male, 90D, 2.54mmx2.54mm
HDB2X10NRA
9
4
R1, R2,R3,R4
10K
402 smt
10
1
R5
1M
402 smt
11
1
R8
2R2/0603
603 smt
12
2
R6, R10
0 Ohm
402 smt
13
1
U1
ITG-3200
QFN-24
14
2
R9, R7
DO NOT STUFF
0402 smt
16
1
U2
YB1210-ST25R300, 3.0V Regulator1
SOT-235
17
1
M7
Solder across Jumper
Split oval
18
5
M1, M3, M4, M5, M6
Do not solder across Jumper
Split oval
19
1
Blank PCB
ITG-3200 EVB REV B
Note 1: www.yobon.com.tw
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ITG-3200EVB Application Note
Document Number: EB-ITG-3200-00-01.1
Revision: 1.1
Release Date: 03/18/2010
4.4 Assembly Drawing for ITG-3200 EV Board
13B
Figure 4. ITG-3200 EV Board Assembly Drawing. Follow the Parts Stuffing List for assembly instructions.
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, CA 94089, USA
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ITG-3200EVB Application Note
Document Number: EB-ITG-3200-00-01.1
Revision: 1.1
Release Date: 03/18/2010
4.5 Power Supply Connections
14B
JP2 and JP7 are 3 header-pin plug-in jumpers which allow users to select between the on-board LDO and
an external DC supply to the ITG-3200. For details, please refer to Table 2. Power Selection Jumpers.
X
X
The on-board 3.0V LDO (Low-dropout voltage regulator) is a low-noise part. Its output is called 3V0 on the
schematic, and using it will assure that the gyroscope and accelerometer performance will meet the
intended specifications.
Selecting the raw VCC line to power the chip is generally done while designing and evaluating with an
embedded platform, where the host processor and related electronics need full control over the motion
processing chip’s power supply. When the user intends to use the on board LDO 3V0 power, the external
VCC must be higher than 3.7V to ensure the LDO works properly. If the user provides VCC with 5V, JP2
and JP7 must be set as “1-2 short” to enable the on-board 3.0V LDO. The ITG-3200 VDD and VLOGIC
operation range is 2.1V to 3.6V.
Refer to the ITG-3200 product specification for power-on-timing waveforms for VDD and VLOGIC.
Figure 5. JP2 and JP7 Pin-out
4.6 ITG-3200 EVB Connector Signals Description
15B
Table 2. Power Selection Jumpers (use P2, P7 to short pins as required)
JP2 Pin Number
Signal Description
1-2 short
ITG-3200 VLOGIC = 3V using on board LDO
2-3 short
ITG-3200 VLOGIC = VCC (from external)
JP7 Pin Number
Signal Description
1-2 short
ITG-3200 VDD = 3V using on-board LDO
2-3 short
ITG-3200 VDD = VCC (from external)
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ITG-3200EVB Application Note
Document Number: EB-ITG-3200-00-01.1
Revision: 1.1
Release Date: 03/18/2010
Table 3. “Main Header” User Interface Signals
JP8 Pin Number
Signal Name
Signal Description
1
RESV1
Reserved. Do not connect to this pin.
3
RESV2
Reserved. Do not connect to this pin.
5
RESV5
Reserved. Do not connect to this pin.
7
INT
9
RESV4
Reserved. Do not connect to this pin.
11
CLKIN
ITG-3200 pin 1 external clock input
13
CPOUT
ITG-3200 pin 20 (charge pump capacitor)
15
GND
GND
17
GND
GND
19
ITG-3200 pin 12 interrupt output to host controller
3V on-board LDO (regulated DC) output
21
RESV-G
23
VCC
25
NC
Not Connected
27
NC
Not Connected
2
NC
Not Connected
4
NC
Not Connected
6
Reserved. Do not connect to this pin.
VCC from ARM-7 Controller Board or external 3.3V at >100mA
Do not connect to this pin.
8
VLOGIC
VLOGIC DC Input, ITG-3200 pin 8, sets I2C bus logic levels
10
RESV3
Reserved. Do not connect to this pin.
12
NC
14
LDO_EN
Not Connected
16
NC
18
REGOUT
20
SCL
ITG-3200 pin 23 I2C clock line
22
SDA
ITG-3200 pin 24 I2C data line
24
AD0
ITG-3200 pin 9 I2C Address bit zero
26
NC
Not Connected
28
NC
Not Connected
EVB on-board 3V LDO enable (when pulled to VCC)
Not Connected
ITG-3200 pin 10, on-chip regulator bypass capacitor
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ITG-3200EVB Application Note
Document Number: EB-ITG-3200-00-01.1
Revision: 1.1
Release Date: 03/18/2010
Table 4. Extended Factory Connector pin functions
JP6 Pin
Number
Signal Name
1
VCC
Power from ARM-7 controller board or external 3.3V at >100mA
3
GND
GND
5
NC
Not Connected
7
NC
Not Connected
9
NC
Not Connected
2
LDO_V_OUT
4
SCL
ITG-3200 I2C clock line
6
SDA
ITG-3200 I2C data line
8
AD0
ITG-3200 I2C Address bit zero
10
RESV-G
Signal Description
3V Output from LDO
Reserved. Do not connect to this pin.
4.7 Serial Bus Levels, Speeds and Terminations
16B
The ITG-3200 supports fast mode I2C up to 400Hz. The I2C bus open-drain pull up resistors are R2 and R3
for SDA and SCL; both are 2.2kohm connected to either 3.0V or the externally provided VCC. The pull up
level is selected by JP2. Please refer to Table 2. Power Selection Jumpers.
X
X
4.8 Solder-Across “M” Jumpers
17B
For fast and permanent configuration connections, a set of solder-across jumpers are provided.
4.9 Table 5. Solder-Across “M” Jumpers – what they do and how to connect
18B
M
Number
M Jumper function
1
Shorts JP2 pins 1-2 to set ITG-3200 VLOGIC = 3.0V using on board LDO
3
Shorts JP2 pins 2-3 to set ITG-3200 VLOGIC = VCC externally supplied voltage
4
Shorts JP7 pins 2-3 to set ITG-3200 VDD = VCC externally supplied voltage
5
Shorts JP7 pins 1-2 to setITG-3200 VDD = 3.0V using on board LDO
6
Pulls ITG-3200 VLOGIC pin 8 to V_LOGIC supply. It is in parallel with R1
7
Shorts ITG-3200 pin 11 as required by Product Specification.
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ITG-3200EVB Application Note
Document Number: EB-ITG-3200-00-01.1
Revision: 1.1
Release Date: 03/18/2010
5. Data Gathering Options
4B
The ITG-3200 Digital Sensor Data is available at the Main Header connector. Alternately, for connectivity
with a host PC, an InvenSense ARM Interface Board may also be used.
5.1 Connection to ARM7 Interface EVB
19B
For communications via USB to a host computer, the ITG-3200EVB may be connected to InvenSense’s
ARM7 Microprocessor Interface board, the INV-ARMEVB. It serves as an interface between a Windows PC
USB port, and the ITG-3200 EVB Main header.
The following photo shows the connection of ITG-3200 to INV-ARMEVB. Connection between the two
boards is made via the Main header connector.
Figure 6: Connect ITG-3200 to ARM Board
5.2 Use of ITG-3200 without ARM EVB board
20B
I2C signals are available on JP8. The user may develop tools to communicate with the ITG-3200. There is
no bus mode selection setting required.
6. Special Instructions
5B
6.1 Electrostatic Discharge Sensitivity
21B
The ITG-3200 gyro can be permanently damaged by an electrostatic discharge. Proper ESD precautions for
handling and storage are recommended.
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ITG-3200EVB Application Note
Document Number: EB-ITG-3200-00-01.1
Revision: 1.1
Release Date: 03/18/2010
7. Mechanical Dimensions
6B
The ITG-3200EVB is a 4 layer PCB with 32mm x 38mm overall dimensions. The mounting holes are
arranged to fit 19.56mm x 18.54 mm fixture screw centers, offset from the edge of the board by 9.22mm and
3.05mm as shown.
Figure 7: ITG-3200 Dimensions, Top Side shown
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or
other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its
circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information
and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of
products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property
rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of
InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies.
InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or any other weapons or life
threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant
equipment, disaster prevention and crime prevention equipment.
©2010 InvenSense, Inc. All rights reserved.
InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, CA 94089, USA
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