MIKROE-159

SPECIFICATION CUSTOMER : MIKROELEKTRONIKA MODULE NO.: WH2004L-TMI-ET# APPROVED BY: ( FOR CUSTOMER USE ONLY ) PCB VERSION: SALES BY APPROVED BY VERSION DATE REVISED PAGE NO. A 2008/6/25 21 1 of 29 DATA: CHECKED BY PREPARED BY SUMMARY Modify backlight information. MODLE NO： DOC. FIRST ISSUE RECORDS OF REVISION REVISED PAGE NO. VERSION DATE 0 A 2006-10-20 2008/6/25 21 SUMMARY First issue Modify backlight information. Contents 2 of 29 1.Module Classification Information 2.Precautions in use of LCD Modules 3.General Specification 4.Absolute Maximum Ratings 5.Electrical Characteristics 6.Optical Characteristics 7.Interface Pin Function 8.Contour Drawing & Block Diagram 9.Function Description 10.Character Generator ROM Pattern 11.Instruction Table 12.Timing Characteristics 13.Initializing of LCM 14.Reliability 15.Backlight Information 16. Inspection specification 17. Material List of Components for RoHs 3 of 29 1.Module 1.Module Classification Information WH 2004
  L－ T M I－ ET#   
Brand：WINSTAR DISPLAY CORPORATION  Display Type：H→Character Type, G→Graphic Type  Display Font：Character 20 words, 4Lines.  Model serials no.  Backlight Type：  LCD Mode： N→Without backlight B→EL, Blue green D→EL, Green W→EL, White F→CCFL, White Y→LED, Yellow Green T→LED, White A→LED, Amber R→LED, Red O→LED, Orange G→LED, Green B→TN Positive, Gray T→FSTN Negative N→TN Negative, G→STN Positive, Gray Y→STN Positive, Yellow Green M→STN Negative, Blue F→FSTN Positive  LCD Polarize Type/ A→Reflective, N.T, 6:00 H→Transflective, W.T,6:00 Temperature range/ D→Reflective, N.T, 12:00 K→Transflective, W.T,12:00 View direction G→Reflective, W. T, 6:00 C→Transmissive, N.T,6:00 J→Reflective, W. T, 12:00 F→Transmissive, N.T,12:00 B→Transflective, N.T,6:00 I→Transmissive, W. T, 6:00 E→Transflective, N.T.12:00 L→Transmissive, W.T,12:00 ET : English and European standard font  Special Code #:Fit in with the ROHS Directions and regulations 4 of 29 2.Precautions in use of LCD Modules (1)Avoid applying excessive shocks to the module or making any alterations or modifications to it. (2)Don’t make extra holes on the printed circuit board, modify its shape or change the components of LCD module. (3)Don’t disassemble the LCM. (4)Don’t operate it above the absolute maximum rating. (5)Don’t drop, bend or twist LCM. (6)Soldering: only to the I/O terminals. (7)Storage: please storage in anti-static electricity container and clean environment. (8). Winstar have the right to change the passive components (9). Winstar have the right to change the PCB Rev. 3.General Specification Item Dimension Unit 20 characters x 4 Lines － 146.0 x 62.5 x 13.6(MAX) mm View area 123.5 x 43.0 mm Active area 118.84x 38.47 mm Dot size 0.92 x 1.1 mm Dot pitch 0.98 x 1.16 mm Character size 4.84 x 9.22 mm Character pitch 6.0 x 9.75 mm Number of Characters Module dimension LCD type STN Negative, Blue Transmissive, Duty (In LCD production, It will occur slightly color difference. We can only guarantee the same color in the same batch.) 1/16 View direction 6 o’clock Backlight Type LED White 5 of 29 4.Absolute Maximum Ratings Item Symbol Min Typ Max Unit Operating Temperature TOP -20 － +70 ℃ Storage Temperature TST -30 － +80 ℃ Input Voltage VI VSS － VDD V Supply Voltage For Logic VDD-VSS -0.3 － 7 V Supply Voltage For LCD VDD-V0 -0.3 － 13 V 5.Electrical Characteristics Item Supply Voltage For Logic Symbol Condition Min Typ Max Unit VDD-VSS － 4.5 5.0 5.5 V Ta=-20℃ － － 5.4 V Ta=25℃ － 4.2 － V Ta=70℃ 3.5 － － V Supply Voltage For LCD VDD-V0 *Note Input High Volt. VIH － 0.7 VDD － VDD V Input Low Volt. VIL － VSS － 0.6 V Output High Volt. VOH － 3.9 － － V Output Low Volt. VOL － － － 0.4 V Supply Current IDD VDD=5.0V 1.0 1.2 1.5 mA * Note: Please design the VOP adjustment circuit on customer's main board Vdd VR 10K~20K Vo LCM Module VSS 6 of 29 6.Optical Characteristics Item Symbol Condition Min Typ Max Unit (V)θ CR≧2 20 － 40 deg (H)φ CR≧2 -30 － 30 deg CR － － 3 － － T rise － － 150 200 ms T fall － － 150 200 ms View Angle Contrast Ratio Response Time Definition of Operation Voltage (Vop) Definition of Response Time ( Tr , Tf ) Non-selected Conition Selected Wave Intensity 100％ Non-selected Wave Selected Conition Non-selected Conition Intensity 10％ Cr Max Cr = Lon / Loff 90％ 100％ Vop Tr Driving Voltage(V) [positive type] Tf [positive type] Conditions : Operating Voltage : Vop Viewing Angle(θ，φ) : 0°， 0° Frame Frequency : 64 HZ Driving Waveform : 1/N duty , 1/a bias Definition of viewing angle(CR≧ ≧2) θb θf θl φ= 180° θr φ= 90° φ= 270° φ= 0° 7 of 29 7.Interface Pin Function Pin No. Symbol Level Description 1 VSS 0V Ground 2 VDD 5.0V 3 VO 4 RS H/L H: DATA, L: Instruction code 5 R/W H/L H: Read(MPU→Module) L: Write(MPU→Module) 6 E H,H→L 7 DB0 H/L Data bus line 8 DB1 H/L Data bus line 9 DB2 H/L Data bus line 10 DB3 H/L Data bus line 11 DB4 H/L Data bus line 12 DB5 H/L Data bus line 13 DB6 H/L Data bus line 14 DB7 H/L Data bus line 15 A － LED + 16 K － LED - 17 NC － No connection 18 NC － No connection Supply Voltage for logic (Variable) Operating voltage for LCD Chip enable signal 8 of 29 18.00 P 2.54*17=43.18 2.00 13.6M ax 9.0 2.50 13.015 4.75 10.75 3.50 8.Contour Drawing &Block Diagram 38.47(AA) 55.0 43.0(VA) L E D W H IT E 13.58 118.8 4(A A ) 11.25 123.5 0(V A ) 6.00 134.00 3.50 4- 2.5P T H 4- 5.0P A D 1.6 L E D B /L 139.0 6.0 146.00  0 .5 4.84 0.98 0.92 9.75 9.22 1.16 1.1 59.00 62.5 0.5 1 D O T S IZ E S C A L E 4/1 9 of 29 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 V ss V dd Vo RS R /W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 A K NC NC VR 10K ~ 20K V dd Vo V ss E xternal contrast adjustm ent. C h aracter located D D R A M add ress D D R A M add ress D D R A M add ress D D R A M add ress 20X 4 L C D C o m 1 7~3 2 Bias and Power Circuit 80 series or 68 series C o m 1 ~16 C ontroller/C om D river H D 44780 or E quivalent S eg1 ~4 0 D S eg 41~ 12 0 S eg1 20~ 20 0 S eg D river S eg D river M CL1 CL2 V dd,V ss,V 1~ V 5 N.V. Generator M PU RS R /W E D B 0~D B 7 O ptional 1 00 40 14 54 2 01 41 15 55 3 02 42 16 56 4 03 43 17 57 5 04 44 18 58 6 05 45 19 59 7 06 46 1A 5A 8 07 47 1B 5B 9 08 48 1C 5C 10 of 29 10 11 09 0A 49 4A 1D 1E 5D 5E 12 0B 4B 1F 5F 13 0C 4C 20 60 14 0D 4D 21 61 15 0E 4E 22 62 16 0F 4F 23 63 17 10 50 24 64 18 11 51 25 65 19 12 52 26 66 20 13 53 27 67 9.Function Description The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an instruction register (IR) and a data register (DR). The IR stores instruction codes, such as display clear and cursor shift, and address information for display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from the MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM. By the register selector (RS) signal, these two registers can be selected. Operation RS R/W 0 0 IR write as an internal operation (display clear, etc.) 0 1 Read busy flag (DB7) and address counter (DB0 to DB7) 1 0 Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM) 1 1 Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR) Busy Flag (BF) When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction will not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7. The next instruction must be written after ensuring that the busy flag is 0. Address Counter (AC) The address counter (AC) assigns addresses to both DDRAM and CGRAM Display Data RAM (DDRAM) This DDRAM is used to store the display data represented in 8-bit character codes. Its extended capacity is 80×8 bits or 80 characters. Below figure is the relationships between DDRAM addresses and positions on the liquid crystal display. High bits Low bits Example: DDRAM addresses 4E AC (hexadecimal) AC6 AC5 AC4 AC3 AC2 AC1 AC0 11 of 29 1 0 0 1 1 1 0 Display position DDRAM address 1 2 00 40 14 54 3 01 41 15 55 4 02 42 16 56 5 03 43 17 57 6 04 44 18 58 7 8 05 06 07 45 46 47 19 1A 1B 59 5A 5B 9 10 11 12 13 14 15 16 17 18 19 20 08 48 1C 5C 09 49 1D 5D 0A 4A 1E 5E 0B 4B 1F 5F 0C 4C 20 60 0D 4D 21 61 0E 4E 22 62 0F 4F 23 63 10 50 24 64 11 51 25 65 12 52 26 66 Character Generator ROM (CGROM) The CGROM generate 5×8 dot or 5×10 dot character patterns from 8-bit character codes. See Table 2. Character Generator RAM (CGRAM) In CGRAM, the user can rewrite character by program. For 5×8 dots, eight character patterns can be written, and for 5×10 dots, four character patterns can be written. Write into DDRAM the character code at the addresses shown as the left column of table 1. To show the character patterns stored in CGRAM. 12 of 29 13 53 27 67 Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns Table 1. F o r 5 * 8 d o t c h a ra c te r p a tte rn s C h a ra c te r C o d e s ( D D R A M d a ta ) 7 6 5 4 3 H ig h 0 0 0 0 0 0 0 0 0 2 1 0 Low 0 0 0 * 0 * 0 * 1 0 0 1 C h a ra c te r P a tte rn s ( C G R A M d a ta ) C G R A M A d d re ss 5 4 3 2 1 0 7 Low 0 0 0 0 0 1 0 1 0 0 0 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 0 0 1 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 * * * * * * * * * * * * * * * * * H ig h 0 1 1 1 1 1 1 1 1 1 0 0 1 1 0 1 0 1 * 6 5 H ig h * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * 4 3 2 1 0 Low 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C h a ra c te r p a tte rn ( 1 ) 0 0 0 0 C u rs o r p a tte rn 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C h a ra c te r p a tte rn ( 2 ) C u rs o r p a tte rn * F o r 5 * 1 0 d o t c h a ra c te r p a tte rn s C h a ra c te r C o d e s ( D D R A M d a ta ) 7 6 5 4 H ig h 0 0 0 3 2 1 0 Low 0 * 0 0 C h a ra c te r P a tte rn s ( C G R A M d a ta ) C G R A M A d d re ss 5 4 3 0 0 0 0 0 0 0 0 0 1 1 1 0 0 0 0 1 1 1 1 0 0 0 1 1 H ig h 0 0 2 1 0 7 0 0 1 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 1 0 1 0 * * * * * * * * * * * 1 1 * Low 6 5 4 3 1 0 * * * * * * * * * * * * 0 * 0 * * * * * * * * * 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 * * * * * * H ig h : " H ig h " 13 of 29 2 Low * C h a ra c te r p a tte rn C u rs o r p a tte rn 10.Character Generator ROM Pattern Table.2 Upper 4 bit Lower 4 bit LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH LLLL CG RAM (1) LLLH CG RAM (2) LLHL CG RAM (3) LLHH CG RAM (4) LHLL CG RAM (5) LHLH CG RAM (6) LHHL CG RAM (7) LHHH CG RAM (8) HLLL CG RAM (1) HLLH CG RAM (2) HLHL CG RAM (3) HLHH CG RAM (4) HHLL CG RAM (5) HHLH CG RAM (6) HHHL CG RAM (7) HHHH CG RAM (8) 14 of 29 11.Instruction 11.Instruction Table Instruction Code Instruction Execution time (fosc=270Khz) Description RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Clear Display 0 0 0 0 0 0 0 0 0 1 Write “00H” to DDRAM and set DDRAM address to “00H” from AC 1.53ms 1.53ms Return Home 0 0 0 0 0 0 0 0 1 － Set DDRAM address to “00H” from AC and return cursor to its original position if shifted. The contents of DDRAM are not changed. Entry Mode Set 0 0 0 0 0 0 0 1 I/D SH Assign cursor moving direction and enable the shift of entire display. 39μs Display ON/OFF Control 0 0 0 0 0 0 1 D C B Set display (D), cursor (C), and blinking of cursor (B) on/off control bit. 39μs Cursor or Display Shift 0 0 0 0 0 1 S/C R/L － － control bit, and the direction, without Function Set Set CGRAM Address Set DDRAM Address Set cursor moving and display shift 39μs changing of DDRAM data. Set interface data length (DL:8-bit/4-bit), numbers of display line (N:2-line/1-line)and, display font type (F:5×11 dots/5×8 dots) 39μs AC5 AC4 AC3 AC2 AC1 AC0 Set CGRAM address in address counter. 39μs 1 DL N F － － 0 0 0 0 0 0 0 1 0 0 1 AC6 AC5 AC4 AC3 AC2 AC1 AC0 Set DDRAM address in address counter. 39μs Whether during internal operation or not can be known by reading BF. The AC6 AC5 AC4 AC3 AC2 AC1 AC0 contents of address counter can also be read. 0μs Read Busy Flag and Address 0 1 BF Write Data to RAM 1 0 D7 D6 D5 D4 D3 D2 D1 D0 Write data into internal RAM (DDRAM/CGRAM). 43μs Read Data from RAM 1 1 D7 D6 D5 D4 D3 D2 D1 D0 Read data from internal RAM (DDRAM/CGRAM). 43μs ＊ ”－”：don’t care 15 of 29 12.Timing Characteristics 12.1 Write Operation Ta=25℃, VDD=5.0V Item Symbol Min Typ Max Unit Enable cycle time TC 1200 － － ns Enable pulse width TPW 140 － － ns Enable rise/fall time TR,TF － － 25 ns Address set-up time (RS, R/W to E) tAS 0 － － ns Address hold time tAH 10 － － ns Data set-up time tDSW 40 － － ns tH 10 － － ns Data hold time 16 of 29 12.2 Read Operation Ta=25℃, VDD=5V Symbol Min Typ Max Unit TC 1200 － － ns TPW 140 － － ns TR,TF － － 25 ns Address set-up time (RS, R/W to E) tAS 0 － － ns Address hold time tAH 10 － － ns Data delay time tDDR － － 100 ns Data hold time tH 10 － － ns Item Enable cycle time Enable pulse width (high level) Enable rise/fall time 17 of 29 13.Initializing of LCM Power on Wait for more than 40 ms after VDD rises to 4.5 V BF can not be checked before this instruction. RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 1 1 * 0 * * * Wait for more than 39us BF can not be checked before this instruction. RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 0 1 0 * * * * 0 0 * * * * N F * * 0 Function set Wait for more than 39 µs BF can not be checked before this instruction. RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 * * * Function set 0 1 0 * 0 0 N F * * * * * * 0 Wait for more than 37us RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control 0 0 0 0 0 * * * * 0 * * * * 0 1 D C B 0 Wait for more than 37 µs RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear * * * 0 0 0 0 0 * 0 0 0 0 0 1 * * * * 0 Wait for more than 1.53ms RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 0 0 * * * * 0 0 1 0 * * * 0 I/D SH * Initialization ends 4-Bit Ineterface 18 of 29 Power on Wait for more than 40 ms after VDD rises to 4.5 V BF can not be checked before this instruction. RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N F * * Wait for more than 39us BF can not be checked before this instruction. RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 0 0 1 1 N F * * Function set Wait for more than 37us RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control 0 0 0 0 0 0 1 B C D Wait for more than 37 µs RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear 0 0 0 0 0 0 0 0 0 1 Wait for more than 1.53ms RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 0 0 0 0 1 I/D S Initialization ends 8-Bit Ineterface 19 of 29 14.Reliability Content of Reliability Test (wide temperature, -20℃~70℃ ℃) Environmental Test Test Item High Temperature storage Low Temperature storage High Temperature Operation Low Temperature Operation High Temperature/ Humidity Operation Thermal shock resistance Content of Test Endurance test applying the high storage temperature for a long time. Endurance test applying the high storage temperature for a long time. Endurance test applying the electric stress (Voltage & Current) and the thermal stress to the element for a long time. Endurance test applying the electric stress under low temperature for a long time. The module should be allowed to stand at 60 ℃,90%RH max For 96hrs under no-load condition excluding the polarizer, Then taking it out and drying it at normal temperature. The sample should be allowed stand the following 10 cycles of operation -20℃ 25℃ 70℃ 30min 5min 1 cycle Test Condition 80℃ 200hrs -30℃ 200hrs Note 2 1,2 70℃ 200hrs —— -20℃ 200hrs 1 60℃,90%RH 96hrs 1,2 -20℃/70℃ 10 cycles —— 30min Total fixed amplitude : 1.5mm Vibration Frequency : Endurance test applying the vibration during 10~55Hz Vibration test 3 transportation and using. One cycle 60 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=800V,RS=1.5k Endurance test applying the electric stress to the Ω Static electricity test —— terminal. CS=100pF 1 time Note1: No dew condensation to be observed. Note2: The function test shall be conducted after 4 hours storage at the normal Temperature and humidity after remove from the test chamber. Note3: Vibration test will be conducted to the product itself without putting it in a container. 20 of 29 15.Backlight Information Specification PARAMETER SYMBOL MIN TYP MAX UNIT TEST Supply Current ILED 72 80 125 mA V=3.5V Supply Voltage V 3.4 3.5 3.6 V － Reverse Voltage VR － － 5 V － IV 232 290 － CD/M2 ILED=80mA λp ─ － nm Luminous Intensity Wave Length CONDITION ILED=80mA ILED=80mA LED Life Time (For Reference only) － Color White － 50K － Hr. 25℃ ℃,50-60%RH, (Note 1) Note: The LED of B/L is drive by current only, drive voltage is for reference only. drive voltage can make driving current under safety area (current between minimum and maximum). Note 1:50K hours is only an estimate for reference. 2.Drive from pin15,pin16 R R A B/L K LCM (Will never get Vee output from pin15) 21 of 29 16. Inspection specification NO 01 02 Item Electrical Testing Criterion 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character , dot or icon. 1.3 Display malfunction. 1.4 No function or no display. 1.5 Current consumption exceeds product specifications. 1.6 LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect. Black or 2.1 White and black spots on display ≦0.25mm, no more than white spots on three white or black spots present. LCD (display 2.2 Densely spaced: No more than two spots or lines within 3mm only) 3.1 Round type : As following drawing Φ=( x + y ) / 2 SIZE Φ≦0.10 03 0.10＜ Φ≦0.20 0.20＜ Φ≦0.25 0.25＜Φ LCD black spots, white spots, contamination (non-display) 3.2 Line type : (As following drawing) Length Width --W≦0.02 L≦3.0 0.02＜W≦0.03 L≦2.5 0.03＜W≦0.05 --- 04 AQ L Polarizer bubbles If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction. 22 of 29 0.05＜W Size Φ Φ≦0.20 0.65 2.5 Acceptable Q TY Accept no dense 2 2.5 1 0 Acceptable Q TY Accept no dense 2.5 2 As round type Acceptable Q TY Accept no dense 0.20＜Φ≦0.50 3 0.50＜Φ≦1.00 2 1.00＜Φ Total Q TY 0 3 2.5 NO Item 05 Scratches Criterion AQL Follow NO.3 LCD black spots, white spots, contamination Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length: 6.1 General glass chip : 6.1.1 Chip on panel surface and crack between panels: 06 Chipped glass z: Chip thickness y: Chip width x: Chip length Z≦1/2t Not over viewing area x≦1/8a 1/2t＜z≦2t Not exceed 1/3k x≦1/8a ☉If there are 2 or more chips, x is total length of each chip. 6.1.2 Corner crack: z: Chip thickness y: Chip width x: Chip length Z≦1/2t Not over viewing area x≦1/8a 1/2t＜z≦2t Not exceed 1/3k x≦1/8a ☉If there are 2 or more chips, x is the total length of each chip. 23 of 29 2.5 NO Item Criterion AQL Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad : y: Chip width x: Chip length z: Chip thickness y≦0.5mm x≦1/8a 0 ＜ z≦t 6.2.2 Non-conductive portion: 06 Glass crack 2.5 y: Chip width x: Chip length z: Chip thickness y≦ L x≦1/8a 0 ＜ z≦t ☉If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. ☉If the product will be heat sealed by the customer, the alignment mark not be damaged. 6.2.3 Substrate protuberance and internal crack. 24 of 29 y: width x: length y≦1/3L x≦a NO Item 07 Cracked glass 08 09 10 Backlight elements Bezel PCB、COB Criterion AQL The LCD with extensive crack is not acceptable. 2.5 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. 8.3 Backlight doesn’t light or color wrong. 0.65 2.5 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications. 10.1 COB seal may not have pinholes larger than 0.2mm or contamination. 10.2 COB seal surface may not have pinholes through to the IC. 10.3 The height of the COB should not exceed the height indicated in the assembly diagram. 10.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 10.5 No oxidation or contamination PCB terminals. 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 10.7 The jumper on the PCB should conform to the product characteristic chart. 10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down. 10.9 The Scraping testing standard for Copper Coating of PCB 0.65 2.5 0.65 2.5 2.5 0.65 2.5 2.5 0.65 0.65 2.5 2.5 X Y 11 Soldering X * Y