8331S-200ML

8331S Technical Data Sheet Silver Conductive Epoxy Adhesive Good Conductivity / Slow Cure ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA 8331S SAI Global File: 004008 Description This is a two-part, smooth, silver paste adhesive that cures to form a hard, durable polymer. In its cured state, it is highly electrically and thermally conductive. It adheres strongly to metals and glass, and it adheres well to most plastics used in electronic assemblies. It has a convenient 1-to-1 mix ratio and a long 4 hour working time. The mixed adhesive essentially acts like a one-part adhesive for the duration of a shift. But unlike one-part adhesives, it does not require high curing temperatures or frozen storage, and it has a very long shelf life. Applications & Usages The 8331S is used as a solder replacement for bonding heat-sensitive electronic components and for making conductive bonds where solder is not an option, such as when bonding to glass, soft metals. or plastics. It allows for quick cold soldering repairs of electronic devices, makes excellent thermal connections, provides excellent EMI/RFI shielding, and is very effective at filling in seams between metal plates. It is useful in applications where the high cure temperatures of one-part epoxy systems can potentially damage components. Its primary applications are in assembly of electronic devices. It is used in the automobile, aerospace, marine, communication, instrumentation, and industrial control equipment industries. It is also widely used by hobbyists and makers. Benefits and Features • Electrical resistivity: 0.0060 Ω·cm • Thermal conductivity: 0.85 W/(m·K) • 1:1 mix ratio by volume • Working time of 4 hours • Cure time: 2 hours at 65 °C • Good adhesive strength • Strong resistance to water, brine, acids, bases, and aliphatic hydrocarbons • Room temperature storage • Shelf life greater than three years Page 1 of 7 Rev. Date: 04 October 2017 / Ver. 2.07 ENVIRONMENT ✓ RoHS ✓ REACH compliant 8331S Technical Data Sheet Silver Conductive Epoxy Adhesive Good Conductivity / Slow Cure ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA Usage Parameters Properties Working Time a) Shelf Life Full Cure @65 °C [149 °F] Full Cure @80 °C [176 °F] Full Cure @100 °C [212 °F] 8331S SAI Global File: 004008 Temperature Ranges Value 4h ≥3 y 2h 1h 40 min Properties Constant Service Temperature Storage Temperature of Unmixed Parts Value -40 to 150 °C [-40 to 302 °F] 16 to 27 °C [60 to 80 °F] a) Cure and life values 5 g unless stated otherwise. Principal Components Name Part A: Epoxide Resin Metallic Silver Part B: Aliphatic Amines Metallic Silver CAS Number 28768-32-3 + 17557-23-3 7440-22-4 68082-29-1, 112-24-3, 68541-13-9, 4246-51-9 7440-22-4 Properties of Cured 8331S Physical Properties Color Density @25 °C [77 °C] Hardness Tensile Strength Elongation Young’s Modulus Lap Shear Strength (Stainless Steel 304) Lap Shear Strength (Aluminum 5052) Compressive Strength Solderable Outgassing (Total Mass Loss) @24 h Water vapor release Collectable Volatile Condensable Material Water absorption Method Visual ASTM D 1475 Shore D durometer ASTM D 638 " " ASTM D 1002 ASTM D 1002 ASTM D 695 ASTM E 595 " " Page 2 of 7 Rev. Date: 04 October 2017 / Ver. 2.07 Value a) Silver Grey 2.19 g/mL 73D 14 N/mm2 5.3% 760 MPa 1.1 N/mm2 4.8 N/mm2 65 N/mm2 No 0.43% 0.27% 0.04% 0.12% [2 000 lb/in2] [160 lb/in2] [690 lb/in2] [9 400 lb/in2] 8331S Technical Data Sheet Silver Conductive Epoxy Adhesive Good Conductivity / Slow Cure ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA 8331S SAI Global File: 004008 Electrical Properties b) Volume Resistivity After 65 °C [149 °F] cure Surface Resistance After 25 °C [149 °F] cure after 96 h After 65 °C [149 °F] cure after 1 h After 80 °C [176 °F] cure After 100 °C [212 °F] cure Method Method 5011.5 in MIL-STD-883H Value 0.0060 Ωcm Square Square Square Square ~0.35 Ω/sq 0.25–0.40 Ω/sq 0.15–0.20 Ω/sq 0.11–0.15 Ω/sq Thermal Properties Thermal Conductivity @25 °C [77 °F] Thermal Conductivity @50 °C [122 °F] Thermal Conductivity @100 °C [212 °F] Glass Transition Temperature (Tg) CTE c) prior Tg CTE c) after Tg Specific Heat @25 °C [77 °F] Method ASTM E 1461 " " ASTM D 3418 ASTM E 831 ASTM E 831 Probe Probe Probe Probe Value 0.85 W/(mK) 0.83 W/(mK) 0.96 W/(mK) 34 °C [93 °F] 78 ppm/°C 158 ppm/°C 0.90 J/(g∙K) Note: Specifications are for epoxy samples that were cured at 80 °C for 60 minutes. Additional curing time at room temperature was given to allow for optimum curing. Samples were conditioned at 23 °C and 50% RH prior to most tests. a) N/mm2 = mPa; lb/in2 = psi b) The uncured epoxy mixture does not conduct electricity well and can have high resistance. To attain stated resistivity, ensure that the mix ratio is followed and that the product is fully cured by heat curing. c) Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10 -6 = unit/unit/°C × 10-6 Properties of Uncured 8331S Physical Properties Color Density a) Mix Ratio by volume (A:B) Mix Ratio by weight (A:B) Solids Content (w/w) Physical Properties Color Density Flash Point Resistivity of uncured material Mixture Silver Grey 2.49 g/mL 1.0:1.0 1.17:1.0 100% Part A Silver Grey 2.55 g/mL >127 °C [261 °F] Off-scale (no reading) a) Calculated value based on measures densities of each part Page 3 of 7 Rev. Date: 04 October 2017 / Ver. 2.07 Part B Silver Grey 2.38 g/mL >93 °C [200 °F] Off-scale (no reading) 8331S Technical Data Sheet Silver Conductive Epoxy Adhesive Good Conductivity / Slow Cure ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA SAI Global File: 004008 8331S Extrusion Rate The extrusion rate for a ¼” nozzle for each adhesive parts with respect to pressure are given below. For extrusion rates with respect to other nozzle diameters, contact us at support@mgchemicals.com. 8331S Extrusion Rates for Part A and B Pressure lb/in2 40 50 60 70 80 90 Rate Part A g/min 521 628 731 832 931 1027 Rate Part B g/min 44 86 128 170 211 223 Note: Nozzle diameter = ¼" Compatibility Adhesion—As seen in the substrate adhesion table, the 8331S epoxy adheres to most materials found on printed circuit assemblies; however, it is not compatible with contaminants like water, oil, and greasy flux residues that may affect adhesion. If contamination is present, clean the printed circuit assembly with electronic cleaner such as MG Chemicals 4050 Safety Wash, 406B Super Wash, or 824 Isopropyl Alcohol. Substrate Adhesion in Decreasing Order Physical Properties Steel Aluminum Fiberglass Wood Paper, Fiber Glass Rubber Polycarbonate Acrylic Polypropylene a) Adhesion Stronger Weaker a) Does not bond to polypropylene Page 4 of 7 Rev. Date: 04 October 2017 / Ver. 2.07 8331S Technical Data Sheet Silver Conductive Epoxy Adhesive Good Conductivity / Slow Cure ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA 8331S SAI Global File: 004008 Storage Store between 22 and 27 °C [72 and 80 °F] in dry area away from sunlight. Prolonged storage or storage at or near freezing temperatures can result in crystallization. If crystallization occurs, reconstitute the component to its original state by temporarily warming it to 50 to 60 °C [122 to 140 °F]. To ensure full homogeneity, stir thoroughly the warm component, reincorporating all settled material. Re-secure container lid and let cool down before use. Health, Safety, and Environmental Awareness Please see the 8331S Safety Data Sheet (SDS) parts A and B for more details on transportation, storage, handling and other security guidelines. Health and Safety: The 8331S parts can ignite if the liquid is both heated and exposed to flames or sparks. Wear safety glasses or goggles and disposable polyvinyl chloride, neoprene, or nitrile gloves while handling liquids. Part B in particular causes skin burns and may cause sensitization if exposed over a long period of time. The epoxy will not wash off once cured: wear protective work clothing. Wash hands thoroughly after use or if skin contact occurs. Do not ingest. Use in well-ventilated area since vapors may cause irritation of the respiratory tract and cause respiratory sensitization in susceptible individuals. The cured epoxy resin presents no known hazard. Part A HMIS® RATING HEALTH: NFPA® 704 CODES * 2 FLAMMABILITY: 1 PHYSICAL HAZARD: 0 1 2 0 PERSONAL PROTECTION: Part B HMIS® RATING HEALTH: NFPA® 704 CODES * 2 FLAMMABILITY: 1 PHYSICAL HAZARD: 0 PERSONAL PROTECTION: Approximate HMIS and NFPA Risk Ratings Legend: 0 (Low or none); 1 (Slight); 2 (Moderate); 3 (Serious); 4 (Severe) Page 5 of 7 Rev. Date: 04 October 2017 / Ver. 2.07 1 2 0 8331S Technical Data Sheet Silver Conductive Epoxy Adhesive Good Conductivity / Slow Cure ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA 8331S SAI Global File: 004008 Application Instructions Follow the procedure below for best results. For mixing quantities that are less than 1 mL in size or for stricter stoichiometry control, mix by weight ratio instead (requires a high precision balance). Heat cure is recommended to get the best possible conductivity. CAUTION ! To prepare 1:1 (A:B) epoxy mixture Do not cross contaminate. 1. Remove syringe cap or jar cover. To avoid premature curing, 2. For jars, stir each part individually to re-incorporate material that use different stirring tools may have settled during storage. for parts A & B. 3. Measure one part by volume of A. 4. Measure one part by volume of B. 5. Thoroughly mix the parts together with a stir stick until homogeneous. 6. Apply to with an appropriate sized stick for the application area. NOTE: Remember to recap the syringe or container promptly after use. TIP: Due to the high viscosity and abrasiveness of the silver filler, you may preheat part A and part B to increase the flow and improve air release. To heat cure the 8331S epoxy Put in oven at 65 °C [149 °F] for 120 minutes. For optimum conductivity and faster cure, heat cure at temperatures up to 100 °C. TIP: Hair dryers are normally rated not to exceed 60 °C, so they can generally be used to accelerate the cure. You can cure the epoxy faster by using higher temperatures of up to 100 °C [302 °F]. ATTENTION : Keep the curing temperature well below temperature limit of heat sensitive components that may be present. As a guideline, remember that commercial grade devices normally can be safely operated up to 70 °C, industrial grade up to 85 °C, and military grade up to 175 °C. ATTENTION : Heat guns can easily exceed the temperature limits for your assembly: they should not be used. Packaging and Supporting Products Cat. No. 8331S-15G 8331S-50ML 8331S-200ML Packaging Syringe Jar Can Net Weight 14.7 g 123 g 492 g Page 6 of 7 Rev. Date: 04 October 2017 / Ver. 2.07 0.52 oz 4.34 oz 1.09 lb Packaging Weight 40 g 1.4 oz 190 g 0.4 lb 650 g 1.4 lb 8331S Technical Data Sheet Silver Conductive Epoxy Adhesive Good Conductivity / Slow Cure ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA SAI Global File: 004008 8331S Technical Support Contact us regarding any questions, improvement suggestions, or problems with this product. Application notes, instructions, and FAQs are located at www.mgchemicals.com. Email: support@mgchemicals.com Phone: +(1) 800-340-0772 +(1) 905-331-1396 +(44) 1663 362888 Fax: +(1) 905-331-2862 Mailing address: (Canada, Mexico & USA) (International) (UK & Europe) or +(1) 800-340-0773 Manufacturing & Support 1210 Corporate Drive Burlington, Ontario, Canada L7L 5R6 Head Office 9347–193rd Street Surrey, British Columbia, Canada V4N 4E7 Warranty M.G. Chemicals Ltd. warranties this product for 12 months from the date of purchase by the end user. M.G. Chemicals Ltd. makes no claims as to shelf life of this product for the warranty. The liability of M.G. Chemicals Ltd. whether based on its warranty, contracts, or otherwise shall in no case include incidental or consequential damage. Disclaimer This information is believed to be accurate. It is intended for professional end users having the skills to evaluate and use the data properly. M.G. Chemicals Ltd. does not guarantee the accuracy of the data and assumes no liability in connection with damages incurred while using it. Page 7 of 7 Rev. Date: 04 October 2017 / Ver. 2.07