RGTCM0806650H0T

Approval Sheet RGTCM Series – 0806(3025)- RoHS Compliance THIN FILM CERAMIC COMMON MODE FILTER Halogens Free Product P/N: RGTCM0806650H0T *Contents in this sheet are subject to change without prior notice. Page 1 of 7 ASC_RGTCM0806650H0T_V01 Mar. 2013 Approval Sheet FEATURES 1. Miniature footprint: 0.8 X 0.6 X 0.5 mm³. 2. Thin Film Technology. 3. Reflow Solderable SMD Devices. 4. Wide Pass Band( Cut- Off Frequency: -3dB : 4/5/8GHz Typical). 5. High attenuation for common mode noise. 6. This product contains no lead and supports lead-free Ni/Au soldering APPLICATIONS 1. For Super Speed Signal Line Application 2. LVDS/IEEE1394/HDMI/DVI/MIPI/USB3.0 CONSTRUCTION 4 3 2 1 DIMENSIONS Figure Page 2 of 7 1 4 2 3 Symbol Dimension (mm) L 0.88 ± 0.05 W 0.68 ± 0.05 T 0.50 ± 0.05 A 0.15 ± 0.05 B 0.20 ± 0.05 C 0.27 ± 0.10 D 0.62 ± 0.05 E 0.50 ± 0.10 F 0.82 ± 0.05 ASC_RGTCM0806650H0T_V01 Mar. 2013 Approval Sheet EQUIVALENT CIRCUIT ELECTRICAL CHARACTERISTICS Type Common Mode Impedance Max. DC Resistance Rated Current (Ω Ω) (Ω Ω) 65±20% 2.5±30% RGTCM0806650H0T Insulation Cut off Frequency Resistance (mA) Rated Voltage Ed(V) (GHz) typ. (MΩ Ω) min. 100 10 5G 10 Operating temperature range : -40℃ to +85℃ Typical electrical performance S-Parameter Impedance VS Frequency Characteristics TCM0806650H0 TCM0806650H0 TCM-650 TCM-650 SOLDER LAND PATTERN Figure B Dimension( mm) A 0.90 ± 0.10 B 0.50 ± 0.10 C 0.30 ± 0.10 D 0.30± 0.10 A C D Page 3 of 7 Symbol ASC_RGTCM0806650H0T_V01 Mar. 2013 Approval Sheet RELIABILITY TEST Test condition / Test method Test item Specification Solderability JIS C 0050-4.6 *Solder bath temperature：235 ± 5°C At least 95% of a surface of each terminal *Immersion time：2 ± 0.5 sec electrode must be covered by fresh solder. JESD22-B102D *Solder：Sn3Ag0.5Cu for lead-free Leaching *Solder bath temperature：260 ± 5°C Loss of metallization on the edges of each *Leaching immersion time：30 ± 0.5 sec electrode shall not exceed 25%. of metallization) IEC 60068-2-58 *Solder : SN63A (Resistance to dissolution Resistance to soldering heat *Preheating temperature：120~150℃, JIS C 0050-5.4 1 minute. Loss of metallization on the edges of each electrode shall not exceed 25%. No mechanical damage. *Solder temperature：270±5°C *Immersion time：10±1 sec *Solder：Sn3Ag0.5Cu for lead-free Samples shall satisfy electrical specification after test, meet Table 1. Table 1 Appearance Measurement to be made after keeping at Common Mode room temperature for 24±2 hrs Impedance Change DC Resistance Change Drop Test JIS C 0044 No damaged Within ± 20% Within ± 30% *Height：75 cm No mechanical damage. *Test Surface：Rigid surface of concrete Samples shall satisfy electrical specification after test, meet Table 1. or steel. *Times：6 surfaces for each units；2 times for each side. Vibration JIS C 0040 *Frequency：10Hz~55Hz~10Hz(1min) *Total amplitude：1.5mm *Test times：6hrs.(Two hrs each in three mutually perpendicular directions) Bending test JIS C 0051- 7.4.1 The middle part of substrate shall be No mechanical damage. pressurized by means of the pressurizing Samples shall satisfy electrical specification rod at a rate of about 1 mm/s per second after test, meet Table 2. until the deflection becomes 1mm/s and Table 2 then pressure shall be maintained for 5±1 sec. Measurement to be made after keeping at room temperature for 24±2 hours Page 4 of 7 ASC_RGTCM0806650H0T_V01 Appearance DC Resistance Change No damaged Within ± 30% Mar. 2013 Approval Sheet Temperature cycle JIS C 0025 1. 30±3 minutes at -40°C±3°C, No mechanical damage. 2. 10~15 minutes at room temperature, Samples shall satisfy electrical specification 3. 30±3 minutes at +85°C±3°C, after test, meet Table 1. 4. 10~15 minutes at room temperature, Total 100 continuous cycles Measurement to be made after keeping at room temperature for 24±2 hrs High temperature JIS C 0021 *Temperature：85°C±2°C No mechanical damage. *Test duration：1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test, meet Table 1. room temperature for 24±2 hrs Humidity (steady conditions) *Humidity：90% to 95% R.H. No mechanical damage. *Temperature：40±2°C Samples shall satisfy electrical specification JIS C 0022 *Time：1000+24/-0 hrs. after test, meet Table 1. Measurement to be made after keeping at room temperature for 24±2 hrs ※ 500hrs measuring the first data then 1000hrs data Low temperature JIS C 0020 *Temperature：-40°C±2°C No mechanical damage. *Test duration：1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test, meet Table 1. room temperature for 24±2 hrs Page 5 of 7 ASC_RGTCM0806650H0T_V01 Mar. 2013 Approval Sheet SOLDERING CONDITION Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2, Fig 2. Infrared soldering profile ORDERING CODE RG TCM Walsin Product code RG device TCM : Thin Film Common Mode Filter 0806 650 Dimension code H CM Impedance Application 650 : 65 ohm 0806 = Length 08 Width 06, 0 H: HDMI/DVI/LVDS /SATA/PCI-/DPort T Specification Packing Code from 0~9 dependent on different electrical specification T : Reeled Minimum Ordering Quantity: 10000 pcs per reel. PACKAGING Index A0 B0 ΦD T W Dimension(mm) 0.78±0.03 1.04±0.03 1.55±0.05 0.6±0.03 8.0±0.10 Index E F P0 P1 P2 Dimension(mm) 1.75±0.05 3.5±0.05 4.0±0.10 4.0±0.10 2.0±0.05 Reel dimensions Page 6 of 7 ASC_RGTCM0806650H0T_V01 Mar. 2013 Approval Sheet C Index Dimension (mm) A Φ178.0 B Φ60.0 A B C Φ13.0 Taping Quantity:10000 pieces per 7” reel CAUTION OF HANDLING Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party’s life, body or property. (1) (2) (3) (4) (5) (6) (7) (8) Aircraft equipment Aerospace equipment Undersea equipment Medical equipment Disaster prevention / crime prevention equipment Traffic signal equipment Transportation equipment (vehicles, trains, ships, etc.) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition Products should be storage in the warehouse on the following conditions. Temperature : -10 to +40℃ Humidity : 30 to 70% relative humidity Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of electrode, resulting in poor solderability. Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be storage under the airtight packaged condition. Page 7 of 7 ASC_RGTCM0806650H0T_V01 Mar. 2013