Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
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In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
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Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
use http://www.nexperia.com
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Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
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- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
- © Nexperia B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and
understanding,
Kind regards,
Team Nexperia
PCMF2DFN1; PCMF3DFN1
Common-mode EMI filter for differential channels with
integrated ESD protection
Rev. 2 — 28 April 2014
Product data sheet
1. Product profile
1.1 General description
The devices are common-mode ElectroMagnetic Interference (EMI) filters with integrated
ElectroStatic Discharge (ESD) protection for two and three differential channels. The
devices are designed to provide low insertion loss for differential high-speed signals on
each channel while unwanted common-mode signals are attenuated.
Each differential channel incorporates two signal lines that are coupled by integrated coils.
Diodes provide protection to downstream components from ESD voltages up to 15 kV on
each signal line.
Table 1.
Product overview
Type number
Number of
channels
Package
Name
Version
PCMF2DFN1
2
DFN2520-9
SOT1333-1
XSON9
PCMF3DFN1
3
DFN4020-14
SOT1334-1
XSON14
1.2 Features and benefits
Two and three differential channels
ESD protection up to 15 kV contact
common-mode EMI filter with integrated
discharge according to IEC 61000-4-2
ESD protection
Superior common-mode suppression
Maximum package height: 0.5 mm
over a wide frequency range
1.3 Applications
Smartphone, cellular and cordless
phone
MIPI D-PHY as used in Camera Serial
Interface (CSI) and Display Serial
Interface (DSI)
General-purpose EMI and
Radio-Frequency Interference (RFI)
filter and downstream ESD protection
Tablet PC and Mobile Internet
Device (MID)
High-Definition Multimedia Interface
(HDMI)
PCMF2DFN1; PCMF3DFN1
NXP Semiconductors
Common-mode EMI filter for differential channels with ESD protection
2. Pinning information
Table 2.
Pin
Pinning
Symbol
Description
Simplified outline
Graphic symbol
PCMF2DFN1 (SOT1333-1)
1
CH1_IN+
input channel 1
2
CH1_IN
input channel 1
1
3
GND
ground
2
4
CH2_IN+
input channel 2
3
5
CH2_IN
input channel 2
4
7
6
CH2_OUT
output channel 2
5
6
7
CH2_OUT+
output channel 2
8
CH1_OUT
output channel 1
9
CH1_OUT+
output channel 1
9
8
1
9
2
8
3
Transparent top view
DFN2520-9
4
7
5
6
aaa-007385
PCMF3DFN1 (SOT1334-1)
1
CH1_IN+
input channel 1
2
CH1_IN
input channel 1
1
3
GND_1
ground 1
2
4
CH2_IN+
input channel 2
3
5
CH2_IN
input channel 2
4
12
6
GND_2
ground 2
5
11
7
CH3_IN+
input channel 3
6
8
CH3_IN
input channel 3
7
10
9
CH3_OUT
output channel 3
8
9
10
CH3_OUT+
output channel 3
11
CH2_OUT
output channel 2
12
CH2_OUT+
output channel 2
13
CH1_OUT
output channel 1
14
CH1_OUT+
output channel 1
14
13
1
14
2
13
3
4
12
5
11
Transparent top view
DFN4020-14
6
7
10
8
9
aaa-007384
PCMF2DFN1_PCMF3DFN1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
2 of 14
PCMF2DFN1; PCMF3DFN1
NXP Semiconductors
Common-mode EMI filter for differential channels with ESD protection
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
PCMF2DFN1
DFN2520-9
plastic extremely thin small outline package;
no leads; 9 terminals; body 2 2.5 0.5 mm
SOT1333-1
PCMF3DFN1
DFN4020-14 plastic extremely thin small outline package;
no leads; 14 terminals; body 2 4 0.5 mm
SOT1334-1
4. Marking
Table 4.
Marking codes
Type number
Marking code
PCMF2DFN1
MP1
PCMF3DFN1
CMFMP1
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VI
input voltage
VESD
electrostatic discharge
voltage
Min
Max
Unit
0.5
5
V
contact discharge
15
15
kV
air discharge
15
15
kV
contact discharge
2
2
kV
air discharge
IEC 61000-4-2, level 4;
all input pins to ground
IEC 61000-4-2, level 4;
all output pins to ground
PCMF2DFN1_PCMF3DFN1
Product data sheet
2
2
kV
Tstg
storage temperature
55
+125
C
Tamb
ambient temperature
40
+85
C
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
3 of 14
PCMF2DFN1; PCMF3DFN1
NXP Semiconductors
Common-mode EMI filter for differential channels with ESD protection
6. Characteristics
6.1 Channel characteristics
Table 6.
Channel characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rs(ch)
channel series
resistance
single line; input to output
-
5
-
Cd
diode capacitance
f = 1 MHz; VI = 2.5 V
-
0.6
0.75
pF
IRM
reverse leakage
current
per line; VI = 5 V
-
-
100
nA
VBR
breakdown voltage
IR = 10 mA
6
-
9
V
VF
forward voltage
IF = 10 mA
0.6
-
1.1
V
positive transient
-
0.6
-
negative transient
-
0.6
-
-
0.6
-
Rdyn
dynamic resistance
TLP
surge
[1]
[2]
[3]
positive transient
-
0.6
-
positive transient; IPP = 4 A
[3]
-
4.8
-
V
negative transient; IPP = 5 A
[3]
-
3.6
-
V
TLP; ICL = 8 A
-
8
-
V
TLP; ICL = 12 A
-
10.5
-
V
TLP; ICL = 16 A
-
13.4
-
V
TLP; ICL = 8 A
-
6
-
V
TLP; ICL = 12 A
-
8.4
-
V
TLP; ICL = 16 A
-
10.7 -
V
negative transient
VCL
[1]
PCMF2DFN1_PCMF3DFN1
Product data sheet
clamping voltage
This parameter is guaranteed by design.
[2]
100 ns Transmission Line Pulse (TLP); 50 ; pulser at 70 to 90 ns.
[3]
According to IEC 61000-4-5 (8/20 s).
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
4 of 14
PCMF2DFN1; PCMF3DFN1
NXP Semiconductors
Common-mode EMI filter for differential channels with ESD protection
aaa-007659
5
aaa-007660
-1
ICL
(A)
ICL
(A)
4
-3
3
-5
2
1
3.0
-7
3.5
4.0
4.5
5.0
5.5
VCL (V)
-5
-2
-1
IEC 61000-4-5; tp = 8/20 s; negative pulse
Dynamic resistance with positive clamping;
typical values
Fig 2.
DDD
-3
VCL (V)
IEC 61000-4-5; tp = 8/20 s; positive pulse
Fig 1.
-4
Dynamic resistance with negative clamping;
typical values
DDD
,&/
$
,&/
$
9&/ 9
tp = 100 ns; Transmission Line Pulse (TLP)
Fig 3.
9&/ 9
tp = 100 ns; Transmission Line Pulse (TLP)
Dynamic resistance with positive clamping;
typical values
Fig 4.
Dynamic resistance with negative clamping;
typical values
The device uses an advanced clamping structure showing a negative dynamic resistance.
This snap-back behavior strongly reduces the clamping voltage to the system behind the
ESD protection during an ESD event. Do not connect unlimited DC current sources to the
data lines to avoid keeping the ESD protection device in snap-back state after exceeding
breakdown voltage (due to an ESD pulse for instance).
PCMF2DFN1_PCMF3DFN1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
5 of 14
PCMF2DFN1; PCMF3DFN1
NXP Semiconductors
Common-mode EMI filter for differential channels with ESD protection
6.2 Frequency characteristics
Table 7.
Frequency characteristics
Symbol Parameter
Conditions
Min
Typ
Max
Unit
f = 400 MHz
-
15
-
dB
f = 800 MHz
-
30
-
dB
f = 5 GHz
-
21
-
dB
[1]
-
0.6
-
dB
[1][2]
-
2.2
-
GHz
Common mode: S21cc
il
[1]
insertion loss
Differential mode: S21dd
il
insertion loss
f3dB
cut-off frequency
f = 1MHz
[1]
Measured with 4-port network analyzer; Rgen = 50 ; RL = 50 .
[2]
Normalized to attenuation at 1 MHz.
DDD
DDD
6GG
G%
6FF
G%
Fig 5.
I +]
Common-mode insertion loss; typical values
PCMF2DFN1_PCMF3DFN1
Product data sheet
Fig 6.
I +]
Differential-mode insertion loss; typical values
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
6 of 14
PCMF2DFN1; PCMF3DFN1
NXP Semiconductors
Common-mode EMI filter for differential channels with ESD protection
7. Application information
7.1 Application diagram
PCMF2DFN1
(PCMF3DFN1)
CLK_N
D0_P
D0_N
D1_P
D1_N
SYSTEM-ON-CHIP
(SoC)
FLEX FOIL
FLEX FOIL CONNECTOR
MIPI LANE MODULE
CLK_P
CAMERA
MODULE
SUPPLY AND
CONTROL
aaa-007392
Fig 7.
Application diagram for MIPI D-PHY CSI
PCMF3DFN1
CLK_P
CLK_N
D0_P
FLEX FOIL
LIQUID CRYSTAL
DISPLAY
(LCD)
D1_P
D1_N
FLEX FOIL CONNECTOR
MIPI LANE MODULE
D0_N
D2_P
D2_N
D3_P
D3_N
PCMF2DFN1
SYSTEM-ON-CHIP
(SoC)
SUPPLY,
CONTROL
AND BACKLIGHT
aaa-007393
Fig 8.
Application diagram for MIPI D-PHY DSI
PCMF2DFN1_PCMF3DFN1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
7 of 14
PCMF2DFN1; PCMF3DFN1
NXP Semiconductors
Common-mode EMI filter for differential channels with ESD protection
7.2 Eye diagram
aaa-007649
Data rate: 1.5 Gbit/s
Vertical scale = 28.7 mV/div
Horizontal scale = 100 ps/div
Fig 9.
MIPI D-PHY eye diagram
aaa-007648
Data rate: 3.4 Gbit/s
Vertical scale = 200 mV/div
Horizontal scale = 58.9 ps/div
Fig 10. HDMI eye diagram
PCMF2DFN1_PCMF3DFN1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
8 of 14
PCMF2DFN1; PCMF3DFN1
NXP Semiconductors
Common-mode EMI filter for differential channels with ESD protection
8. Package outline
0.5
max
0.9
0.7
0.05
0.00
0.2 min
6
5
0.25
0.15
2.6
2.4
3
2.0
0.5
1
9
0.152
0.050
2.1
1.9
Dimensions in mm
13-05-07
Fig 11. Package outline DFN2520-9 (SOT1333-1)
0.152
0.050
0.05
0.00
0.5 max
3.5
0.5
1
3
6
8
0.25
0.15
0.9
0.7
2.1
1.9
0.2
min
14
4.1
3.9
Dimensions in mm
9
13-05-07
Fig 12. Package outline DFN4020-14 (SOT1334-1)
PCMF2DFN1_PCMF3DFN1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
9 of 14
PCMF2DFN1; PCMF3DFN1
NXP Semiconductors
Common-mode EMI filter for differential channels with ESD protection
9. Soldering
Footprint information for reflow soldering of DFN2520-9 package
SOT1333-1
D1
(9x)
C
(8x)
Ay
solder land
occupied area
P1
DIMENSIONS in mm
P1
Ay
C
D1
0.50
2.30
1.07
0.30
Dimensions in mm
13-05-08
13-05-21
sot1333-1_fr
Fig 13. Reflow soldering footprint DFN2520-9 (SOT1333-1)
Footprint information for reflow soldering of DFN4020-14 package
SOT1334-1
D1
(14x)
C
(12x)
Ay
solder land
occupied area
DIMENSIONS in mm
P1
P1
Ay
C
D1
0.50
2.30
1.07
0.30
Dimensions in mm
13-05-08
13-05-21
sot1334-1_fr
Fig 14. Reflow soldering footprint DFN4020-14 (SOT1334-1)
PCMF2DFN1_PCMF3DFN1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
10 of 14
PCMF2DFN1; PCMF3DFN1
NXP Semiconductors
Common-mode EMI filter for differential channels with ESD protection
10. Revision history
Table 8.
Revision history
Document ID
Release
date
Data sheet status
Change
notice
Supersedes
PCMF2DFN1_PCMF3DFN1 v.2
20140428
Product data sheet
-
PCMF2DFN1_PCMF3DFN1 v.1
-
-
Modification:
PCMF2DFN1_PCMF3DFN1 v.1
PCMF2DFN1_PCMF3DFN1
Product data sheet
•
Surge rating adapted
20130606
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
11 of 14
PCMF2DFN1; PCMF3DFN1
NXP Semiconductors
Common-mode EMI filter for differential channels with ESD protection
11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PCMF2DFN1_PCMF3DFN1
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
12 of 14
PCMF2DFN1; PCMF3DFN1
NXP Semiconductors
Common-mode EMI filter for differential channels with ESD protection
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PCMF2DFN1_PCMF3DFN1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
13 of 14
PCMF2DFN1; PCMF3DFN1
NXP Semiconductors
Common-mode EMI filter for differential channels with ESD protection
13. Contents
1
1.1
1.2
1.3
2
3
4
5
6
6.1
6.2
7
7.1
7.2
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Channel characteristics . . . . . . . . . . . . . . . . . . 4
Frequency characteristics. . . . . . . . . . . . . . . . . 6
Application information. . . . . . . . . . . . . . . . . . . 7
Application diagram . . . . . . . . . . . . . . . . . . . . . 7
Eye diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 April 2014
Document identifier: PCMF2DFN1_PCMF3DFN1
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