SMD29175G

SMD29175G Datasheet revision 1.2 www.chipquik.com Tack Flux No-Clean in Jar 75g Product Highlights Ideal for all rework, solder, de-solder and reflow applications Non-corrosive, non-conductive, no-clean Tack flux will not run all over PCB when applied Has a pleasant odor Excellent wetting Easily cleaned with isopropyl alcohol (IPA) Attachment of BGA spheres Soldering flip chip components Long stencil life Wide process window Clear residue Can be used with Leaded and Lead-Free applications RoHS 3 and REACH compliant Specifications Flux Type: Flux Classification: Flux Activation Temperature: Packaging: Shelf Life: Synthetic No-Clean (for Leaded and Lead-Free applications) REL0 140°C (284°F) Jar 75g Refrigerated >24 months, Unrefrigerated >24 months Stencil Life >8 hours @ 20-50% RH 22-28°C (72-82°F) >4 hours @ 50-70% RH 22-28°C (72-82°F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store refrigerated or at room temperature 3-25°C (37-77°F). Do not freeze. Allow 4 hours for flux to reach an operating temperature of 20-25°C (68-77°F) before use. Transportation This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground or air will not impact this product’s stated shelf life. Conforms to the following Industry Standards: J-STD-004B, Amendment 1 (Solder Fluxes): RoHS 3 Directive (EU) 2015/863: 1 © 1994-2020 Chip Quik® Inc. Yes Yes