SMD291150G
Datasheet revision 1.2
www.chipquik.com
Tack Flux No-Clean in Jar 150g
Product Highlights
Ideal for all rework, solder, de-solder and reflow applications
Non-corrosive, non-conductive, no-clean
Tack flux will not run all over PCB when applied
Has a pleasant odor
Excellent wetting
Easily cleaned with isopropyl alcohol (IPA)
Attachment of BGA spheres
Soldering flip chip components
Long stencil life
Wide process window
Clear residue
Can be used with Leaded and Lead-Free applications
RoHS 3 and REACH compliant
Specifications
Flux Type:
Flux Classification:
Flux Activation Temperature:
Packaging:
Shelf Life:
Synthetic No-Clean (for Leaded and Lead-Free applications)
REL0
140°C (284°F)
Jar 150g
Refrigerated >24 months, Unrefrigerated >24 months
Stencil Life
>8 hours @ 20-50% RH 22-28°C (72-82°F)
>4 hours @ 50-70% RH 22-28°C (72-82°F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Store refrigerated or at room temperature 3-25°C (37-77°F). Do not freeze. Allow 4 hours for flux to reach an operating
temperature of 20-25°C (68-77°F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground
or air will not impact this product’s stated shelf life.
Conforms to the following Industry Standards:
J-STD-004B, Amendment 1 (Solder Fluxes):
RoHS 3 Directive (EU) 2015/863:
1
© 1994-2020 Chip Quik® Inc.
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