7016070520

TECHNICAL DATA SHEET R276 Solder Paste Dispensable, No-Clean Solder Paste for Leaded and Lead-free Alloys Product Description Kester R276 Solder Paste is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is available in leaded and lead-free alloys. The flow characteristics of R276 provide for excellent dispensing characteristics with a wide range of needle diameters. Performance Characteristics:  Available with leaded and lead-free alloys  Compatible with Kester EP256 stenciling solder paste  Classified as ROL0 per J-STD-004  Compliant to Bellcore GR-78 Standard Applications: For Dispensing:  86% Metal for -325 +500 mesh  86% Metal for -400 +500 mesh RoHS Compliance This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive. Additional RoHS information is located at https://www.kester.com/downloads/environmental. Physical Properties (Data given for Sn96.5Ag3.0Cu0.5 86% metal, -325+500 mesh) Viscosity (typical): 650 poise Malcom Viscometer @ 10 rpm and 25 °C Initial Tackiness (typical): 30 grams Tested to J-STD-005, IPC-TM-650, Method 2.4.44 Slump Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.35 R276 Solder Paste Technical Data Sheet Issue: 15 December 2020 Page 1 of 4 TECHNICAL DATA SHEET Solder Ball Test: Preferred Tested to J-STD-005, IPC-TM-650, Method 2.4.43 Wetting Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.45 Reliability Properties Copper Mirror Corrosion: Low Tested to J-STD-004, IPC-TM-650, Method 2.3.3 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Chloride and Bromides: None Detected Tested to J-STD-004, IPC-TM-650, Method 2.3.35 Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 Surface Insulation Resistance (SIR) (typical): Pass Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3 Blank R276 10 9.8*10 Ω 10 1.6*10 Ω 10 1.1*10 Ω Day 1 1.0*10 Ω Day 4 1.3*10 Ω Day 7 1.3*10 Ω 8 9 9 Availability R276 is available in Sn63Pb37, Sn96.5Ag3.0Cu0.5, Sn43Pb43Bi14, Sn10Pb88Ag2, Sn95.5Ag3.8Cu0.7 and Sn62Pb36Ag2 alloys with the recommended Type 3 powder mesh. For specific packaging information, please refer to https://www.kester.com. R276 Solder Paste Technical Data Sheet Issue: 15 December 2020 Page 2 of 4 TECHNICAL DATA SHEET Printing Parameters Needle Diameter Type 3 powder may be used with needle sizes down to 22 gauge Dispense Speed Capable of at least 4 dots per second Temperature/Humidity Optimal ranges are 21 to 25 °C (70 to 77 °F) and 35 to 65% RH Recommended Reflow Profile The recommended reflow profile for R276 made with SAC alloys is shown here. This profile is simply a guideline. Since R276 is a highly active solder paste, it can solder effectively over a wide range of profiles. Your optimal profile may be different from the one shown based on your oven, board and mix of defects. Please contact Kester if you need additional profiling advice. Recommended Profile Temperature 260 Peak Temp (235-250°C) 240 220 200 Reflow Zone 4590 secs typical 180 160 140 Ramp Rate