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TECHNICAL DATA SHEET R500 Solder Paste Dispensable Water Soluble Solder Paste Product Description Kester R500 Solder Paste is a water soluble solder paste formula specifically designed as a consistent dot dispensing paste for automated dispense equipment. This solder paste exhibits excellent wetting characteristics in a wide range of profiles. The activator package in this formula is extremely aggressive. It is active enough to remove tenacious oxide layers or to solder to OSP coated boards. R500 maintains its activity and tackiness characteristics for up to 8 hours. Performance Characteristics:  Excellent dispensing characteristics using 21 gauge needles and Type 3 powder  Capable of dispensing rate of 4 dots per second  Leaves bright/shiny solder joints after reflow  Scrap is reduced due to minimal paste clogging and separation  Residues easily removed with DI water  Classified as ORM0 per J-STD-004 Standard Applications:  86% Metal – Syringe Dispensing Physical Properties (Data given for Sn63Pb37 86% metal, -325 +500 mesh) Viscosity (typical): 1000 poise Malcom Viscometer @ 10 rpm and 25 °C Initial Tackiness (typical): 45 grams Tested to J-STD-005, IPC-TM-650, Method 2.4.44 Slump Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.35 Solder Ball Test: Preferred Tested to J-STD-005, IPC-TM-650, Method 2.4.43 R500 Solder Paste Technical Data Sheet Issue: 06 January 2021 Page 1 of 4 TECHNICAL DATA SHEET Wetting Test: Pass Tested to J-STD-005, IPC-TM-650, Method 2.4.45 Reliability Properties Copper Mirror Corrosion: Low Tested to J-STD-004, IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33 Chloride and Bromides: None Detected Tested to J-STD-004, IPC-TM-650, Method 2.3.35 Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 Surface Insulation Resistance (SIR) IPC (typical): Pass Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3 Blank Day 1 1.9 × 10 Ω Day 4 1.1 × 10 Ω Day 7 8.3 × 10 Ω R500 10 1.4 × 10 Ω 8 10 2.0 × 10 Ω 9 8.3 × 10 Ω 8 9 Availability Kester R500 is available in SAC305 and Sn63Pb37 alloys with Type 3 powder. Please visit https://www.kester.com for additional information. R500 Solder Paste Technical Data Sheet Issue: 06 January 2021 Page 2 of 4 TECHNICAL DATA SHEET Recommended Reflow Profile The recommended reflow profiles for R500 made with the SAC305 and Sn63Pb37 alloys are shown here. This profile is simply a guideline. Since R500 is a highly active, water soluble solder paste, it can solder effectively over a wide range of profiles. Your optimal profile may be different from the one shown based on your oven, board and mix of defects. Please contact Kester Technical Support if you need additional profiling advice. Cleaning R500 residues are best removed using automated cleaning equipment (in-line or batch). Deionized water is recommended for the final rinse. Water temperatures should be 49 to 60 °C (120 to 140 °F). Kester’s 5768 Bio-Kleen® saponifier can also be used in a 1 to 2% ratio for aqueous cleaning systems. R500 Solder Paste Technical Data Sheet Issue: 06 January 2021 Page 3 of 4 TECHNICAL DATA SHEET Recycling Services We provide safe and efficient recycling services to help companies meet their environmental and legislative requirements and at the same time, maximize the value of their waste streams. Our service collects solder dross, solder scrap, and various forms of solder paste waste. Please contact your local sales representative for recycling capabilities in your area or link here. Storage, Handling and Shelf Life Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity, reflow characteristics, and overall performance. R500 should be stabilized at room temperature prior to dispensing. R500 should be kept at standard refrigeration temperatures, 0 to 10 °C (32 to 50 °F). Please contact Kester if you require additional advice with regard to storage and handling of this material. Shelf life for both SAC305 and Sn63Pb37 alloys is 6 months from date of manufacture and held at 0 to 10 °C (32 to 50 °F). Health and Safety This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet and warning label before using this product. Safety Data Sheets are available at this link. Contact Information To confirm this document is the most recent version, please contact Assembly@MacDermidAlpha.com North America 109 Corporate Blvd. South Plainfield, NJ 07080, USA 1.800.253.7837 Europe Unit 2, Genesis Business Park Albert Drive Woking, Surrey, GU21 5RW, UK 44.01483.758400 Asia Pacific 8/F., Paul Y. Centre 51 Hung To Road Kwun Tong, Kowloon, Hong Kong 852.3190.3100 Also read carefully warning and safety information on the Safety Data Sheet. This data sheet contains technical information required for safe and economical operation of this product. READ IT THOROUGHLY PRIOR TO PRODUCT USE. Emergency safety directory assistance: US 1 202 464 2554, Europe + 44 1235 239 670, Asia + 65 3158 1074, Brazil 0800 707 7022 and 0800 172 020, Mexico 01800 002 1400 and (55) 5559 1588 DISCLAIMER: All statements, technical information and recommendations contained herein are based on tests we believe to be reliable, but the accuracy or completeness thereof is not guaranteed. No statement or recommendation shall constitute a representation unless set forth in an agreement signed by officers of seller and manufacturer. NO WARRANTY OF MERCHANTABILITY, WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE OR ANY IMPLIED WARRANTY IS MADE. The following warranty is made in lieu of such warranties and all other warranties, express, implied, or statutory. Products are warranted to be free from defects in material and workmanship at the time sold. The sole obligation of seller and manufacturer under this warranty shall be to replace any noncompliant product at the time sold. Under no circumstances shall manufacturer or seller be liable for any loss, damage or expense, direct, indirect, incidental or consequential, arising out of the inability to use the product. Notwithstanding the foregoing, if products are supplied in response to a customer request that specifies operating parameters beyond those stated above, or if products are used under conditions exceeding said parameters, the customer by acceptance or use thereof assumes all risk of product failure and of all direct, indirect, incidental and consequential damages that may result from use of the products under such conditions, and agrees to exonerate, indemnify, defend and hold harmless MacDermid, Incorporated and its affiliates therefrom. No suggestion for product use nor anything contained herein shall be construed as a recommendation to use any product in a manner that infringes any patent or other intellectual property rights, and seller and manufacturer assume no responsibility or liability for any such infringement. © 2019 MacDermid, Inc. and its group of companies. All rights reserved. “(R)” and “TM” are registered trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries. R500 Solder Paste Technical Data Sheet Issue: 06 January 2021 Page 4 of 4