TECHNICAL DATA SHEET
Leaded Solid Solder Wire
for High Reliability Soldering
Product Description
For soldering applications that require maximum reliability of solder joints, especially for surface
mounted components, through hole and final assembly, only solder of the highest purity is
acceptable. Kester does not make any vague claims of understanding solder purity. Only the
highest quality metals are used to make Kester Solder Wire. Complete analysis of Kester Solder
Wire proves that every batch conforms to the strictest quality controls in the solder industry.
Maximum Allowed Impurities
Kester Solder Wire meets IPC Specifications J-STD-006C Amendment 1.
Element
Symbol
ANSI/IPC J-STD-006C
Antimony
Sb
0.200
Copper
Cu
0.080
Gold
Au
0.050
Aluminum
Al
0.005
Cadmium
Cd
0.002
Zinc
Zn
0.003
Silver
Ag
0.100
Bismuth
Bi
0.100
Arsenic
As
0.030
Iron
Fe
0.020
Nickel
Ni
0.010
Indium
In
0.100
The component elements in each alloy shall deviate from their nominal mass percentage by not
more than 0.020% of the alloy mass when their nominal percentage is 0.10% to 1.0% to 5.0%.
Leaded Solid Solder Wire
Technical Data Sheet
Issue: 18 May 2021
Page 1 of 3
TECHNICAL DATA SHEET
Kester solder purchased directly or through stocking distributors will conform to these
requirements. Only highest purity virgin metals are used to make Kester wire. DOD-STD-20001A (Soldering Technology High Quality/High Reliability) states that it is the responsibility of the
manufacturer to select those materials and processes that will produce acceptable high
quality/high reliability products.
RoHS Compliance
Kester does not determine any applicable Restriction of Hazardous Substances (RoHS)
exemptions for our lead containing products at the user level.
Availability
Alloy
Melting Point
Sn63Pb37
183 °C (361 °F)
Sn60Pb40
183 to 190 °C (361 to 374 °F)
Sn50Pb50
183 to 212 °C (361 to 414 °F)
Sn40Pb60
183 to 238 °C (361 to 460 °F)
Sn5Pb93.5Ag1.5
296 to 301 °C (565 to 574 °F)
Sn5Pb95
301 to 314 °C (574 to 597 °F)
Other alloy compositions may be available. Consult your local Kester Sales Representative.
Leaded Solid Solder Wire
Technical Data Sheet
Issue: 18 May 2021
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TECHNICAL DATA SHEET
Recycling Services
We provide safe and efficient recycling services to help companies meet their
environmental and legislative requirements and at the same time, maximize
the value of their waste streams.
Our service collects solder dross, solder scrap, and various forms of solder
paste waste. Please contact your local sales representative for recycling
capabilities in your area or link here.
Storage, Handling and Shelf Life
Storage must be in a dry, non-corrosive environment between 10 to 40 °C (50 to 104 °F). The
surface may lose its shine and appear a dull shade of grey. This is a surface phenomenon and
is not detrimental to product functionality. Solid solder wire has a shelf life determined by the
alloy used in the wire. For alloys containing more than 70% lead, the shelf life is 2 years from
the date of manufacture. Other alloys have a shelf life of 3 years from the date of manufacture.
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment.
Read the Safety Data Sheet and warning label before using this product. Safety Data Sheets
are available at this link.
Contact Information
To confirm this document is the most recent version, please contact
Assembly@MacDermidAlpha.com
North America
109 Corporate Blvd.
South Plainfield, NJ 07080, USA
1.800.253.7837
Europe
Unit 2, Genesis Business Park
Albert Drive
Woking, Surrey, GU21 5RW, UK
44.01483.758400
Asia Pacific
8/F., Paul Y. Centre
51 Hung To Road
Kwun Tong, Kowloon, Hong Kong
852.3190.3100
Also read carefully warning and safety information on the Safety Data Sheet. This data sheet contains technical information required for safe and economical operation of this product. READ IT THOROUGHLY
PRIOR TO PRODUCT USE. Emergency safety directory assistance: US 1 202 464 2554, Europe + 44 1235 239 670, Asia + 65 3158 1074, Brazil 0800 707 7022 and 0800 172 020, Mexico 01800 002 1400 and (55)
5559 1588
DISCLAIMER: All statements, technical information and recommendations contained herein are based on tests we believe to be reliable, but the accuracy or completeness thereof is not guaranteed. No
statement or recommendation shall constitute a representation unless set forth in an agreement signed by officers of seller and manufacturer. NO WARRANTY OF MERCHANTABILITY, WARRANTY OF FITNESS
FOR A PARTICULAR PURPOSE OR ANY IMPLIED WARRANTY IS MADE. The following warranty is made in lieu of such warranties and all other warranties, express, implied, or statutory. Products are warranted to
be free from defects in material and workmanship at the time sold. The sole obligation of seller and manufacturer under this warranty shall be to replace any noncompliant product at the time sold. Under no
circumstances shall manufacturer or seller be liable for any loss, damage or expense, direct, indirect, incidental or consequential, arising out of the inability to use the product. Notwithstanding the foregoing, if
products are supplied in response to a customer request that specifies operating parameters beyond those stated above, or if products are used under conditions exceeding said parameters, the customer by
acceptance or use thereof assumes all risk of product failure and of all direct, indirect, incidental and consequential damages that may result from use of the products under such conditions, and agrees to
exonerate, indemnify, defend and hold harmless MacDermid, Incorporated and its affiliates therefrom. No suggestion for product use nor anything contained herein shall be construed as a recommendation to
use any product in a manner that infringes any patent or other intellectual property rights, and seller and manufacturer assume no responsibility or liability for any such infringement.
© 2019 MacDermid, Inc. and its group of companies. All rights reserved. “(R)” and “TM” are registered trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries.
Leaded Solid Solder Wire
Technical Data Sheet
Issue: 18 May 2021
Page 3 of 3