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2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 | 800 253 7837 | WWW.kester.com Coming Soon: NXG3 & NXG5 Zero Halogen Solder Pastes Formula NXG3 Application No-Clean Stencil Printing Alloy Product Characteristics Sn96.5Ag3.0Cu0.5 Zero halogen, lead-free, no-clean solder paste. NXG3 is engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically as bright as SnPb joints. Designed to be reflowable in air as well as nitrogen. Residue Characteristics Light colored Typical Metal Percentage and mesh size 88.5%, -325/+500 (Type 3) Compliant Specifications IPC/J-STD-004B Flux Designator ROL0 Suggested Packaging Style 500g jar or 600g cartridges Formula NXG5 Application No-Clean Stencil Printing Alloy Product Characteristics Sn96.5Ag3.0Cu0.5 Zero halogen, lead-free, no-clean solder paste. NXG5 is engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically as bright as SnPb joints. Prints down to 01005 pad sites for nitrogen reflow. Larger pad sizes reflowable in air as well as nitrogen. ICT-friendly Residue Characteristics Light colored Typical Metal Percentage and mesh size 88.5%, -400/+500 (Type 4) Compliant Specifications IPC/J-STD-004B Flux Designator ROL0 Suggested Packaging Style 500g jar or 600g cartridges WWW.Kester.com | 800 253 7837 | 3 see Page 4 for details Formula Application Alloy NXG3 Kester Lead-Free, Halogen-Free Product Characteristics Residue Characteristics Typical Metal Percentage and mesh size Compliant Specifications Suggested Packaging Style NXG33 No-Clean Stencil Printing No-Clean Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield le Formula NXG33 Zero halogen, lead-free, no-clean solder paste. NXG3 is engineered for manufacturing. NXG33 is engineered for the high thermal de the high thermal demands of assembling with lead-free alloys. Joints are of assembling with lead-free alloys. Joints are cosmetically b No-Clean Stencil cosmetically brightApplication as SnPb joints. Prints down to 01005 pad sites. SnPb joints. PrintsPrinting down to 01005 pad sites. Designed to be Designed to be reflowable able in air as well as nitrogen. Post soldering, the NXG33 off Alloy in air as well as nitrogen. Sn96.5Ag3.0Cu0.5 mized defects, including head-in-pillow and QFN/BGA voidin Product Designed to exceed customers’ expectations for high yield lead-free Characteristics manufacturing. NXG33 is engineered for the high thermal demands Light colored Light colored of assembling with lead-free alloys. Joints are cosmetically as bright as SnPb joints. Prints down to 01005 pad sites. to be reflow88.5%, -400/+500 (Type 4) 88.5%, -400/+500 (TypeDesigned 4) able in air as well as nitrogen. Post soldering, the NXG33 offers minimized defects, including head-in-pillow and QFN/BGA voiding. Telcordia Issue 1 GR-78-CORE Telcordia Issue 1 GR-78-CORE IPC/J-STD-004B Flux Designator ROL0 IPC/J-STD-004B Flux Designator ROL0 Residue Characteristics Light colored Typicalcartridges Metal Percentage and 500g jar; 600 or1400g mesh size 88.5%, -400/+500 (Type 500g4)jar; 600 or1400g cartridges Compliant Specifications IPC/J-STD-004B Flux Designator ROL0 Suggested Packaging Style 500g jar or 600g cartridges STANDARD SOLDER PASTE REFLOW PROFILE STANDARD SOLDERPASTE PASTE REFLOW PROFILE FOR KESTER CONTAINING FOR KESTER PASTE CONTAINING ALLOYS: Sn96.5Ag3.0Cu0.5 or Sn96.5Ag3.5 ALLOY: Sn96.5Ag3.0Cu0.5 Stage 1- Preheat Zone (Rapid Heating Stage) The purpose of this zone is to quickly bring the Stage 1- Preheat Zone assembly up to a temperature where solder pa (Rapid Heating Stage) can become highly chemically active. The purpose of this zone is to quickly bring the assembly up to a temperature where solder paste Stagechemically 2- Soak active. Zone can become highly (Temperature Equalization Stage) TheZone purpose of this stage is for the thermal ma Stage 2- Soak theEqualization assembly to reach (Temperature Stage)a uniform temperature so that a verymass small differentia The purpose ofplateau this stage is forthere the isthermal between theahottest coldest soldering locat of the assembly to reach uniformand temperature plateau so thatonthere is a very small differential the assembly. between the hottest and coldest soldering locations on the assembly. Stage 3- Reflow Zone (Rapid Heating and Cooling) Stage 3- Reflow Zone of this stage is to rapidly heat the The purpose (Rapid Heating and assemblyCooling) above the melting (liquidus) tempera The purpose of this stage is to rapidly heat the asof the solder and subsequently cool the assemb sembly above the melting (liquidus) temperature down quickly to solidify the solder. Wetting of of the solder and subsequently cool the assembly onto teh substrate and component metalization down quickly to solidify the solder. Wetting of in theand reflow zone. metalsolder onto theoccurs substrate component izations occurs in the reflow zone. 4 | 800 253 7837 | WWW.kester.com Kester Lead-Free Formula Kester Lead-Free NXG1 Application EnviroMark™ 907 No-Clean Stencil Printing Alloy Formula Sn96.5Ag3.0Cu0.5 No-Clean Stencil Printing NXG1 Sn96.5Ag3.0Cu0.5 Product Characteristics Designed to exceed customers’ expectations for high yield lead-free manufacturing. NXG1 is engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically as bright as SnPb joints. Prints down to 0201 pad sites. Designed to be reflowable in air as well as nitrogen. EM907 is a first generation solder paste engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically as bright as SnPb joints. Prints down to 0201 pad sites. Designed to be reflowable in air as well as nitrogen. Residue Characteristics Light colored Light colored Typical Metal Percentage 88.5%, -325/+500 (Type 3) 88.5%, -325/+500 (Type 3) Compliant Specifications Telcordia Issue 1 GR-78-CORE IPC/J-STD-004B Flux Designator ROL1 Telcordia Issue 1 GR-78-CORE IPC/J-STD-004B Flux Designator ROL0 Suggested Packaging Style 500g jar or 600g cartridges 500g jar; 600 or 750g DEK cartridges Formula EnviroMark™ 828 Application Formula Water-Soluble Stencil Printing Alloy EnviroMark™ 828 Sn96.5Ag3.0Cu0.5 Product Characteristics Kester EM828 provides excellent printability, activity, cleanability and low-voiding behavior. EM828 is very robust and can tolerate a wide variety of printing and reflow conditions. EM828 is a “state of the art” water-soluble lead-free paste that combines superior activity, cleanability and low-voiding. Residue Characteristics Cleanable in warm water Typical Metal Percentage 89.5%, -325/+500 (Type 3) Compliant Specifications IPC/J-STD-004B Flux Designator ORH1 Suggested Packaging Style 500g jar; 600 or 1400g cartridges Kester Part # Description Alloy Packaging 7032130810 NXG1 No-Clean, Type 3, 88.5% metalsl Sn96.5Ag3.0Cu0.5 500g jar 7032130811 NXG1 No-Clean, Type 3, 88.5% metalsl Sn96.5Ag3.0Cu0.5 600g cartridge 7006050810 EM907 No-Clean, Type 3, 88.5% metal Sn96.5Ag3.0Cu0.5 500g jar 7006050811 EM907 No-Clean, Type 3, 88.5% metal Sn96.5Ag3.0Cu0.5 600g cartridge 7006050819 EM907 No-Clean, Type 3, 88.5% metal Sn96.5Ag3.0Cu0.5 750g DEK cartridge 7004030824 EM828 Water-Soluble, Type 3, 89.5% metal Sn96.5Ag3.0Cu0.5 700g DEK Cartridge 7004030810 EM828 Water-Soluble, Type 3, 89.5% metal Sn96.5Ag3.0Cu0.5 500g jar 7004030811 EM828 Water-Soluble, Type 3, 89.5% metal Sn96.5Ag3.0Cu0.5 600g cartridge 7035050910 NXG-33 Type 4, 88.5% metal Sn96.5Ag3.0Cu0.5 500g jar 7035050911 NXG-33 Type 4, 88.5% metal Sn96.5Ag3.0Cu0.5 600g cartridge WWW.Kester.com | 800 253 7837 | 5 Solder Paste for Tin-lead No-Clean Water-Soluble Solder Paste for Stencil Printing Applications Formula Type Alloy Product Characteristics Residue Removal Easy Profile® Sn63Pb37 Easy Profile® 256 256HA Sn62Pb36Ag2 Sn63Pb37 High activity no-clean paste specifically engineered to provide excellent solderability to lead free component and board finishes. Consistent print volume regardless of process parameters and 0201 application capable. Wide reflow process window. Compatible with enclosed print head systems. Sn62Pb36Ag2 Standard no-clean paste for a wide variety of reflow profiles and printing conditions. Industry standard formula that performs well in a variety of applications. Compatible with enclosed print head systems. HydroMark 531 Sn63Pb37 R562 Sn62Pb36Ag2 Sn63Pb37 Sn62Pb36Ag2 This highly-active, anti-slump paste is produced consistently so that every batch Designed for maximum environmental results in high yield manufacturing. robustness and minimal void production, HydroMark 531 also offers extremely R562 has a stencil life of over 8 hours robust printing, even with idle time up to and may be used in a wide range 1 hour and print speeds of up to 6 in/sec. of humidities (10 - 85% RH). This very active formula is effective on a Compatible with enclosed print wide variety of metallizations, including head systems. palladium. Compatible with enclosed print head systems. Not normally required. Not normally required. Use de-ionized or soft tap water at 120-140° Use de-ionized or soft tap water at 120-140° Compliant Specifications Telcordia Issue 1 GR-78-CORE, IPC/J-STD-004B Classification ROL0 Telcordia Issue 1 GR-78-CORE, IPC/J-STD-004B Classification ROL0 IPC/J-STD-004B Classification ORM0 IPC/J-STD-004B Classification ORM0 Powder Mesh Size -325/+500 (Type 3) -325/+500 (Type 3) -325/+500 (Type 3) -325/+500 (Type 3) Metal % 90% 90% 90% 90% Suggested Packaging Style 500g jar, 600 or 750g DEK cartridges 500g jar, 600g, 1400g or 750g DEK cartridges 500g jar, 600g cartridges 500g jar, 600g, 1400g or 750g DEK cartridges Solder Paste for Syringe Dispensing Applications Formula Type R276 R500 Alloy Sn63Pb37 Sn63Pb37 Product Characteristics Provides optimal performance in all types of dispensing applications. R276 is packaged void-free to ensure consistent dispensing in high speed automated processes. Exhibits excellent dispensing characteristics with a wide range of needle diameters. The activator package in this formula is aggressive enough to remove tenacious oxide layers or solder to OSP coated boards. R500 delivers excellent wetting characteristics. Residue Removal Not normally required. Use de-ionized or soft tap water at 49-60°C (120-140°F). Compliant Specifications Telcordia Issue 1 GR-78-CORE, IPC/J-STD-004B Classification ROL0 IPC/J-STD-004B Classification ORM0 Powder Mesh Size -325/+500 (Type 3) -325/+500 (Type 3) Metal % 87% 86% Suggested Packaging Style 35g and 100g syringes 35g syringes *For lead based products, Kester produces solder powder in compliance to J-STD-006B for alloy purity and particle size distribution. 6 | 800 253 7837 | WWW.kester.com Solder Paste for Tin-leadDescription Kester Part # 7002020510 Kester Part # 7002020310 7002020510 7002020511 7002020310 7002020311 Easy Profile® 256HA No-Clean, Type 3, 90% metal Description Easy Profile® 256HA® No-Clean, Type 3, 90% metal Easy Profile 256HA No-Clean, Type 3, 90% metal Easy Profile® 256HA® No-Clean, Type 3, 90% metal Easy Profile 256HA No-Clean, Type 3, 90% metal Easy Profile® 256HA® No-Clean, Type 3, 90% metal 7001020510 7002020311 7001020310 7002020519 7001020511 7001020510 7001020311 256HA No-Clean, 90% metal Easy®Profile Easy Profile 256 No-Clean, Type 3,Type 90%3, metal ® 256HA No-Clean, 90% metal Easy®Profile 256 No-Clean, Type 3,Type 90%3, metal Easy Profile Type 3, 90% metal Easy Profile® 256 No-Clean, Easy Profile® 256 No-Clean, Type 3, 90% metal Type 3, 90% metal Easy Profile® 256 No-Clean, ® 7002020511 7001020310 7010020510 7001020511 7010020310 7001020311 7010020511 7001020518 7010020311 7010020510 Easy Profile 256HA No-Clean, Type 3, 90% metal ® Easy Profile 256 No-Clean, Type 3, 90% metal No-Clean, 3, 90%metal metal HydroMarkEasy 531Profile Water 256 Soluble, TypeType 3, 90% ® No-Clean, 3, 90%metal metal HydroMarkEasy 531Profile Water 256 Soluble, TypeType 3, 90% ® No-Clean, 3, 90%metal metal HydroMarkEasy 531Profile Water 256 Soluble, TypeType 3, 90% HydroMark 531 Water Soluble, Type 3, 90% metal ® HydroMark 531 Water Soluble, Type 3, 90% metal 7021020510 7010020310 7021020310 7010020511 7021020511 7010020311 7021020311 531 Water Typemetal 3, 90% metal R562HydroMark Water Soluble, TypeSoluble, 3, 90% 531 Water Typemetal 3, 90% metal R562HydroMark Water Soluble, TypeSoluble, 3, 90% R562HydroMark Water Soluble, TypeSoluble, 3, 90% 531 Water Typemetal 3, 90% metal R562 Water Soluble, Type 3, 90% metal 7016070520 7021020310 7016070504 7021020511 7017080520 7021020311 7017080504 7021020519 R562 WaterType Soluble, Type 3,metal 90% metal R276 No-Clean, 3, 87% R562 WaterType Soluble, Type 3,metal 90% metal R276 No-Clean, 3, 87% R562Soluble, Water Soluble, 3, 90% metal R500 Water Type 3,Type 86% metal R500 Water Type 3,Type 86% metal R562Soluble, Water Soluble, 3, 90% metal 7021020510 R562 Water Soluble, Type 3, 90% metal Alloy Sn63Pb37 Alloy Sn62Pb36Ag2 Sn63Pb37 Sn63Pb37 Sn62Pb36Ag2 Sn62Pb36Ag2 Sn63Pb37 Sn62Pb36Ag2 Sn63Pb37 Sn63Pb37 Sn62Pb36Ag2 Sn63Pb37 Sn63Pb37 Sn62Pb36Ag2 Sn62Pb36Ag2 Packaging 500g jar Packaging 500g jar 500g jar 600g cartridge 500g jar 600g cartridge 600g cartridge 600g cartridge 500g jar 750g DEK cartridge 500g jar 600g cartridge 600g cartridge 500g jar 500g jar Sn63Pb37 Sn63Pb37 600g cartridge 500g jar Sn62Pb36Ag2 Sn62Pb36Ag2 600g cartridge 500g jar Sn63Pb37 Sn63Pb37 750g DEK 600g cartridge cartridge Sn62Pb36Ag2 Sn63Pb37 Sn62Pb36Ag2 Sn63Pb37 Sn63Pb37 Sn62Pb36Ag2 Sn63Pb37 Sn62Pb36Ag2 Sn62Pb36Ag2 Sn63Pb37 600g cartridge 500g jar 500g jar 500g jar 600g cartridge 500g jar 600g cartridge 600g cartridge 600g cartridge 500g jar Sn62Pb36Ag2 Sn63Pb37 500g jar 35g syringe Sn63Pb37 Sn63Pb37 600g cartridge 100g syringe Sn62Pb36Ag2 Sn63Pb37 600g cartridge 35g syringe Sn63Pb37 Sn63Pb37 100g syringe 750g DEK cartridge 7016070520 R276 No-Clean, Type 3, 87% metal Sn63Pb37 35g syringe 7016070504 R276 No-Clean, Type 3, 87% metal Sn63Pb37 100g syringe 7017080520 R500 Water Soluble, Type 3, 86% metal Sn63Pb37 35g syringe WWW.Kester.com | 800 253 7837 | 7 Fluxes for Lead-Free Lead-free wave and selective soldering systems require exposing the flux to slightly higher soldering temperatures. Lead-free alloys traditionally wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for lead-free assembly have new activator packages to enable rapid wetting and hole-filling, ensuring reliable product output. *Formula 985M 959T 2220-VF VOC-Free 2235 No-Clean No-Clean Water-Soluble Water-Soluble Application Spray or Wave Fluxer Spray or Foam Spray, Wave or Foam Spray or Foam Halide Content % Halide - Free Halide - Free 1.6 1.6 Specific Gravity 0.805 0.794 1.060 0.856 Solids % 3.6 2.9 7 11 Compliant IPC/J-STD-004B IPC/J-STD-004B IPC/J-STD-004B IPC/J-STD-004B Flux Designator ROL0 Flux Designator ORL0 Flux Designator ORH1 Flux Designator ORH1 Kester Part # Description Packaging 63-0004-0985 985M No-Clean 1 gallon 64-0004-0985 985M No-Clean 5 gallon 65-0004-0985 985M No-Clean 53 gallon drum 63-0020-0959 959T No-Clean 1 gallon 64-0020-0959 959T No-Clean 5 gallon 65-0020-0959 959T No-Clean 53 gallon drum 63-0056-2220 2220-VF VOC-Free Water-Soluble 1 gallon 64-0056-2220 2220-VF VOC-Free Water-Soluble 5 gallon 65-0056-2220 2220-VF VOC-Free Water-Soluble 53 gallon drum 63-0000-2235 2235 Water-Soluble 1 gallon 64-0000-2235 2235 Water-Soluble 5 gallon 65-0000-2235 2235 Water-Soluble 53 gallon drum *These products are designed specifically for high performance lead-free applications. 8 | 800 253 7837 | WWW.kester.com No-Clean Fluxes No-Clean Fluxes Alcohol Based VOC-Free Formula 985M 959T 951 979 977 Flux Type Low Solids No-Clean Low Solids No-Clean Rosin-Free Low Solids, No Clean VOC-Free No-Clean VOC-Free No-Clean Percent Solids 3.6 2.9 2.0 4.2 3.25 VOCs (g/liter) 776 770 792 0 0 Specific Gravity 0.805 0.794 0.814 1.015 1.012 Designed for the wave soldering applications and gives excellent hole fill on thick board assemblies. Designed for the wave soldering of conventional and SMT board assemblies. Developed to minimize the formation of microsolderballs. Very low solids, rosin free, foam and spray application flux. Practically no residue after the soldering process. Developed to reduce bottomside micro-solder balling and bridging on glossy laminates and between connector pins. Designed as a spray flux, 979’s activation system provides excellent wetting producing complete and consistent hole-fill. Developed to reduce bottomside micro-solder balling and bridging. The wetting system is designed to allow for a larger process window and can survive the longer dwell times in extremely turbulent chip waves. Designed for spray applications. Compliant Specifications Telcordia Issue 1 GR-78-CORE & IPC/J-STD-004B Flux designator ROL0 Telcordia Issue 1 GR-78-CORE & IPC/J-STD-004B Flux designator ORL0 Telcordia Issue 1 GR-78-CORE & IPC/J-STD-004B Flux designator ORL0 Telcordia Issue 1 GR-78-CORE & IPC/J-STD-004B Flux designator ORL0 Telcordia Issue 1 GR-78-CORE & IPC/J-STD-004B Flux designator ORL0 Residue Removal (not normally required) Wash with Kester’s #5768 Bio-Kleen® saponifier at 2% concentration. Wash with Kester’s #5768 Bio-Kleen® saponifier at 2% concentration. Wash with Kester’s #5768 Bio-Kleen® saponifier at 2% concentration. Wash with hot de-ionized water at 49-60°C (140-160°F) or use 1% solution of Kester’s #5768 Bio-Kleen® Wash with hot de-ionized water at 49-60°C (140-160°F) or use 1% solution of Kester’s #5768 Bio-Kleen® Thinner 4662 4662 110 De-ionized Water De-ionized Water Flux Test Kit PS-20 PS-22 PS-22 PS-20 PS-20 Product Characteristics Kester Part # Description Packaging 63-0000-0951 951 No-Clean 1 gallon 64-0000-0951 951 No-Clean 5 gallon 65-0000-0951 951 No-Clean 53 gallon drum 63-0004-0985 985M No-Clean 1 gallon 64-0004-0985 985M No-Clean 5 gallon 65-0020-0959 985M No-Clean 53 gallon drum 63-0020-0959 959T No-Clean 1 gallon 64-0020-0959 959T No-Clean 5 gallon 65-0020-0959 959T No-Clean 53 gallon drum 63-0000-0977 977 VOC - Free No Clean 1 gallon 64-0000-0977 977 VOC - Free No Clean 5 gallon 65-0000-0977 977 VOC - Free No Clean 53 gallon drum 63-0000-0979 979 VOC - Free No Clean 1 gallon 64-0000-0979 979 VOC - Free No Clean 5 gallon 65-0000-0979 979 VOC - Free No Clean 53 gallon drum WWW.Kester.com | 800 253 7837 | 9 Water-Soluble Fluxes Water-Soluble Fluxes 10 Formula 2331-ZX 2235 2120 Flux Type Neutral pH Organic Water-Soluble Organic Water-Soluble Organic Water-Soluble Percent Solids 33 11 24 VOCs (g/liter) 729 763 670 Specific Gravity 0.899 ± 0.005 0.856 ± 0.005 0.862 ± 0.005 Percent Halides 2.2 1.5 Halide-Free Product Characteristics Original pH neutral organic flux for automated wave and drag soldering processes. Highly active flux for surface mount assemblies designed to help reduce skips on bottom side surface mount pads. Highly active, organic flux designed for automated wave soldering applications. This halide-free formula produces bright, shiny joints and high ionic cleanliness after water cleaning Compliant Specifications IPC/J-STD-004 Flux designator ORH1 IPC/J-STD-004 Flux designator ORH1 IPC/J-STD-004 Flux designator ORH0 Residue Removal Residue removal is required. Use soft or de-ionized water at temperatures of 49-66°C (120-150°F). Residue removal is required. Use soft or de-ionized water at temperatures of 49-66°C (120-150°F). Residue removal is required. Use soft or de-ionized water at temperatures of 49-66°C (120150°F). Thinner 4662 4662 4662 Kester Part # 63-0097-2331 64-0097-2331 65-0097-2331 Description 2331-ZX Water-Soluble 2331-ZX Water-Soluble 2331-ZX Water-Soluble Packaging 1 gallon 5 gallon 53 gallon drum 63-0000-2235 64-0000-2235 65-0000-2235 2235 Water-Soluble 2235 Water-Soluble 2235 Water-Soluble 1 gallon 5 gallon 53 gallon drum 63-0000-2120 65-0000-2120 2120 Water-Soluble 2120 Water-Soluble 1 gallon 53 gallon drum | 800 253 7837 | WWW.kester.com Rosin Based Fluxes Rosin Fluxes Formula 186 1544 Flux Type Rosin Mildly Activated (RMA) Activated Rosin (RA) Percent Solids 36 50 Specific Gravity 0.879 ± 0.005 Rosin Based Fluxes 186 Formula Percent Halides Flux Type Rosin Mildly Activated (RMA) Percent Solids Specific Gravity Percent Halides Product Characteristics Compliant Specifications Residue Removal 0.929 ± 0.005 1544 0.02 Activated Rosin (RA) 0.44 Kester's active, Non-corrosive rosin type Product 36 Designed for high thermal stability and 50 flux. Used on surfaces that are more Characteristics 0.879 ± 0.005 superior solderability. 0.928 ± 0.005 difficult to solder. 0.02 0.44 superior solderability. flux. Used on surfaces that are more Compliant IPC/J-STD-004 IPC/J-STD-004 Designed for high thermal stability Kester’s rosindesignator type ROM1 Specifications Fluxand designator ROL0 active, Non-corrosiveFlux Residue is non-corrosive, but may be difficultResidue to solder. is non-corrosive, but may be removed removed with solvent or with Kester’s ® with solvent ® IPC/J-STD-004 IPC/J-STD-004 or with Kester’s 5768 Bio-Kleen Residue Removal 5768 Bio-Kleen saponifier at 7-10% saponifier at 7-10% solution in de-ionized or Flux designatorsolution ROL0 in de-ionized or soft water Fluxatdesignator ROM1 soft water at temperatures of 49-60°C temperatures (120Residue is non-corrosive, but may be of 49-60°C Residue is non-corrosive, but may(120-140°)F. be removed with solvent or with Kester’s 5768 removed with solvent or with Kester’s 5768 Thinner 120 104 Bio-Kleen® saponifier at Bio-Kleen® saponifier at 7-10% solution in de-ionized or 7-10% solution in de-ionized or soft water at temperatures of soft water at temperatures of 49-60°C (120-140°F). 49-60°C (120-140°F). Thinner 120 104 Kester Part # Description Packa 63-0000-0186 186 RMA 1 gal 64-0000-0186 Packaging 186 RMA 5 gal 186 RMA 65-0000-0186 1 gallon 186 RMA 53 gallon 64-0000-0186 186 RMA 5 gallon 63-0000-1544 1544 RA 1 gal 65-0000-0186 186 RMA 64-0000-1544 53 gallon drum 1544 RA 5 gal 65-0000-1544 1544 RA 53 gallon Kester Part # Description 63-0000-0186 63-0000-1544 1544 RA 1 gallon 64-0000-1544 1544 RA 5 gallon 65-0000-1544 1544 RA 53 gallon drum Kester Flux-Pen® Kester Flux-Pen® ® Kester Flux-Pen is a unique tool for rework andIttouch-up soldering. It allows The Kester Flux-Pen® isThea unique tool for rework and touch-up soldering. allows controlled controlled application of flux, eliminating the mess from flux bottles. Flux-Pens application of flux, eliminating the mess from flux bottles. Flux-Pens are ideally suited for ideally suited for typical hand-soldering applications. The five available typical hand-soldering are applications. The five available formulas are listed below. formulas are listed below. Kester Part # Description Kester Part #985M Low Solids No-Clean (20 Description pens/carton) 83-1004-0985 83-1004-0985951 Low985M Solids No-Clean (20 pens/carton) SolidsLow No-Clean (20 pens/carton) 83-1000-0951 83-1000-0951 186-18951 Solids No-Clean (20 pens/carton) RMALowNo-Clean (20 pens/carton) 83-1018-0186 83-1018-0186 186-18 RMA No-Clean (20 pens/carton) 83-1000-0186 186 RMA No-Clean (20 pens/carton) 83-1097-2331 2331-ZX Neutral pH Water-Soluble (20 pens/carton) 83-1020-0959 959T Low Solids ®No-Clean (20 pens/carton) 83-1046-0952 952 D6 Low Solids No-Clean (20 pens/carton) 83-1000-0186 186 RMA No-Clean (20 pens/carton) 83-1097-2331 2331-ZX Neutral pH Water-Soluble (20pens/carton) 53-0000-0225 Flux-Pen Replacement Tips (25 tips/bag) WWW.Kester.com | 800 253 7837 | 11 1 STD-004 OL0 Kester Lead-Free Kester Lead-Free Solder Wires for Lead-Free Assembly Formula 48 Flux Content Activated Rosin Availability No-Clean Activated Rosin Water-Soluble