498-0090

Company Name： Digi International Customer Part Number： 984-63-052202 Mini PCI Express Socket 0.8Pitch 52P Pinrex Part Number： Description： 3FL-3,NO.16,LANE 609,SEC.5,CHUNG HSIN ROAD SAN CHUNG CITY,TAIPEI HSIEN,TAIWAN R.O.C. TEL : (02) 2999-9001 本公司通過 QA FAX : (02) 2999-9002 ISO9000 及 140001 認証 ATTEND SPECIFICATION AND PERFORMANCE TECHNOLOGY INC. SERIES: 119A DATE:2007/5/30 PAGE:1/3 Scope: This specification covers the requirements for product performance, test methods and quality assurance provisions of Mini PCI Express. Performance and Descriptions: The product is designed to meet the electrical, mechanical and environmental performance requirements specification. Unless otherwise specified, all tests are performed at ambient environmental conditions. ROHS: All material in according with the ROHS environment related substances list controlled. MATERIAL AND FINISH INSULATOR Material Housing: High Temperature Plastic UL94V-0 CONTACT Material Brass Plating Contact Plating: 3u” and 15u” selective gold. Solder: Lead free. Material Latch: Stainless SHELL OR COVER Plating OTHERWISE SPECIFIED Voltage rating: 50VAC Current: 0.5A Operating Temperature: -55℃~+85℃ ATTEND SPECIFICATION AND PERFORMANCE TECHNOLOGY INC. SERIES:119A DATE:2007/5/30 PAGE:2/3 ELECTRICAL Item Requirement Test Condition Contact resistance 30 milliohms Subject mated contacts assembled in housing to closed circuit current of 10mA(max) at open circuit voltage of 20mV voltage(Max). Insulation resistance 500MΩ(Min) Measured by applying 500VDC between adjacent contacts of unmated connector. Dielectric Strength No breakdown Current leakage: 0.5mA Measured by applying 250VAC for one minute between adjacent contacts of unmated connector assemblies. MIL-STD-202 method 301 MECHANICAL Item Requirement Test Condition Vibration test No electrical discontinuity greater than 1 microsecond. ΔR=20mΩ Max Physical shock 1.No electrical discontinuity greater than 1 microsecond 2.ΔR=20mΩ Max. No physical damage. Subject mated connectors to 10-55-10 Hz traversed in 1 minute at 1.52mm amplitude 2 hours each of 3 mutually perpendicular planes. MIL-STD-202 method 201. Subject mated connector to 50G’s，half-sine shock pulses of 11 millisecond duration，3drops in each PCB mating force Durability 124pos. 51.5N(5.3Kgf) Max. ΔR=20mΩ Max direction applied along the 3 mutually perpendicular planes total 18 drops. MIL-STD-202 method 202. Operation speed: 100mm/min measure the force required to mate connectors. Repeat insertion and extraction of PCB to and from the connector with the turns to lock it and then unlock it for 100 cycles. ATTEND TECHNOLOGY INC. SPECIFICATION AND PERFORMANCE SERIES:119A DATE:2007/5/30 PAGE:3/3 SOLDER ABILITY Item Requirement Solder ability Wet solder coverage: 95% Min. Resistance to Soldering heat. No physical damage. Test Condition Solder temperature: 260±5℃ Immersion duration: 3±0.5sec. ENVIRONMENTAL Item Requirement Humidity 1.Contact resistance: △R=20mΩ Max 2.Insulation resistance: 500mΩ Min. 3.No physical damage. Thermal shock 1.Contact resistance: △R=20mΩ Max. No physical damage Test Condition Expose the mated connectors to 40±2℃ Relative humidity 90~95% for 96 hours. MIL-STD-202 method 103. Expose the mated connectors to -55℃/30min and 85℃/30min. Repeat 5 cycles.