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date 06/10/2016
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1 of 36
SERIES: NEB-D Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
FEATURES
•
•
•
•
•
•
•
• pin and function compatible with
Architects of Modern Power™ product
standards
• eighth-brick with digital PMBus interface
58.4 x 22.7 x 10.2 mm
(2.299 x 0.894 x 0.402 in)
• industry standard 5-pins for
intermediate bus architectures
• industry-leading power density for
telecom and datacom 129~147W / sq. in
• high efficiency, typ. 95.2% at half load,
12 Vout
• fully regulated advanced bus converter
from 36~75Vin
• 2,250 Vdc input to output isolation
• fast feed forward regulation to manage
line transients
• optional baseplate for high temperature
applications
• droop load sharing with 10% current
share accuracy
• PMBus Revision 1.2 compliant
• 2.9 million hours MTBF
• ISO 9001/14001 certified supplier
SC
ON
TI
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configurable soft start/stop
precision delay and ramp-up
voltage margining
voltage/current/temperature monitoring
configurable output voltage
configurable fault response
power good
ED
GENERAL CHARACTERISTICS
MODEL
output voltage
output current
output wattage
(Vdc)
(Vdc)
max
(A)
max
(W)
NEB-264DWA-AN
36~75
12
22
264
NEB-300DMA-AN
40~60
12
25
300
NEB-261DWB-AN
36~75
12.45
22
261
DI
input voltage
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date 06/10/2016 Ϳ page 2 of 36
PART NUMBER KEY
NEB- XXX D X X - X X X X - XXX -ES X
Base Number
UE
D
Engineering Phase:
A~Z
Design Output Power:
1~999
Engineering Sample:
ES
Digital Interface
Heatsink Option:
"blank" = open frame
+ KHDWVLQNÀDW
G = heatsink with GND pin
Enable Logic Sense:
N = negative logic
P = positive logic
DI
SC
ON
T
Nominal Output Voltage:
A = 12.0 V
B = 12.45 V
C = 9.6 V
Load Sharing Function:
D = 9.0 V
D = Vout droop
IN
)LUPZDUH&RQ¿JXUDWLRQ
000~ZZZ
Input Voltage Range:
W = wide (36~75 V)
M = medium (40~60 V)
Pin Description:
A = 5.33 mm (0.210 in.)
B = 4.57 mm (0.180 in.)
D = 2.79 mm (0.110 in.)
F = 3.69 mm (0.145 in.)
S = SMT
Packaging:
20 converters(through hole pin)/tray, PE foam dissipative
20 converters(surface mount pin)/tray, Antistatic PPE
Example part number: NEB-264DWA-AN-001
264 W output power, digital pins
wide input voltage range, 12.0 V output
5.33 mm pins, negative enable logic
¿UPZDUHUHYLVLRQ
CONTENTS
Part Number Key........................................................2
General Information...................................................3
6DIHW\6SHFL¿FDWLRQ
Absolute Maximum Ratings..........................................4
(OHFWULFDO6SHFL¿FDWLRQ
12V, 22A, 264W, 36~75Vin; NEB-264DWA-AN.....................6
12 V, 25 A, 300 W, 40~60 Vin; NEB-300DMA-AN...................10
12.45V, 22A, 261W, 36~75Vin; NEB-261DWB-AN...............14
12.45 V, 25 A, 296 W, 40~60 Vin; NEB-296DMB-AN...............17
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Operating Information...................................21
Thermal Consideration..................................24
Connections............................................25
PMBus Interface...........................................26
Mechanical Information.................................29
Soldering Information...................................32
Delivery Package Information.........................33
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CUI Inc Ϳ SERIES: NEB-D Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
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General Information
Telcordia SR-332 Issue 2 also provides techniques to
HVWLPDWHWKHXSSHUFRQ¿GHQFHOHYHOVRIIDLOXUHUDWHVEDVHG
on the mean and standard deviation.
Mean steady-state failure rate, λ Std. deviation, σ
60.9 nF ailures/h
MTBF (mean value) for the NEB series = 2.91 Mh.
07%)DWFRQ¿GHQFHOHYHO 0K
Compatability with RoHS requirements
CUI Power Modules DC/DC converters and DC/DC
UHJXODWRUVDUH8/UHFRJQL]HGDQGFHUWL¿HGLQ
DFFRUGDQFHZLWK(17KHÀDPPDELOLW\UDWLQJIRU
all construction parts of the products meet requirements
for V-0 class material according to IEC 60695-11-10, Fire
KD]DUGWHVWLQJWHVWÀDPHV±:KRUL]RQWDODQGYHUWLFDO
ÀDPHWHVWPHWKRGV
Isolated DC/DC converters
*DOYDQLFLVRODWLRQEHWZHHQLQSXWDQGRXWSXWLVYHUL¿HG
in an electric strength test and the isolation voltage
(Viso) meets the voltage strength requirement for basic
insulation according to IEC/EN/UL 60950-1.
TI
The products are compatible with the relevant clauses
and requirements of the RoHS directive 2011/65/EU and
have a maximum concentration value of 0.1% by weight
in homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
Component power supplies for general use should comply
with the requirements in IEC/EN/UL 60950 1 Safety
of Information Technology Equipment. Product related
standards, e.g. IEEE 802.3af Power over Ethernet, and
ETS 300132 2 Power interface at the input to telecom
equipment, operated by direct current (dc) are based on
IEC/EN/UL 60950 1 with regards to safety.
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421 n F ailures/h
the responsibility of the installer to ensure that the
¿QDOSURGXFWKRXVLQJWKHVHFRPSRQHQWVFRPSOLHVZLWK
the requirements of all applicable safety standards and
UHJXODWLRQVIRUWKH¿QDOSURGXFW
ED
Reliability
7KHIDLOXUHUDWHNJDQGPHDQWLPHEHWZHHQIDLOXUHV
07%) NJLVFDOFXODWHGDWPD[RXWSXWSRZHUDQG
an operating ambient temperature (TA) of +40°C. CUI
Power Modules uses Telcordia SR-332 Issue 2 Method 1 to
calculate the mean steady-state failure rate and standard
GHYLDWLRQı
Exemptions in the RoHS directive utilized in CUI
Power Modules products are found in the Statement of
Compliance document.
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It is recommended to use a slow blow fuse at the input
RIHDFK'&'&FRQYHUWHU,IDQLQSXW¿OWHULVXVHGLQWKH
FLUFXLWWKHIXVHVKRXOGEHSODFHGLQIURQWRIWKHLQSXW¿OWHU
In the rare event of a component problem that imposes a
short circuit on the input source, this fuse will provide the
following functions:
Safety Specification
General Information
CUI Power Modules DC/DC converters and DC/DC
regulators are designed in accordance with the safety
standards IEC60950-1, EN60950-1 and UL60950-1 Safety
of Information Technology Equipment
• Isolate the fault from the input power source so as not to
affect the operation of other parts of the system
• Protect the distribution wiring from excessive current and
power loss thus preventing hazardous overheating
IEC/EN/UL60950-1 contains requirements to prevent
injury or damage due to the following hazards:
The DC/DC converter output is considered as safety extra
low voltage (SELV) if one of the following conditions is
met:
Electrical Shock
Energy hazards
Fire
Mechanical and heat hazards
Radiation hazards
Chemical hazards
DI
•
•
•
•
•
•
On-board DC/DC converters and DC/DC regulators are
GH¿QHGDVFRPSRQHQWSRZHUVXSSOLHV$VFRPSRQHQWV
they cannot fully comply with the provisions of any
safety requirements without “conditions of acceptability”.
Clearance between conductors and between conductive
parts of the component power supply and conductors on
WKHERDUGLQWKH¿QDOSURGXFWPXVWPHHWWKHDSSOLFDEOH
safety requirements. Certain conditions of acceptability
apply for component power supplies with limited stand-off
(see Mechanical Information for further information). It is
•The input source has double or reinforced insulation from
the AC mains according to IEC/EN/UL 60950-1
•The input source has basic or supplementary insulation
from the AC mains and the input of the DC/DC converter
is maximum 60 Vdc and connected to protective earth
according to IEC/EN/UL 60950-1
•The input source has basic or supplementary insulation
from the AC mains and the DC/DC converter output is
connected to protective earth according to IEC/EN/UL
60950-1
Non - isolated DC/DC regulators
The DC/DC regulator output is SELV if the input source
meets the requirements for SELV circuits according to IEC/
EN/UL 60950-1.
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CUI Inc Ϳ SERIES: NEB-D Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 06/10/2016 Ϳ page 4 of 36
Absolute Maximum Ratings
parameter
conditions/description
min
max
units
operating temperature (TP1)
see thermal consideration section
-40
+125
°C
-55
+125
°C
-0.5
+80
+65*
V
storage temperature (TS)
input voltage (VI)
typ
input to output test voltage, see note 1
2250
Vdc
input voltage transient (Vtr)
according to ETSI EN 300 132-2 and Telcordia GR1089-CORE
+100
+80*
V
remote control pin voltage (VRC)
see operating information section
-0.3
18
V
-0.3
3.6
V
SALERT, CTRL, SCL, SDA, SA0,
SA1 (V Logic I/O)
ED
isolation voltage (Viso)
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Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are normally tested with one
SDUDPHWHUDWDWLPHH[FHHGLQJWKHOLPLWVLQWKH(OHFWULFDO6SHFL¿FDWLRQ,IH[SRVHGWRVWUHVVDERYHWKHVHOLPLWVIXQFWLRQDQGSHUIRUPDQFHPD\GHJUDGHLQDQXQVSHFL¿HGPDQQHU
Note 1: Isolation voltage (input/output to base-plate) max 750 Vdc.
* Applies for the narrow input version VI= 40-60 V
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Fundamental Circuit Diagram
SC
ON
+IN
Driver
+OUT
-OUT
-IN
DI
Auxillary
Supply
Driver
Control
RC
RC isolation
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Functional Description
TP1, TP3 = -40 to +90ºC, VI WR9VHQVHSLQVFRQQHFWHGWRRXWSXWSLQVXQOHVVRWKHUZLVHVSHFL¿HGXQGHU&RQGLWLRQV
Typical values given at: TP1, TP3 = +25°C, VI= 53 V, max IOXQOHVVRWKHUZLVHVSHFL¿HGXQGHU&RQGLWLRQV
&RQ¿JXUDWLRQ)LOH&'$
parameter
conditions/description
min
typ
max
units
-2
±0.5
2
%
output voltage (VOUT_READ)
VI = 53V
-1.0
±0.1
1.0
%
output current (IOUT_READ)
VI = 53V, 50-100% of max IO
VI = 53V, 10% of max IO
-6
-0.6
±0.15
6
0.6
%
A
temperature (TEMP_READ)
controller IC internal sensor
0
5
10
32
0.5
2
1
input voltage (VIN_READ)
fault protection
characteristics
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input under voltage lockout
(UVLO)
factory default
setpoint accuracy
hysteresis: factory default
K\VWHUHVLVFRQ¿JXUDEOHYLD30%XVRIWKUHVKROG
range, note 1
delay
output voltage - under voltage
protection (VOUT_UV_FAULT_
LIMIT)
factory default
FRQ¿JXUDEOHYLD30%XVQRWH
fault response time
output voltage - over voltage
protection (VOUT_OV_FAULT_
LIMIT)
factory default
FRQ¿JXUDEOHYLD30%XVQRWH
fault response time
over current protection (OCP)
setpoint accuracy (IO)
IOUT_OC_FAULT_LIMIT: factory default
,287B2&B)$8/7B/,0,7FRQ¿JXUDEOHYLD30%XV
note 1
fault response time
0
0
300
0
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VOUT
SC
ON
over temperature protection
(OTP)
ED
PMBus monitoring accuracy
OTP_FAULT_LIMIT: factory default
273B)$8/7B/,0,7FRQ¿JXUDEOHYLD30%XVQRWH
hysteresis: factory default
K\VWHUHVLVFRQ¿JXUDEOHYLD30%XVQRWH
fault response time
-6
0
0
200
15.6
200
25
0
125
10
300
C
V
V
V
V
NjV
16
V
V
NjV
16
V
V
NjV
6
100
200
-50
º
%
A
A
NjV
C
C
º
C
º
C
NjV
º
125
125
º
logic input/output
characteristics
logic input low (VIL)
CTRL, SA0, SA1, PG, SCL, SDA
logic input high (VIH)
CTRL, SA0, SA1, PG, SCL, SDA
logic output low (VOL)
CTRL, PG, SALERT, SCL, SDA
IOL = 6 mA
logic output high (VOH)
CTRL, PG, SALERT, SCL, SDA
IOH = -6 mA
2.7
V
bus free time T(BUF)
note 2
1.3
NjV
1: See Operating Information section.
DI
Note
2: PMBus timing parameters according to PMBus spec.
cui.com
1.1
2.1
V
V
0.25
V
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CUI Inc Ϳ SERIES: NEB-D Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 06/10/2016 Ϳ page 6 of 36
Electrical Specification
12 V, 22 A, 264 W
TP1 = -40 to +90ºC, VI WR9VHQVHSLQVFRQQHFWHGWRRXWSXWSLQVXQOHVVRWKHUZLVHVSHFL¿HGXQGHU&RQGLWLRQV
Typical values given at: TP1 = +25°C, VI = 53 V, max IOXQOHVVRWKHUZLVHVSHFL¿HGXQGHU&RQGLWLRQV
Additional Cin= 0.1 mF, Cout = 0.1 mF. See Operating Information section for selection of capacitor types.
&RQ¿JXUDWLRQ)LOH&'$
conditions/description
min
typ
input voltage range (VI)
36
turn-off input voltage (VIoff)
decreasing input voltage
turn-on input voltage (VIon)
increasing input voltage
max
32
34
internal input capacitance (CI)
75
V
33
34
V
35
36
11
output power (PO)
0
power dissipation (Pd)
max IO
264
15.5
input idling power (Pli)
IO = 0 A, VI = 53 V
input standby power (PRC)
VI = 53 V (turned off with RC)
default switching frequency (fs)
0-100% of max IO
output voltage initial setting
and accuracy (VOi)
TP1 = +25°C, VI = 53 V, IO = 12 A
output adjust range (VO)
see operating information
output voltage tolerance band
(VO)
V
Nj)
94.7
94.5
95.2
94.8
NU
HI¿FLHQF\dž
50% of max IO
max IO
50% of max IO, VI = 48 V
max IO, VI = 48 V
units
ED
parameter
W
%
%
%
%
22
W
3.5
W
0.4
W
180
189
kHz
11.88
12.0
12.12
V
6.9
13.2
V
0-100% of max IO
11.76
12.24
V
11.88
IO = 0 A
max IO
SC
ON
idling voltage (VO)
line regulation (VO)
TI
171
12.12
V
100
200
mV
30
100
mV
load regulation (VO)
VI = 53 V, 1-100% of max IO
load transient voltage deviation
(Vtr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
$NjV&out = 2.2 mF OSCON type
±350
mV
load transient recovery time
(ttr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
$NjV&out = 2.2 mF OSCON type
200
µs
ramp-up time (tr) - (from
íRI9Oi)
10-100% of max IO
8
ms
start-up time (ts) - (from VI
connection to 90% of VOi)
10-100% of max IO
23
ms
VI shut-down fall time (tf) (from VI off to 10% of VO)
max IO
IO = 0 A
0.7
6
ms
s
RC start-up time (tRC)
max IO
12
ms
RC shut-down fall time (tRC) (from RC off to 10% of VO)
max IO
IO = 0 A
3
6
ms
s
DI
output current (IO)
current limit threshold (Ilim)
VO = 10.8 V, TP1 < max TP1
short circuit current (Isc)
TP1 = 25ºC, see Note 1
recommended capacitive load
(Cout)
TP1 = 25ºC, see Note 2
output ripple & noise (VOac)
See ripple & noise section, VOi
over voltage protection (OVP)
TP1 = +25°C, VI = 53 V, 10-100 % of max IO
remote control (RC)
sink current (note 3), see operating information
trigger level, decreasing RC-voltage
trigger level, increasing RC-voltage
Note
0
24
22
25
26
1.1
0
A
A
2.2
6
mF
50
100
mVp-p
15.6
2.6
2.9
1: OCP in hic-up mode
2: Low ESR-value
3: Sink current drawn by external device connected to the RC pin. Minimum sink current required to guarantee activated RC function.
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A
V
0.7
mA
V
V
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date 06/10/2016 Ϳ page 7 of 36
Typical Characteristics
12 V, 22 A, 264 W
Efficiency
Power Dissipation
100
ED
[W]
20
[%]
16
95
36 V
90
53 V
85
36 V
12
48 V
48 V
8
75 V
53 V
75 V
4
NU
80
0
75
0
5
10
15
20
25 [A]
Efficiency vs. load current and input voltage at T P1 = +25°C.
Output Characteristics
0
5
10
15
20
25 [A]
Dissipated power vs. load current and input voltage at
T P1 = +25°C.
Current Limit Characteristics
[V]
[V]
12.20
TI
15.00
12.10
36 V
48 V
12.00
CO
N
53 V
75 V
11.90
11.80
0
5
10
15
20
25 [A]
DI
S
Output voltage vs. load current at T P1 = +25°C.
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12.00
36 V
9.00
48 V
53 V
6.00
75 V
3.00
0.00
15
18
21
24
27 [A]
Output voltage vs. load current at I O > max I O , T P1 = +25°C.
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Typical Characteristics
12 V, 22 A, 264 W
Shut-down
Start-up enabled by connecting V I at:
T P1 = +25°C, V I = 53 V,
I O = 22 A resistive load.
Top trace: output voltage (5 V/div).
Bottom trace: input voltage (50 V/div).
Time scale: (5 mS/div)
Shut-down enabled by disconnecting V I at:
T P1 = +25°C, V I = 53 V,
I O = 22 A resistive load.
Top trace: output voltage (5 V/div).
Bottom trace: input voltage (50 V/div).
Time scale: (2 mS/div).
Output Load Transient Response
SC
ON
TI
Output Ripple & Noise
NU
ED
Start-up
Output voltage ripple at:
T P1 = +25°C, V I = 53 V,
I O = 22 A resistive load.
Trace: output voltage (20 mV/div).
Time scale: (2 uS/div).
Output voltage response to load current step- Top trace: output voltage (0.5 V/div).
change (5.5 – 16.5 – 5.5 A) at:
Bottom trace: load current (5 A/div).
T P1 =+25°C, V I = 53 V. C O = 2.2 mF.
Time scale: (0.5 mS/div)
DI
Input Voltage Transient Response
Output voltage response to input voltage
transient at: T P1 = +25°C, V I = 36-75 V,
I O = 11 A resistive load, C O = 2.2 mF
Top trace: output voltage (2 V/div.).
Bottom trace: input voltage (20 V/div.).
Time scale: (0.5 ms/div.).
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Typical Characteristics
12 V, 22 A, 264 W
Output Current Derating – Open frame
[A]
25
2.0 m/s
15
1.5 m/s
ED
3.0 m/s
20
1.0 m/s
10
0.5 m/s
5
Nat. Conv.
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate
NU
0
Thermal Resistance – Base plate
[A]
25
[°C/W]
3.0 m/s
20
5
TI
2.0 m/s
6
15
1.5 m/s
1.0 m/s
10
0.5 m/s
5
3
2
1
SC
ON
Nat. Conv.
4
0
0
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate + Heat sink
[A]
25
0.0
25
20
15
1.5 m/s
10
1.0 m/s
DI
0
20
40
60
2.5
3.0 [m/s]
Tamb
85°C
15
10
Nat. Conv.
80
2.0
A
2.0 m/s
0
1.5
Output Current Derating – Cold wall sealed box
20
0.5 m/s
1.0
Thermal resistance vs. airspeed measured at the converter. Tested in
wind tunnel with airflow and test conditions as per the Thermal
consideration section. V I = 53 V.
3.0 m/s
5
0.5
5
0
100 [°C]
0
Available load current vs. base plate temperature.
V I = 53 V. See Thermal Consideration section. Tested with Plate Fin
Transverse heatsink, height 0.23 In, P0114 Thermal Pad.
20
40
60
80
100 [°C]
Available load current vs. base plate temperature at 85ºC ambient.
V I = 53 V. See Thermal Consideration section.
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Electrical Specification
12 V, 25 A, 300 W
TP1 = -40 to +90ºC, VI WR9VHQVHSLQVFRQQHFWHGWRRXWSXWSLQVXQOHVVRWKHUZLVHVSHFL¿HGXQGHU&RQGLWLRQV
Typical values given at: TP1 = +25°C, VI= 53 VI max IOXQOHVVRWKHUZLVHVSHFL¿HGXQGHU&RQGLWLRQV
Additional Cout = 0.1 mF. See Operating Information section for selection of capacitor types.
&RQ¿JXUDWLRQ)LOH&'$
parameter
conditions/description
min
turn-off input voltage (VIoff)
decreasing input voltage
turn-on input voltage (VIon)
increasing input voltage
internal input capacitance (CI)
max
units
60
V
36
37
38
V
38
39
40
V
11
output power (PO)
0
50% of max IO
max IO
50% of max IO, VI = 48 V
max IO, VI = 48 V
power dissipation (Pd)
max IO
input idling power (Pli)
IO = 0 A, VI = 53 V
Nj)
300
95.2
94.6
95.1
94.5
NU
HI¿FLHQF\dž
typ
40
ED
input voltage range (VI)
17
%
%
%
%
24
4.4
input standby power (PRC)
VI = 53 V (turned off with RC)
default switching frequency (fs)
0-100% of max IO
output voltage initial setting
and accuracy (VOi)
TP1 = +25°C, VI = 53 V, IO = 12 A
output adjust range (VO)
see operating information
output voltage tolerance band
(VO)
W
W
0.4
W
180
kHz
V
6.9
13.2
V
0-100% of max IO
11.76
12.24
V
idling voltage (VO)
IO = 0 A
11.88
12.12
V
line regulation (VO)
max IO
50
220
mV
load regulation (VO)
VI = 53 V, 1-100% of max IO
45
100
mV
load transient voltage deviation
(Vtr)
VI = 53 V, load step 25-75-25% of max Io, di/dt =
$NjV&out = 2.5 mF OSCON type
±300
mV
load transient recovery time
(ttr)
VI = 53 V, load step 25-75-25% of max Io, di/dt =
$NjV&out = 2.5 mF OSCON type
250
µs
ramp-up time (tr) - (from
íRI9Oi)
10-100% of max IO
8
ms
start-up time (ts) - (from VI
connection to 90% of VOi)
10-100% of max IO
23
ms
VI shut-down fall time (tf) (from VI off to 10% of VO)
max IO
IO = 0 A
0.7
6
ms
s
RC start-up time (tRC)
max IO
14
ms
RC shut-down fall time (tRC) (from RC off to 10% of VO)
max IO
IO = 0 A
4
6
ms
s
SC
ON
TI
12.12
DI
output current (IO)
current limit threshold (Ilim)
TP1 < max TP1
short circuit current (Isc)
TP1 = 25ºC, see Note 1
recommended capacitive load
(Cout)
TP1 = 25ºC, see Note 2
output ripple & noise (VOac)
See ripple & noise section, VOi
over voltage protection (OVP)
TP1 = +25°C, VI = 53 V, 10-100 % of max IO
remote control (RC)
sink current (note 3), see operating information
trigger level, decreasing RC-voltage
trigger level, increasing RC-voltage
Note
11.88
W
12.0
0
27
30
25
A
33
A
1.1
0
2.5
10
mF
70
140
mVp-p
15.6
2.6
2.9
1: OCP in hic-cup mode
2: Low ESR-value
3: Sink current drawn by external device connected to the RC pin. Minimum sink current required to guarantee activated RC function.
cui.com
A
V
0.7
mA
V
V
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date 06/10/2016 Ϳ page 11 of 36
Typical Characteristics
12 V, 25 A, 300 W
Power Dissipation
[%]
100
[W]
20
95
16
40 V
90
53 V
85
60 V
80
40 V
12
53 V
8
60 V
4
75
5
10
15
20
0
25 [A]
0
5
10
15
20
NU
0
ED
Efficiency
25 [A]
Dissipated power vs. load current and input voltage at
T P1 = +25°C.
Efficiency vs. load current and input voltage at T P1 = +25°C.
Output Characteristics
Current Limit Characteristics
[V]
[V]
12.20
15.00
12.10
12.00
TI
40 V
12.00
11.90
53 V
9.00
60 V
6.00
40 V
53 V
60 V
SC
ON
3.00
11.80
0
5
10
15
20
25
30 [A]
0.00
DI
Output voltage vs. load current at T P1 = +25°C.
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15
20
25
30
35 [A]
Output voltage vs. load current at I O > max I O , T P1 = +25°C.
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date 06/10/2016 Ϳ page 12 of 36
Typical Characteristics
12 V, 25 A, 300 W
Shut-down
Start-up enabled by connecting V I at:
T P1 = +25°C, V I = 53 V,
I O = 25 A resistive load.
Top trace: output voltage (5 V/div).
Bottom trace: input voltage (50 V/div).
Time scale: (10 mS/div)
Shut-down enabled by disconnecting V I at:
T P1 = +25°C, V I = 53 V,
I O = 25 A resistive load.
Top trace: output voltage (5 V/div).
Bottom trace: input voltage (20 V/div).
Time scale: (1 mS/div).
Output Load Transient Response
SC
ON
TI
Output Ripple & Noise
NU
ED
Start-up
Output voltage ripple at:
T P1 = +25°C, V I = 53 V,
I O = 25 A resistive load.
Trace: output voltage (20 mV/div).
Time scale: (2 uS/div).
Output voltage response to load current step- Top trace: Output voltage (500 mV/div).
change (6.25-18.75 -6.25 A) at:
Bottom trace: load current (10 A/div).
T P1 =+25°C, V I = 53 V.
Time scale: (0.5 mS/div)
DI
Input Voltage Transient Response
Output voltage response to input voltage
transient at: T P1 = +25°C, V I = 40-60 V,
I O = 25 A resistive load, C O = 3.3 mF
Top trace: output voltage (2 V/div.).
Bottom trace: input voltage (20 V/div.).
Time scale: (0.5 ms/div.).
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date 06/10/2016 Ϳ page 13 of 36
Typical Characteristics
12 V, 25 A, 300 W
Output Current Derating – Open frame
[A]
25
2.0 m/s
15
1.5 m/s
ED
3.0 m/s
20
1.0 m/s
10
0.5 m/s
5
Nat. Conv.
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate
NU
0
Thermal Resistance – Base plate
[°C/W]
[A]
25
3.0 m/s
20
5
TI
2.0 m/s
6
4
1.5 m/s
15
10
3
0.5 m/s
2
Nat. Conv.
1
SC
ON
5
1.0 m/s
0
0
20
40
60
80
100 [°C]
0
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate + Heat sink
3.0 m/s
15
DI
10
5
20
40
60
1.0
1.5
2.0
2.5
3.0 [m/s]
Thermal resistance vs. airspeed measured at the converter. Tested in
wind tunnel with airflow and test conditions as per the Thermal
consideration section. V I = 53 V.
[A]
30
2.0 m/s
25
1.5 m/s
20
1.0 m/s
15
0.5 m/s
10
Nat. Conv.
Tamb
85°C
5
0
0
0
0.5
Output Current Derating – Cold wall sealed box
[A]
25
20
0.0
80
100 [°C]
0
Available load current vs. base plate temperature.
V I = 53 V. See Thermal Consideration section. Tested with Plate Fin
Transverse heatsink, height 0.23 In, P0114 Thermal Pad.
20
40
60
80
100 [°C]
Available load current vs. base plate temperature at 85ºC ambient.
V I = 53 V. See Thermal Consideration section.
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date 06/10/2016 Ϳ page 14 of 36
Electrical Specification
12.45 V, 22 A, 261 W
TP1 = -40 to +90ºC, VI WR9VHQVHSLQVFRQQHFWHGWRRXWSXWSLQVXQOHVVRWKHUZLVHVSHFL¿HGXQGHU&RQGLWLRQV
Typical values given at: TP1 = +25°C, VI = 53 V, max IOXQOHVVRWKHUZLVHVSHFL¿HGXQGHU&RQGLWLRQV
Additional Cin= 0.1 mF, Cout = 0.1 mF. See Operating Information section for selection of capacitor types.
&RQ¿JXUDWLRQ)LOH&'$
conditions/description
min
input voltage range (VI)
typ
36
turn-off input voltage (VIoff)
decreasing input voltage
32
turn-on input voltage (VIon)
increasing input voltage
34
internal input capacitance (CI)
max
75
V
33
34
V
35
36
11
output power (PO)
0
50% of max IO
max IO
50% of max IO, VI = 48 V
max IO, VI = 48 V
power dissipation (Pd)
max IO
94.7
94.5
95.2
94.8
15.3
V
Nj)
261
NU
HI¿FLHQF\dž
units
ED
parameter
W
%
%
%
%
21
W
input idling power (Pli)
IO = 0 A, VI = 53 V
input standby power (PRC)
VI = 53 V (turned off with RC)
default switching frequency (fs)
0-100% of max IO
output voltage initial setting
and accuracy (VOi)
TP1 = +25°C, VI = 53 V, IO = 0 A
output adjust range (VO)
see operating information
output voltage tolerance band
(VO)
0-100% of max IO
line regulation (VO)
max IO
load regulation (VO)
VI = 53 V, 1-100% of max IO
load transient voltage deviation
(Vtr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
$NjV&out = 2.2 mF OSCON type
±350
mV
load transient recovery time
(ttr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
$NjV&out = 2.2 mF OSCON type
200
µs
ramp-up time (tr) - (from
íRI9Oi)
10-100% of max IO
23
ms
start-up time (ts) - (from VI
connection to 90% of VOi)
10-100% of max IO
38
ms
VI shut-down fall time (tf) (from VI off to 10% of VO)
max IO
IO = 0 A
0.7
6
ms
s
RC start-up time (tRC)
max IO
26
ms
RC shut-down fall time (tRC) (from RC off to 10% of VO)
max IO
IO = 0 A
3.5
6
ms
s
VO = 10.8 V, TP1 < max TP1
short circuit current (ISC)
TP1 = 25ºC, see Note 1
recommended capacitive load
(COut)
TP1 = 25ºC, see Note 2
output ripple & noise (VOac)
See ripple & noise section, VOi
over voltage protection (OVP)
TP1 = +25°C, VI = 53 V, 10-100 % of max IO
remote control (RC)
sink current (note 3), see operating information
trigger level, decreasing RC-voltage
trigger level, increasing RC-voltage
DI
current limit threshold (Ilim)
Note
W
W
171
180
189
kHz
12.415
12.45
12.485
V
6.9
13.2
V
11.5
12.7
V
100
250
mV
600
700
mV
TI
SC
ON
output current (IO)
3.5
0.4
450
0
24
25
22
A
26
A
7
0
2.2
6
mF
50
150
mVp-p
15.6
2.6
2.9
1: OCP in hic-cup mode
2: Low ESR-value
3: Sink current drawn by external device connected to the RC pin. Minimum sink current required to guarantee activated RC function.
cui.com
A
V
0.7
mA
V
V
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date 06/10/2016 Ϳ page 15 of 36
Typical Characteristics
12.45 V, 40 A / 476 W, two products in parallel
Power Dissipation
[W]
45
40
35
30
25
20
15
10
5
0
[%]
100
95
36 V
90
48 V
53 V
85
75 V
80
75
0
10
20
30
40
36 V
48 V
53 V
75 V
0
[A]
ED
Efficiency
10
20
30
40
[A]
Dissipated power vs. load current and input voltage at
T P1 = +25°C
NU
Efficiency vs. load current and input voltage at T P1 = +25°C
Output Characteristics
Current Limit Characteristics
[V]
13.0
[V]
12.6
12.5
11.0
36 V
12.3
48 V
12.2
53 V
12.1
36 V
9.0
TI
12.4
48 V
53 V
7.0
75 V
75 V
5.0
12.0
11.9
3.0
SC
ON
11.8
0
10
20
30
40
40
[A]
Output voltage vs. load current at T P1 , T P3 = +25°C
DI
5VCTVWR
Start-up enabled by connecting V I at:
T P1 = +25°C, V I = 53 V,
I O = 40 A resistive load.
42
44
46
48
50
52 [A]
Output voltage vs. load current at I O > max I O , T P1 , T P3 = +25°C
1WVRWV.QCF6TCPUKGPV4GURQPUG
Top trace: output voltage (5 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (20 ms/div.).
Output voltage response to load current
step-change (10-30-10 A) at:
T P1 = +25°C, V I = 53 V, C O = 2.2 mF.
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Top trace: output voltage (0.5 V/div.).
Bottom trace: output current (20 A/div.).
Time scale: (0.5 ms/div.).
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date 06/10/2016 Ϳ page 16 of 36
Typical Characteristics
12.45 V, 22 A, 261 W
Output Current Derating – Open frame
[A]
25
3.0 m/s
20
2.0 m/s
15
1.5 m/s
ED
1.0 m/s
10
0.5 m/s
5
Nat. Conv.
0
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Thermal Resistance – Base plate
[A]
25
NU
Output Current Derating – Base plate
[°C/W]
3.0 m/s
20
2.0 m/s
15
1.5 m/s
10
1.0 m/s
5
4
3
2
TI
0.5 m/s
5
6
1
Nat. Conv.
0
0
20
40
60
80
0.0
100 [°C]
DI
SC
ON
0
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate + Heat sink
[A]
25
25
20
15
1.5 m/s
10
1.0 m/s
20
40
60
80
2.5
3.0 [m/s]
Tamb
85°C
15
10
Nat. Conv.
0
2.0
A
2.0 m/s
0
1.5
Output Current Derating – Cold wall sealed box
20
0.5 m/s
1.0
Thermal resistance vs. airspeed measured at the converter. Tested in
wind tunnel with airflow and test conditions as per the Thermal
consideration section. V I = 53 V.
3.0 m/s
5
0.5
100 [°C]
Available load current vs. base plate temperature.
V I = 53 V. See Thermal Consideration section. Tested with Plate Fin
Transverse heatsink, height 0.23 In, P0114 Thermal Pad.
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5
0
0
20
40
60
80
100 [°C]
Available load current vs. base plate temperature at 85ºC ambient.
V I = 53 V. See Thermal Consideration section.
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date 06/10/2016 Ϳ page 17 of 36
Electrical Specification
12.45 V, 25 A, 296 W
TP1 = -40 to +90ºC, VI WR9VHQVHSLQVFRQQHFWHGWRRXWSXWSLQVXQOHVVRWKHUZLVHVSHFL¿HGXQGHUFRQGLWLRQV
Typical values given at: TP1 = +25°C, VI = 53 V, max IOXQOHVVRWKHUZLVHVSHFL¿HGXQGHUFRQGLWLRQV
Additional Cout = 0.1 mF. See Operating Information section for selection of capacitor types.
&RQ¿JXUDWLRQ)LOH&'$
parameter
conditions/description
min
turn-off input voltage (VIoff)
decreasing input voltage
turn-on input voltage (VIon)
increasing input voltage
internal input capacitance (CI)
max
units
60
V
36
37
38
V
38
39
40
V
11
output power (PO)
0
50% of max IO
max IO
50% of max IO, VI = 48 V
max IO, VI = 48 V
power dissipation (Pd)
max IO
input idling power (Pli)
IO = 0 A, VI = 53 V
296
95.2
94.6
95.1
94.5
NU
HI¿FLHQF\dž
typ
40
ED
input voltage range (VI)
17
24
4.4
Nj)
W
%
%
%
%
W
W
input standby power (PRC)
VI = 53 V (turned off with RC)
0.4
W
default switching frequency (fs)
0-100% of max IO
180
kHz
output voltage initial setting
and accuracy (VOi)
TP1 = +25°C, VI = 53 V, IO = 0 A
output adjust range (VO)
see operating information
output voltage tolerance band
(VO)
0-100% of max IO
line regulation (VO)
max IO
load regulation (VO)
VI = 53 V, 1-100% of max IO
load transient voltage deviation
(Vtr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
$NjV&Out = 2.5 mF OSCON type
±300
mV
load transient recovery time
(ttr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
$NjV&Out = 2.5 mF OSCON type
250
µs
ramp-up time (tr) - (from
íRI9Oi)
10-100% of max IO
23
ms
start-up time (ts) - (from VI
connection to 90% of VOi)
10-100% of max IO
38
ms
VI shut-down fall time (tf) (from VI off to 10% of VO)
max IO
IO = 0 A
0.7
6
ms
s
RC start-up time (tRC)
max IO
14
ms
RC shut-down fall time (tRC) (from RC off to 10% of VO)
max IO
IO = 0 A
4
6
ms
s
TI
SC
ON
output current (IO)
TP1 < max TP1
short circuit current (ISC)
TP1 = 25ºC, see Note 1
recommended capacitive load
(COut)
TP1 = 25ºC, see Note 2
output ripple & noise (VOac)
See ripple & noise section, VOi
over voltage protection (OVP)
TP1 = +25°C, VI = 53 V, 10-100 % of max IO
remote control (RC)
sink current (note 3), see operating information
trigger level, decreasing RC-voltage
trigger level, increasing RC-voltage
DI
current limit threshold (Ilim)
Note
12.415
12.485
V
6.9
13.2
V
11.5
12.7
V
50
220
mV
500
700
mV
400
12.45
0
27
25
30
33
11
0
A
A
2.5
10
mF
70
140
mVp-p
15.6
2.6
2.9
1: OCP in hic-cup mode, rms value were recorded.
2: Low ESR-value
3: Sink current drawn by external device connected to the RC pin. Minimum sink current required to guarantee activated RC function.
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A
V
0.7
mA
V
V
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date 06/10/2016 Ϳ page 18 of 36
Typical Characteristics
12.45 V, 45 A, 533 W, 2 products in parallel
Power Dissipation
[%]
100
[W]
20
95
16
40 V
90
75
10
20
30
40
60 V
4
0
NU
0
53 V
8
60 V
80
40 V
12
53 V
85
ED
Efficiency
50 [A]
0
10
20
30
40
50 [A]
Dissipated power vs. load current and input voltage at
T P1 = +25°C.
Efficiency vs. load current and input voltage at T P1 = +25°C.
Output Characteristics
Current Limit Characteristics
[V]
12.60
[V]
TI
15.00
12.40
12.00
40 V
12.20
9.00
60 V
6.00
SC
ON
12.00
53 V
11.80
0
12
24
36
48
DI
Top trace: output voltage (5 V/div).
Bottom trace: input voltage (50 V/div).
Time scale: (10 mS/div)
60 V
0.00
20
Output voltage vs. load current at T P1 = +25°C.
Start-up enabled by connecting V I at:
T P1 = +25°C, V I = 53 V,
I O = 25 A resistive load.
53 V
3.00
60 [A]
Start-up
40 V
30
40
50
60
70 [A]
Output voltage vs. load current at I O > max I O , T P1 = +25°C.
Output Load Transient Response
Output voltage response to load current step- Top trace: Output voltage (500 mV/div).
change (6.25-18.75 -6.25 A) at:
Bottom trace: load current (10 A/div).
T P1 =+25°C, V I = 53 V.
Time scale: (0.5 mS/div)
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Typical Characteristics
12.45 V, 25 A, 296 W
Output Current Derating – Open frame
[A]
25
2.0 m/s
15
1.5 m/s
ED
3.0 m/s
20
1.0 m/s
10
0.5 m/s
5
Nat. Conv.
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate
NU
0
Thermal Resistance – Base plate
[°C/W]
[A]
25
3.0 m/s
20
5
4
TI
2.0 m/s
6
1.5 m/s
15
10
5
3
0.5 m/s
2
Nat. Conv.
1
SC
ON
0
1.0 m/s
0
20
40
60
80
100 [°C]
0
Available load current vs. ambient air temperature and airflow at
V I = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate + Heat sink
3.0 m/s
15
10
DI
5
20
40
60
1.0
1.5
2.0
2.5
3.0 [m/s]
Thermal resistance vs. airspeed measured at the converter. Tested in
wind tunnel with airflow and test conditions as per the Thermal
consideration section. V I = 53 V.
[A]
30
2.0 m/s
25
1.5 m/s
20
1.0 m/s
15
0.5 m/s
10
Nat. Conv.
Tamb
85°C
5
0
0
0
0.5
Output Current Derating – Cold wall sealed box
[A]
25
20
0.0
80
100 [°C]
0
Available load current vs. base plate temperature.
V I = 53 V. See Thermal Consideration section. Tested with Plate Fin
Transverse heatsink, height 0.23 In, P0114 Thermal Pad.
20
40
60
80
100 [°C]
Available load current vs. base plate temperature at 85ºC ambient.
V I = 53 V. See Thermal Consideration section.
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date 06/10/2016 Ϳ page 20 of 36
EMC Specification
Conducted EMI measured according to EN55022, CISPR
22 and FCC part 15J (see test set-up). The fundamental
switching frequency is 180 kHz for NEB at VI = 53 V, max
IO .
Test set-up
ED
Conducted EMI Input terminal value (typ)
NU
Layout recommendations
The radiated EMI performance of the product will depend
on the PWB layout and ground layer design. It is also
important to consider the stand-off of the product. If a
ground layer is used, it should be connected to the output
of the product and the equipment ground or chassis.
EMI without filter
A ground layer will increase the stray capacitance in the
PWB and improve the high frequency EMC performance.
2SWLRQDOH[WHUQDO¿OWHUIRUFODVV%
6XJJHVWHGH[WHUQDOLQSXW¿OWHULQRUGHUWRPHHWFODVV%LQ
EN 55022, CISPR 22 and FCC part 15J.
TI
Output ripple and noise
2XWSXWULSSOHDQGQRLVHPHDVXUHGDFFRUGLQJWR¿JXUH
below.
SC
ON
0
Filter components:
C1 = 1 µF
C2 = 1 µF + 220 µF
C3 = 1 µF + 220 µF
C4 = 2.2 nF
C5 = 2.2 nF
L1 = 0.81 mH
L2 = 0.81 mH
C4
L1
C1
L2
C2
+
C3
+
Module
-
C5
-
R
0
DI
Output ripple and noise test setup
EMI with filter
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CUI Inc Ϳ SERIES: NEB-D Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 06/10/2016 Ϳ page 21 of 36
Operating Information
The device should be capable of sinking
0.7 mA. When the RC pin is left open,
the voltage generated on the RC pin
is max 6 V. The standard product is
provided with “negative logic” remote
control and will be off until the RC pin
is connected to the
-In. To turn on the product the voltage
between RC pin and -In should be less
than 1 V.
To turn off the product the RC pin should be left open for
a minimum of time 150 µs, the same time requirement
applies when the product shall turn on. In situations where
it is desired to have the product to power up automatically
without the need for control signals or a switch, the RC
SLQFDQEHZLUHGGLUHFWO\WR±,QRUGLVDEOHGYLDWKH[(
command. The logic option for the primary remote control
LVFRQ¿JXUHGYLD[(FRPPDQGXVLQJWKH30%XV
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7KHSURGXFWLVGHOLYHUHGZLWKDGHIDXOWFRQ¿JXUDWLRQ
suitable for a wide range operation in terms of input
YROWDJHRXWSXWYROWDJHDQGORDG7KHFRQ¿JXUDWLRQLV
stored in an internal Non-Volatile Memory (NVM). All
SRZHUPDQDJHPHQWIXQFWLRQVFDQEHUHFRQ¿JXUHGXVLQJ
the PMBus interface. Please contact your local CUI Power
Modules representative for design support of custom
FRQ¿JXUDWLRQVRUDSSURSULDWH6:WRROVIRUGHVLJQDQG
GRZQORDGRI\RXURZQFRQ¿JXUDWLRQV
pin has an internal pull up resistor. The remote control
IXQFWLRQVFDQDOVREHFRQ¿JXUHGXVLQJWKH30%XV
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Power Management Overview
This product is equipped with a PMBus interface to to
DOORZWKHSURGXFWWREHFRQ¿JXUHGDQGFRPPXQLFDWH
with system controllers. The product incorporates a wide
UDQJHRIUHDGDEOHDQGFRQ¿JXUDEOHSRZHUPDQDJHPHQW
features that are simple to implement with a minimum of
external components. Additionally, the product includes
protection features that continuously safeguard the load
from damage due to unexpected system faults. A fault is
also shown as an alert on the SALERT pin. The following
product parameters can continuously be monitored by a
host: Input voltage, output voltage/current, duty cycle and
internal temperature.
Remote Control (secondary side)
7KH&75/SLQFDQEHFRQ¿JXUHGDVUHPRWHFRQWUROYLDWKH
30%XVLQWHUIDFH,QWKHGHIDXOWFRQ¿JXUDWLRQWKH&75/
SLQLVGLVDEOHGDQGÀRDWLQJ7KHRXWSXWFDQEHFRQ¿JXUHG
to internal pull-up to 3.3 V using the MFR_MULTI_PIN_
CONFIG (0xF9) PMBus command. The CTRL-pin can be left
open when not used. The logic options for the secondary
remote control can be positive or negative logic. The logic
RSWLRQIRUWKHVHFRQGDU\UHPRWHFRQWUROLVFRQ¿JXUHG
via ON_OFF_CONFIG (0x02) command using the PMBus
interface, see also MFR_MULTI_PIN_CONFIG section.
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Input Voltage
The NEB consists of two different product families designed
for two different input voltage ranges, 36 to 75 Vdc and 40
to 60 Vdc, see ordering information.
SC
ON
The input voltage range 36 to 75 Vdc meets the
requirements of the European Telecom Standard ETS 300
IRUQRUPDOLQSXWYROWDJHUDQJHLQ±DQG±9GF
systems, -40.5 to
9DQG±WR9UHVSHFWLYHO\
At input voltages exceeding 75 V, the power loss will be
higher than at normal input voltage and TP1 must be
limited to absolute max +125°C. The absolute maximum
continuous input voltage is 80 Vdc.
Input and Output Impedance
The impedance of both the input source and the load will
interact with the impedance of the product. It is important
that the input source has low characteristic impedance.
Minimum recommended external input capacitance is 100
µF. The performance in some applications can be enhanced
by addition of external capacitance as described under
External Decoupling Capacitors.
The input voltage range 40 to 60 Vdc meets the
requirements for normal input voltage range in -48 V
systems, -40.5 to
-57.0 V. At input voltages exceeding 60 V, the power
loss will be higher than at normal input voltage and TP1
must be limited to absolute max +125°C. The absolute
maximum continuous input voltage is 65 Vdc.
DI
Turn-off Input Voltage
The product monitors the input voltage and will turn
on and turn off at predetermined levels. The minimum
hysteresis between turn on and turn off input voltage is
2 V. The turn on and turn off levels of the product can be
UHFRQ¿JXUHGXVLQJWKH30%XVLQWHUIDFH
Remote Control (RC)
7KHSURGXFWVDUH¿WWHGZLWKDFRQ¿JXUDEOHUHPRWHFRQWURO
function. The primary remote control is referenced to the
primary negative input connection (-In). The RC function
allows the converter to be turned on/off by an external
device like a semiconductor or mechanical switch. The RC
External Decoupling Capacitors
:KHQSRZHULQJORDGVZLWKVLJQL¿FDQWG\QDPLFFXUUHQW
requirements, the voltage regulation at the point of load
can be improved by addition of decoupling capacitors at
the load. The most effective technique is to locate low ESR
ceramic and electrolytic capacitors as close to the load
as possible, using several parallel capacitors to lower the
effective ESR. The ceramic capacitors will handle highfrequency dynamic load changes while the electrolytic
capacitors are used to handle low frequency dynamic load
changes. Ceramic capacitors will also reduce any high
frequency noise at the load. It is equally important to
use low resistance and low inductance PWB layouts and
cabling. External decoupling capacitors will become part of
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CUI Inc Ϳ SERIES: NEB-D Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
Margin Up/Down Controls
These controls allow the output voltage to be momentarily
adjusted, either up or down, by a nominal 10%. This
provides a convenient method for dynamically testing
the operation of the load circuit over its supply margin or
range. It can also be used to verify the function of supply
voltage supervisors.
The margin up and down levels of the product can be reFRQ¿JXUHGXVLQJWKH30%XVLQWHUIDFH
Soft-start Power Up
The default rise time of the ramp up is 10 ms. When
starting by applying input voltage the control circuit bootup time adds an additional 15 ms delay. The soft-start
SRZHUXSRIWKHSURGXFWFDQEHUHFRQ¿JXUHGXVLQJWKH
PMBus interface.
7KH'/6YDULDQWVKDYHDSUHFRQ¿JXUHGUDPSXSWLPHRI
25 ms.
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Parallel Operation (Droop Load Share, DLS)
The NEB DLS products are variants that can be connected
LQSDUDOOHO7KHSURGXFWVKDYHDSUHFRQ¿JXUHGYROWDJH
droop: The stated output voltage set point is at no load.
The output voltage will decrease when the load current is
increased. The voltage will droop 0.6 V while load reaches
max load. This feature allows the products to be connected
in parallel and share the current with 10% accuracy. Up
to 90% of max output current can be used from each
product.
Output Voltage Adjust using PMBus
7KHRXWSXWYROWDJHRIWKHSURGXFWFDQEHUHFRQ¿JXUHG
using the PMBus interface.
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the product’s control loop. The control loop is optimized
for a wide range of external capacitance and the maximum
recommended value that could be used without any
DGGLWLRQDODQDO\VLVLVIRXQGLQWKHHOHFWULFDOVSHFL¿FDWLRQ
The ESR of the capacitors is a very important parameter.
6WDEOHRSHUDWLRQLVJXDUDQWHHGZLWKDYHUL¿HG(65YDOXHRI
!PDFURVVWKHRXWSXWFRQQHFWLRQV
For further information please contact your local CUI Power
Modules representative.
date 06/10/2016 Ϳ page 22 of 36
Remote Sense
The product has remote sense that can be used to
compensate for voltage drops between the output and the
point of load. The sense traces should be located close to
the PWB ground layer to reduce noise susceptibility. The
remote sense circuitry will compensate for up to 10%
voltage drop between output pins and the point of load.
If the remote sense is not needed +Sense should be
connected to +Out and
-Sense should be connected to -Out. To be able to use
remote sense the converter must be equipped with a
Communication interface.
SC
ON
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When running DLS-products in parallel command (0xF9)
must be set according to MFR_MULTI_PIN_CONFIG. To
prevent unnecessary current stress, changes of the output
voltage must be done with the output disabled. This must
be considered for all commands that affect the output
voltage.
DI
Feed Forward Capability
The NEB products have a feed forward function
implemented that can handle sudden input voltage
changes. The output voltage will be regulated during an
input transient and will typically stay within 10% when an
input transient is applied.
30%XVFRQ¿JXUDWLRQDQGVXSSRUW
The product provides a PMBus digital interface that enables
WKHXVHUWRFRQ¿JXUHPDQ\DVSHFWVRIWKHGHYLFHRSHUDWLRQ
as well as monitor the input and output parameters.
Please contact your local CUI Power Modules
representative for appropriate SW tools to down-load new
FRQ¿JXUDWLRQV
Temperature Protection (OTP, UTP)
The products are protected from thermal overload by an
internal temperature shutdown protection. When TP1 as
GH¿QHGLQWKHUPDOFRQVLGHUDWLRQVHFWLRQLVH[FHHGHGWKH
product will shut down. The product will make continuous
attempts to start up (non-latching mode) and resume
normal operation automatically when the temperature
has dropped below the temperature threshold set in the
command OT_WARN_LIMIT (0x51); the hysteresis is
GH¿QHGLQJHQHUDOHOHFWULFDOVSHFL¿FDWLRQ7KH273DQG
K\VWHUHVLVRIWKHSURGXFWFDQEHUHFRQ¿JXUHGXVLQJ
the PMBus interface. The product has also an under
temperature protection. The OTP and UTP fault limit and
IDXOWUHVSRQVHFDQEHFRQ¿JXUHGYLDWKH30%XV1RWH
using the fault response “continue without interruption”
may cause permanent damage to the product.
Over Voltage Protection (OVP)
The product includes over voltage limiting circuitry for
protection of the load. The default OVP limit is 30% above
the nominal output voltage. If the output voltage exceeds
the OVP limit, the product can respond in different ways.
The default response from an over voltage fault is to
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CUI Inc Ϳ SERIES: NEB-D Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
MFR_MULTI_PIN_CONFIG
The MFR_MULTI_PIN_CONFIG (0xF9) command enables
or disables different functions inside the product. This
FRPPDQGFDQEHFRQ¿JXUHGDFFRUGLQJWRWKHWDEOHIRU
different functions.
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
DLS, Power Good Push-pull,
Sec RC w/ pull up/down (0x87)
DLS, Power Good High Z when active,
PMBus Control (0xA6)
DLS, Power Good High Z when active,
Sec RC w/ pull up/down (0xA7)
Stand alone, PMBus Control (0x00)
Stand alone, Sec RC w/ pull up/down (0x01)
Stand alone, Power Good Push-pull, PMBus
Control (0x04)
Stand alone, Power Good Push-pull,
Sec RC w/ pull up/down (0x05)
Stand alone, Power Good High Z when
active, PMBus Control (0x24)
Stand alone, Power Good High Z when
active, Sec RC w/ pull up/down (0x25)
Pre-bias Start-up Capability
The product has a Pre-bias start up functionality and will
not sink current during start up if a Pre-bias source is
present at the output terminals. If the Pre-bias voltage
is lower than the target value set in VOUT_COMMAND
(0x21), the product will ramp up to the target value. If
the Pre-bias voltage is higher than the target value set in
VOUT_COMMAND (0x21), the product will ramp down to
the target value and in this case sink current for a limited
of time set in the command TOFF_MAX_WARN_LIMIT
(0x66).
1) When not used
with PMBus, the
CTRL input can be
internally pulled up
or down depending
on if it is active high
or low. When active
low it will be pulled
up and vice versa
Power Good
7KHSURGXFWSURYLGHV3RZHU*RRG3*ÀDJLQWKH6WDWXV
Word register that indicates the output voltage is within a
VSHFL¿HGWROHUDQFHRILWVWDUJHWOHYHODQGQRIDXOWFRQGLWLRQ
H[LVWV,IVSHFL¿HGLQVHFWLRQ&RQQHFWLRQVWKHSURGXFW
also provides a PG signal output. The Power Good signal
LVE\GHIDXOWFRQ¿JXUHGDVDFWLYHORZ3XVKSXOODQGFDQ
EHUHFRQ¿JXUHGYLDWKH30%XVLQWHUIDFH7KH3RZHU*RRG
RXWSXWFDQEHFRQ¿JXUHGDV3XVKSXOORU³+LJK=ZKHQ
active” to permit AND’ing of parallel devices. It is not
recommended to
use Push-pull when paralleling PG-pins, see MFR_MULTI_
PIN_CONFIG.
DLS, PMBus Control (0x82)
SC
ON
Input Over/Under voltage protection
The input of the product can be protected from high input
voltage and low input voltage. The over/under-voltage
IDXOWOHYHODQGIDXOWUHVSRQVHFDQEHFRQ¿JXUHGYLDWKH
PMBus interface.
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1
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Bit 5
Power Good High Z
when active
Bit 4
Tracking enable
(N/A)
Bit 3
External reference
(N/A)
Bit 2
Power Good
Enable
Bit 1
Reserved
Bit 0
Secondary Remote
Control Pull
up/down resistor
enable 1)
1
DLS, Sec RC w/ pull up/down (0x83)
Bit 7:6
00 = Stand alone
01 = Slave (N/A)
10 = DLS
11 = Master (N/A)
DLS, Power Good Push-pull, PMBus Control
(0x86)
Droop Load Share variants (DLS) will enter hic-up mode,
with a trip voltage, 0.04×Vout, set in command IOUT_
OC_LV_FAULT_LIMIT (0x48). Above the trip voltage in
command (0x48) the product will continue operate while
maintaining the output current at the value set by IOUT_
OC_FAULT_LIMIT (0x46).
The over current protection of the product can be
UHFRQ¿JXUHGXVLQJWKH30%XVLQWHUIDFH
Switching frequency adjust using PMBus
The switching frequency is set to 180 kHz as default but
WKLVFDQEHUHFRQ¿JXUHGYLDWKH30%XVLQWHUIDFH7KH
product is optimized at this frequency but can run at lower
DQGKLJKHUIUHTXHQF\N+]±N+]7KHHOHFWULFDO
performance can be affected if the switching frequency is
changed.
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Over Current Protection (OCP)
The product includes current limiting circuitry for
protection at continuous overload. The default setting for
the product is hic-up mode if the maximum output current
is exceeded and the output voltage is below 0.3×Vout, set
in command IOUT_OC_LV_FAULT_LIMIT (0x48). Above
the trip voltage value in command 0x48 the product will
continue operate while maintaining the output current at
the value set by IOUT_OC_FAULT_LIMIT (0x46). The load
distribution should be designed for the maximum output
VKRUWFLUFXLWFXUUHQWVSHFL¿HG
Synchronization, Tracking and External reference
This product does not support synchronization, tracking or
external reference.
ED
immediately shut down. The device will continuously check
for the presence of the fault condition, and when the fault
condition no longer exists the device will be re-enabled.
The OVP fault level and fault response can be reFRQ¿JXUHGXVLQJWKH30%XVLQWHUIDFH
date 06/10/2016 Ϳ page 23 of 36
7KH0)5B08/7,B3,1B&21),*FDQEHUHFRQ¿JXUHGXVLQJ
WKH30%XVLQWHUIDFH'HIDXOWFRQ¿JXUDWLRQLVVHWWR3RZHU
Good Push-Pull (0x04) for stand alone variants and DLS
Power Good Push-Pull (0x86) for Droop Load Share
variants.
User customized settings
This product has 2 data storage set: Default data (CUI
factory) and User data. The User data set’s priority is
higher than the Default data. The User data area is empty
while shipped to customer. After boot-up, if the controller
found no data stored in User data area, it will load Default
data instead. Customer can change the RAM data and
VWRUHWKHFKDQJHVLQWRÀDVKPHPRU\E\30%866WRUHB
User_All, next power cycle will load the User data into RAM
for execute.
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CUI Inc Ϳ SERIES: NEB-D Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
13.4
13.4
13.2
13.2
13.0
13.0
12.8
12.8
Vout [V]
12.6
12.4
12.6
12.4
12.2
12.2
12.0
12.0
35
45
55
65
75
Vin [V]
Vin range: 36-75Vdc
35 40
45 50 55
60 65
Vin [V]
Vin range:40-60Vdc
Thermal Consideration
General
'H¿QLWLRQRISURGXFWRSHUDWLQJWHPSHUDWXUH
TI
The product is designed to operate in different thermal
HQYLURQPHQWVDQGVXI¿FLHQWFRROLQJPXVWEHSURYLGHGWR
ensure reliable operation.
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Vout [V]
Output Voltage Regulation
The NEB products are designed to be fully regulated
within the plotted area. Operating outside this area is not
recommended.
For products with base plate used in a sealed box/cold
wall application, cooling is achieved mainly by conduction
through the cold wall. The Output Current Derating graphs
are found in the output section for each model. The
product is tested in a sealed box test set up with ambient
temperatures 85, 55 and 25°C.
ED
Store_Default_All is write protected to ensure the factory
settings is always available for recovery.
date 06/10/2016 Ϳ page 24 of 36
The product operating temperature is used to monitor
the temperature of the product, and proper thermal
FRQGLWLRQVFDQEHYHUL¿HGE\PHDVXULQJWKHWHPSHUDWXUH
at positions P1, P2, P3 and P4. The temperature at these
positions (TP1, TP2, TP3, TP4) should not exceed the
maximum temperatures in the table below. The number
of measurement points may vary with different thermal
design and topology. Temperatures above maximum TP1,
measured at the reference point P1 (both for openframe
and base plate versions) are not allowed and may cause
permanent damage.
SC
ON
For products mounted on a PWB without a heat sink
attached, cooling is achieved mainly by conduction, from
the pins to the host board, and convection, which is
GHSHQGDQWRQWKHDLUÀRZDFURVVWKHSURGXFW,QFUHDVHG
DLUÀRZHQKDQFHVWKHFRROLQJRIWKHSURGXFW7KH2XWSXW
Current Derating graph found in the output section for
each model provides the available output current vs.
ambient air temperature and air velocity at
VI =53 V.
DI
The product is tested on a 254 x 254 mm, 35 µm (1 oz),
16-layer test board mounted vertically in a wind tunnel
with a cross-section of 608 x 203 mm
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CUI Inc Ϳ SERIES: NEB-D Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
Position
Description
P1
PWB (reference point, open
TP1=125º C
frame and base-plate)
P2
Opto-coupler
TP2=105º C
P3
Secondary MOSFET
TP3=125º C
P4
Magnetic Core
TP4=125º C
date 06/10/2016 Ϳ page 25 of 36
Max temperature
TOP View
Open frame
Bottom View
Open frame and Baseplate
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ED
Connections (Top view)
Designation
Function
%HVWDLUÀRZGLUHFWLRQLVIURPQHJDWLYHWRSRVLWLYHSLQV
1
+In
Positive Input
Ambient Temperature Calculation
2
RC
Remote Control
4
-In
Negative Input
5
-Out
Negative Output
6
S+
Positive Remote Sense
7
S-
Negative Remote Sense
1. The power loss is calculated by using the formula
džîRXWSXWSRZHU SRZHUORVVHV3d).
dž HI¿FLHQF\RISURGXFW(J
8
SA0
Address pin 0
9
SA1
Address pin 1
10
SCL
PMBus Clock
2. Find the thermal resistance (Rth) in the Thermal
Resistance graph found in the Output section for each
model. Note that the thermal resistance can be
VLJQL¿FDQWO\UHGXFHGLIDKHDWVLQNLVPRXQWHGRQWKH
WRSRIWKHEDVHSODWH
11
SDA
PMBus Data
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Pin
SC
ON
For products with base plate the maximum allowed
ambient temperature can be calculated by using the
thermal resistance.
&DOFXODWHWKHWHPSHUDWXUHLQFUHDVH¨7
¨7 5th x Pd
12
PG
Power Good output
13
DGND
PMBus ground
14
SALERT
PMBus alert signal
15
CTRL
PMBus remote control
16
+Out
Positive Output
DI
3. Max allowed ambient temperature is:
Max TP1¨7
E.g. NEB-264 at 2m/s:
1. ((1/0.945) - 1) × 264 W = 15.4 W
2. 15.4 W × 3.4°C/W = 52°C
&±& PD[DPELHQWWHPSHUDWXUHLV&
The actual temperature will be dependent on several
factors such as the PWB size, number of layers and
GLUHFWLRQRIDLUÀRZ
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CUI Inc Ϳ SERIES: NEB-D Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 06/10/2016 Ϳ page 26 of 36
This product provides a PMBus digital interface that
HQDEOHVWKHXVHUWRFRQ¿JXUHPDQ\DVSHFWVRIWKHGHYLFH
operation as well as to monitor the input and output
voltages, output current and device temperature. The
product can be used with any standard two-wire I2C or
SMBus host device. In addition, the product is compatible
with PMBus version 1.2 and includes an SALERT line to
help mitigate bandwidth limitations related to continuous
fault monitoring. The product supports 100 kHz and 400
kHz bus clock frequency only. The PMBus signals, SCL,
SDA and SALERT require passive pull-up resistors as
VWDWHGLQWKH60%XV6SHFL¿FDWLRQ3XOOXSUHVLVWRUVDUH
required to guarantee the rise time as follows:
Eq. 7
ED
PMBus Interface
Schematic of connection of address resistors.
τ = R P C p ≤ 1us
SA0/SA1 Index RSA0/RSA1 [kΩ]
0
10
1
22
2
33
3
47
4
68
5
100
6
150
7
220
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where Rp is the pull-up resistor value and Cp is the bus
load. The maximum allowed bus load is 400 pF. The pullup resistor should be tied to an external supply between
2.7 to 5.5 V, which should be present prior to or during
power-up. If the proper power supply is not available,
voltage dividers may be applied. Note that in this case, the
resistance in the equation above corresponds to parallel
connection of the resistors forming the voltage divider.
TI
It is recommended to always use PEC (Packet Error Check)
when communicating via PMBus. For these products it is
a requirement to use PEC when using Send Byte to the
device, for example command “RESTORE_DEFAULT_ALL”.
PMBus Address = 8 x (SA0value) + (SA1 value)
•
SC
ON
Monitoring via PMBus
A system controller (host device) can monitor a wide
variety of parameters through the PMBus interface. The
controller can monitor fault conditions by monitoring the
SALERT pin, which will be asserted when any number
RISUHFRQ¿JXUHGIDXOWRUZDUQLQJFRQGLWLRQVRFFXU7KH
system controller can also continuously monitor any
number of power conversion parameters including but not
limited to the following:
•
•
•
•
•
7KH6$DQG6$SLQVFDQEHFRQ¿JXUHGZLWKDUHVLVWRUWR
GND according to the following equation.
If the calculated PMBus address is 0, 11 or 12, PMBus
address 127 is assigned instead. From a system point of
view, the user shall also be aware of further limitations of
WKHDGGUHVVHVDVVWDWHGLQWKH30%XV6SHFL¿FDWLRQ,WLV
not recommended to keep the SA0 and SA1 pins left open.
I2C/SMBus – Timing
Input voltage
Output voltage
Output current
Internal junction temperature
Switching frequency (Monitors the set value not
actual frequency)
Duty cycle
DI
Software Tools for Design and Production
)RUWKLVSURGXFWV&8,SURYLGHVVRIWZDUHIRUFRQ¿JXULQJDQG
monitoring via the PMBus interface.
For more information please contact your local
CUI sales representative.
PMBus Addressing
7KHIROORZLQJ¿JXUHDQGWDEOHVKRZUHFRPPHQGHGUHVLVWRU
values with min and max voltage range for hard-wiring
PMBus addresses (series E12, 1% tolerance resistors
suggested):
Setup and hold times timing diagram
The setup time, tset, is the time data, SDA, must be stable
before the rising edge of the clock signal, SCL. The hold
time thold, is the time data, SDA, must be stable after the
rising edge of the clock signal, SCL. If these times are
violated incorrect data may be captured or meta-stability
may occur and the bus communication may fail. When
FRQ¿JXULQJWKHSURGXFWDOOVWDQGDUG60%XVSURWRFROVPXVW
be followed, including clock stretching. Additionally,
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CUI Inc Ϳ SERIES: NEB-D Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
PMBus Commands
Designation
Cmd Prot
Standard PMBus Commands
Control Commands
Cmd
Prot
IOUT_OC_FAULT_RESPONSE
47h
No
IOUT_OC_LV_FAULT_LIMIT
48h
No
IOUT_OC_WARN_LIMIT
4Ah
No
OT_FAULT_LIMIT
4Fh
No
OT_FAULT_RESPONSE
50h
No
OT_WARN_LIMIT
51h
No
UT_WARN_LIMIT
52h
No
UT_FAULT_LIMIT
53h
No
UT_FAULT_RESPONSE
54h
No
VIN_OV_FAULT_LIMIT
55h
No
VIN_OV_FAULT_RESPONSE
56h
No
VIN_OV_WARN_LIMIT
57h
No
VIN_UV_WARN_LIMIT
58h
No
VIN_UV_FAULT_LIMIT
59h
No
NU
The products are PMBus compliant. The following table
lists the implemented PMBus read commands. For
more detailed information see PMBus Power System
0DQDJHPHQW3URWRFRO6SHFL¿FDWLRQ3DUW,±*HQHUDO
Requirements, Transport and Electrical Interface and
30%XV3RZHU6\VWHP0DQDJHPHQW3URWRFRO3DUW,,±
Command Language.
Designation
ED
a bus-free time delay between every SMBus transmission
(between every stop & start condition) must occur. Refer
WRWKH60%XVVSHFL¿FDWLRQIRU60%XVHOHFWULFDODQGWLPLQJ
requirements. Note that an additional delay of 5 ms has
to be inserted in case of storing the RAM content into the
internal non-volatile memory.
date 06/10/2016 Ϳ page 27 of 36
OP E RATION
01h
No
VIN_UV_FAULT_RESPONSE
5Ah
No
ON_OF F _CONF IG
02h
No
POWER_GOOD_ON
5Eh
No
WRITE _P ROTE CT
10h
No
POWER_GOOD_OFF
5Fh
No
VOUT_MODE
VOUT_COMMAND
VOUT_TRIM
20h
No
TON_DELAY
60h
No
21h
No
TON_RISE
61h
No
22h
No
TON_MAX_FAULT_LIMIT
62h
No
23h
Y es
TON_MAX_FAULT_RESPONSE
63h
No
No
TOFF_DELAY
64h
No
SC
ON
VOUT_CAL_OF F SE T
Time setting Commands
TI
Output Commands
VOUT_MAX
24h
VOUT_MARGIN_HIGH
25h
No
TOFF_FALL
65h
No
VOUT_MARGIN_LOW
26h
No
TOFF_MAX_WARN_LIMIT
66h
No
VOUT_TRANSITION_RATE
27h
No
Status Commands (Read Only)
VOUT_SCALE _LOOP
29h
Y es
CLEAR_FAULTS
03h
No
VOUT_SCALE_MONITOR
2Ah
Yes
STATUS_BYTES
78h
No
MAX_DUTY
32h
No
STATUS_WORD
79h
No
FREQUENCY_SWITCH
33h
No
STATUS_VOUT
7Ah
No
VIN_ON
35h
No
STATUS_IOUT
7Bh
No
VIN_OF F
36h
No
STATUS_INPUT
7Ch
No
IOUT_CAL_GAIN
38h
Y es
STATUS_TEMPERATURE
7Dh
No
IOUT_CAL_OF F SE T
39h
Y es
STATUS_CML
7Eh
No
STATUS_OTHER
7Fh
No
40h
No
Monitior Commands (Read Only)
DI
Fault Commands
VOUT_OV_FAULT_LIMIT
VOUT_OV_FAULT_RESPONSE
41h
No
READ_VIN
88h
No
VOUT_OV_WARN_LIMIT
42h
No
READ_VOUT
8Bh
No
VOUT_UV_WARN_LIMIT
43h
No
READ_IOUT
8Ch
No
VOUT_UV_FAULT_LIMIT
44h
No
READ_TEMPERATURE_1
8Dh
No
VOUT_UV_FAULT_RESPONSE
45h
No
READ_TEMPERATURE_2
8Eh
No
IOUT_OC_FAULT_LIMIT
46h
No
READ_DUTY_CYCLE
94h
No
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CUI Inc Ϳ SERIES: NEB-D Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
Designation
Cmd Prot
READ_FREQUENCY
95h
No
86(5 '$7$
Identification Commands (Read Only)
%K
1R
PMBUS_REVISION
98h
No
MFR_ID
99h
Yes
MFR_MODEL
9Ah
Yes
date 06/10/2016 Ϳ page 28 of 36
Notes:
Cmd, is short for Command.
Prot, is short for commands that are protected with security mask.
9Bh
Yes
9Ch
Yes
MFR_DATE
9Dh
Yes
MFR_SERIAL
9Eh
Yes
Supervisory Commands
11h
Yes
RESTORE_DEFAULT_ALL
12h
No
STORE_USER_ALL
15h
No
RESTORE_USER_ALL
16h
No
CAPABILITY
19h
No
Product Specific Commands
MFR_POWER_GOOD_POLARITY
D0h
No
MFR_VIN_SCALE_MONITOR
D3h
Yes
TI
STORE_DEFAULT_ALL
NU
MFR_REVISION
MFR_LOCATION
ED
Configuration and Control Commands
DCh
No
MFR_VIN_OFFSET
DDh
Yes
SC
ON
MFR_SELECT_TEMP_SENSOR
MFR_VOUT_OFFSET_MONITOR
DEh
Yes
MFR_TEMP_OFFSET_INT
E1h
No
MFR_REMOTE_TEMP_CAL
E2h
No
MFR_REMOTE_CTRL
E3h
No
MFR_DEAD_BAND_DELAY
E5h
Yes
MFR_TEMP_COEFF
E7h
Yes
MFR_DEBUG_BUFF
F0h
No
MFR_SETUP_PASSWORD
F1h
No
MFR_DISABLE_SECURITY_ONCE
F2h
No
MFR_DEAD_BAND_IOUT_THRESHOLD
F3h
Yes
F4h
Yes
MFR_PRIMARY_TURN
F5h
Yes
MFR_SECONDARY_TURN
MFR_ILIM_SOFTSTART
F6h
F8h
Yes
No
MFR_MULTI_PIN_CONFIG
F9h
No
MFR_DEAD_BAND_VIN_THRESHOLD
FAh
Yes
MFR_DEAD_BAND_VIN_IOUT_HYS
FBh
Yes
MFR_RESTART
FEh
No
DI
MFR_SECURITY_BIT_MASK
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date 06/10/2016 Ϳ page 29 of 36
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Mechanical Information - Hole Mount, Open Frame Version
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date 06/10/2016 Ϳ page 30 of 36
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Mechanical Information - Hole Mount, Base Plate Version
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date 06/10/2016 Ϳ page 31 of 36
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Mechanical Information - Surface Mount Version
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CUI Inc Ϳ SERIES: NEB-D Ϳ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
Soldering Information - Surface Mounting
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (TPIN)
in excess of the solder melting temperature (TL, 217 to
221°C for SnAgCu solder alloys) for more than 60 seconds
and a peak temperature of 245°C on all solder joints is
recommended to ensure a reliable solder joint.
The surface mount product is intended for forced
FRQYHFWLRQRUYDSRUSKDVHUHÀRZVROGHULQJLQ6Q3EDQG
Pb-free processes.
7KHUHÀRZSUR¿OHVKRXOGEHRSWLPLVHGWRDYRLGH[FHVVLYH
heating of the product. It is recommended to have
DVXI¿FLHQWO\H[WHQGHGSUHKHDWWLPHWRHQVXUHDQ
even temperature across the host PWB and it is also
UHFRPPHQGHGWRPLQLPL]HWKHWLPHLQUHÀRZ
ED
Maximum Product Temperature Requirements
Top of the product PWB near pin 2 is chosen as reference
location for the maximum (peak) allowed product
temperature (TPRODUCT) since this will likely be the warmest
SDUWRIWKHSURGXFWGXULQJWKHUHÀRZSURFHVV
$QRFOHDQÀX[LVUHFRPPHQGHGWRDYRLGHQWUDSPHQWRI
FOHDQLQJÀXLGVLQFDYLWLHVLQVLGHWKHSURGXFWRUEHWZHHQ
the product and the host board, since cleaning residues
may affect long time reliability and isolation voltage.
NU
SnPb solder processes
)RU6Q3EVROGHUSURFHVVHVWKHSURGXFWLVTXDOL¿HGIRU06/
1 according to IPC/JEDEC standard J STD 020C.
General reflow process specifications SnPb eutectic Pb-free
Average ramp-up (T PRODUCT )
Typical solder melting (liquidus)
temperature
TL
Minimum reflow time above T L
3°C/s max
3°C/s max
183°C
221°C
60 s
60 s
Minimum pin temperature
T PIN
210°C
235°C
Peak product temperature
T PRODUCT
225°C
260°C
6°C/s max
Maximum time 25°C to peak
6 minutes
8 minutes
Pin
profile
Dry Pack Information
3URGXFWVLQWHQGHGIRU3EIUHHUHÀRZVROGHULQJSURFHVVHV
are delivered in standard moisture barrier bags according
to IPC/JEDEC standard J STD 033 (Handling, packing,
VKLSSLQJDQGXVHRIPRLVWXUHUHÀRZVHQVLWLYLW\VXUIDFH
mount devices).
SC
ON
TL
'XULQJUHÀRZ7PRODUCT must not exceed 260 °C at any time.
TI
6°C/s max
TPRODUCT maximum
TPIN minimum
'XULQJUHÀRZ7PRODUCT must not exceed 225 °C at any time.
Pb-free solder processes
)RU3EIUHHVROGHUSURFHVVHVWKHSURGXFWLVTXDOL¿HGIRU
MSL 3 according to IPC/JEDEC standard J-STD-020C.
Average ramp-down (T PRODUCT )
Temperature
date 06/10/2016 Ϳ page 32 of 36
Time in preheat
/ soak zone
Time 25°C to peak
Time in
reflow
Product
profile
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In
case the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
modules must be baked according to J STD 033.
Time
Minimum Pin Temperature Recommendations
Pin number 5 chosen as reference location for the
minimum pin temperature recommendation since this will
OLNHO\EHWKHFRROHVWVROGHUMRLQWGXULQJWKHUHÀRZSURFHVV
Thermocoupler Attachment
Top of PWB near pin 2 for measurement of maximum
product temperature, TPRODUCT
DI
SnPb solder processes
For SnPb solder processes, a pin temperature (TPIN) in
excess of the solder melting temperature, (TL, 183°C
for Sn63Pb37) for more than 60 seconds and a peak
temperature of 220°C is recommended to ensure a reliable
solder joint.
For dry packed products only: depending on the type of
VROGHUSDVWHDQGÀX[V\VWHPXVHGRQWKHKRVWERDUGXSWR
a recommended maximum temperature of 245°C could be
used, if the products are kept in a controlled environment
(dry pack handling and storage) prior to assembly.
Pin 5 for measurement of minimum pin (solder joint)
temperature, TPIN
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date 06/10/2016 Ϳ page 33 of 36
Soldering Information - Hole Mounting
The hole mounted product is intended for plated through
hole mounting by wave or manual soldering. The pin
WHPSHUDWXUHLVVSHFL¿HGWRPD[LPXPWR&IRU
maximum 10 seconds.
ED
A maximum preheat rate of 4°C/s and maximum preheat
temperature of 150°C is suggested. When soldering by
hand, care should be taken to avoid direct contact between
the hot soldering iron tip and the pins for more than a few
seconds in order to prevent overheating.
NU
$QRFOHDQÀX[LVUHFRPPHQGHGWRDYRLGHQWUDSPHQWRI
FOHDQLQJÀXLGVLQFDYLWLHVLQVLGHWKHSURGXFWRUEHWZHHQ
the product and the host board. The cleaning residues may
affect long time reliability and isolation voltage.
Delivery Package Information
Tray Specifications– SMD /Pin in paste
TI
The products are delivered in antistatic injection molded
trays (Jedec design guide 4.10D standard) and in antistatic
trays
Material
Antistatic PPE
Surface resistance
Tray thickness
105 < Ohm/square < 1012
The trays can be baked at maximum
125°C for 48 hours
17.40 mm 0.685 [ inch]
Box capacity
100 products (5 full trays/box)
Tray weight
125 g empty, 605 g full tray
DI
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Bakability
JEDEC standard tray for 2x5 = 10 products.
All dimensions in mm [inch]
Tolerances: X.x ±0.26 [0.01], X.xx ±0.13 [0.005]
Note: pick up positions refer to center of pocket.
See mechanical drawing for exact location on product.
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date 06/10/2016 Ϳ page 34 of 36
Tray Specifications - Through hole Version
105 < Ohm/square < 1012
The trays are not bakeable
25 converters/tray
75 products (3 full trays/box)
Product – Open frame
790 g full tray, 140g empty tray
Product – Base plate option
1090 g full tray, 140 g empty tray
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Weight
PE Foam, dissipative
ED
Material
Surface
resistance
Bakability
Tray capacity
Box capacity
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date 06/10/2016 Ϳ page 35 of 36
Product Qualification Specification
Characteristics
External visual inspection
IPC-A-610
Change of temperature
(Temperature cycling)
IEC 60068-2-14 Na
Temperature range
Number of cycles
Dwell/transfer time
Cold (in operation)
IEC 60068-2-1 Ad
Temperature T A
Duration
Damp heat
IEC 60068-2-67 Cy
Temperature
Humidity
Duration
Dry heat
IEC 60068-2-2 Bd
Temperature
Duration
Electrostatic discharge
susceptibility
IEC 61340-3-1, JESD 22-A114
IEC 61340-3-2, JESD 22-A115
Human body model (HBM)
Machine Model (MM)
Class 2, 2000 V
Class 3, 200 V
Immersion in cleaning solvents
IEC 60068-2-45 XA, method 2
Water
Glycol ether
Isopropyl alcohol
55°C
35°C
35°C
Mechanical shock
IEC 60068-2-27 Ea
Peak acceleration
Duration
100 g
6 ms
Moisture reflow sensitivity 1
J-STD-020C
Level 1 (SnPb-eutectic)
Level 3 (Pb Free)
225°C
260°C
MIL-STD-202G, method 108A
Duration
1000 h
IEC 60068-2-20 Tb, method 1A
Solder temperature
Duration
270°C
10-13 s
IEC 60068-2-21 Test Ua1
IEC 60068-2-21 Test Ue1
Through hole mount products
Surface mount products
All leads
All leads
Preconditioning
Temperature, SnPb Eutectic
Temperature, Pb-free
150°C dry bake 16 h
215°C
235°C
Preconditioning
Temperature, SnPb Eutectic
Temperature, Pb-free
Steam ageing
235°C
245°C
Frequency
Spectral density
Duration
10 to 500 Hz
0.07 g2/Hz
10 min in each direction
Resistance to soldering heat
2
IEC 60068-2-58 test Td 1
Solderability
IEC 60068-2-20 test Ta 2
Vibration, broad band random
IEC 60068-2-64 Fh, method 1
12QO\IRUSURGXFWVLQWHQGHGIRUUHÀRZVROGHULQJVXUIDFHPRXQWSURGXFWV
2 Only for products intended for wave soldering (plated through hole products)
DI
Notes:
ED
85°C
85 % RH
1000 hours
125°C
1000 h
NU
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Robustness of terminations
-45°C
72 h
TI
Operational life test
-40 to 100°C
500
15 min/0-1 min
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date 06/10/2016 Ϳ page 36 of 36
rev.
date
1.03
06/10/2016
ED
REVISION HISTORY
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The revision history provided is for informational purposes only and is believed to be accurate.
Headquarters
20050 SW 112th Ave.
Tualatin, OR 97062
800.275.4899
Fax 503.612.2383
cui.com
techsupport@cui.com
Novum and Architects of Modern Power are trademarks of CUI.
PMBus is a trademark of SMIF, Inc.
All other trademarks are the property of their respective owners.
CUI offers a two (2) year limited warranty. Complete warranty information is listed on our website.
CUI reserves the right to make changes to the product at any time without notice. Information provided by CUI is believed to be accurate and reliable. However, no responsibility is
assumed by CUI for its use, nor for any infringements of patents or other rights of third parties which may result from its use.
CUI products are not authorized or warranted for use as critical components in equipment that requires an extremely high level of reliability. A critical component is any component of a
life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.