产 品 规 格 书
SPECIFICATION
产 品 名 称
型
石英晶体谐振器 QUARTZ CRYSTAL UNITS
HC-49US-SMD
号
40.000MHZ-20PF
标 称 频 率
页
共 8 页
次
铜陵日科电子有限责任公司
批
准
审
核
TONGLING RIKE ELECTRONIC CO., LTD
拟
制
侯其山
胡松
谢江徽
地址:安徽省铜陵市狮子山经济开发区
ADDRESS: SHIZISHAN ECONOMIC DEVELOPMENT ZONE,TONGLING,
ANHUI
TEL:0562-6862288 6862211
POSTCODE:244000
FAX:0562-6862299
E-MAIL:rkdz@rkdz.com
确 认 签 章
APPROVAL SIGNATURE
客
物
户
料
机种/
批
深圳华秋电子有限公司
SB402020
号
49US-SMD
型号
准
审
核
检
验
铜陵日科电子有限责任公司
产品规格书/ SPECIFICATION
HC-49US-SMD
型号
Ⅰ-1 晶振电性能 Electrical Characteristics
1.标称频率
40.000 MHZ
Nominal Frequency
2.振动模式
基 频
Mode of vibration
3.工作温度范围
- 20 ℃~+ 70 ℃
Operating Temperature Range
4.保存温度范围
-40℃~+85℃
Storage Temperature Range
5.频率偏差
± 20 ppm Max
Adjustment Tolerance
6.温度偏差
± 30 ppm Max
Tolerance over the Temperature Range
7. 等效电阻
30
Ω Max.at 25℃
Equivalent Series Resistance
8.静电容
5.0 pF Max
Shunt Capacitance
9.绝缘电阻
500MΩ Min./DC100V±15V
Insulation resistance
10.老化率
±3ppm Max/Y
Aging
11.标字
Marking
40.000M
Ⅱ.测试条件 Test Condition
1.负载电容
Load Capacitance
2.激励功率
Level of Drive
3.测试仪表
Equipment
RK-0867
20
pF
100
μW
250B Crystal Impedance Meter
TONGLING RIKE ELECTRONIC CO., LTD.
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铜陵日科电子有限责任公司
产品规格书/ SPECIFICATION
型号
HC-49US-SMD
Ⅲ. 包装 PACKING
包装方式应符合运输和装卸要求,特殊包装须经双方认可。
Packing must prevent damage during transportation and handing. Specific method
will be settled by mutual agreement。
Ⅳ. 对环境影响 INFLUENCE TO ENVIRONMENT
本产品在生产过程中不使用 ODS Ⅰ,对臭氧层无破坏。
This product doesn’t use the class Ⅰ ODS at any of production process .
Ⅴ. 生产厂家 MANUFACTURE
公司名称:铜陵日科电子有限责任公司
TONGLING RIKE ELECTRONICS CO.,LTD.
地址:安徽省铜陵市狮子山经济开发区
ADDRESS: SHIZISHAN ECONOMIC DEVELOPMENT ZONE, TONGLING , ANHUI
TEL:0562-6862288 6862211
POSTCODE:244000
FAX:0562-6862299
E-MAIL:rkdz@rkdz.com
Ⅵ.其它 OTHERS
1、如果您对本公司产品规格书有疑问或书中未列出,请与我方联系,协商解决
及改进。
If you have some doubt or unknowing about this specification, Please contact us
for settlement or development.
2. 我们按照产品规格书要求保证晶体品质,若客户要求具体数据,我们可提供。
We guarantee that quartz crystal unit satisfies this specification, If you need the
data, we will provide it.
3.变更与联络(MODIFY AND CONTACT)
本产品在设计、工艺、材料、生产厂所、关键设备、操作人员等影响产品质
量的因素有变更时,应事先提供更改后的产品并经过质量认可后,方可大批量供货。
When the quality is changed due to the changes of the design, technology,
material, manufacture place, main equipment and workers, we will first supply the
modified products and obtain approval from you, then start to supply mass production.
4.售后服务(AFTER SALE SERVICE)
若在生产过程中遇到不良品,本公司负责调换,并及时提交不良品的分析及
改进措施报告经认可。
If the defection product was found in the production process, we will exchange
and provide the improving measures in time.
RK-0867
TONGLING RIKE ELECTRONIC CO., LTD.
铜陵日科电子有限责任公司
产品规格书/ SPECIFICATION
HC-49US/SMD 晶体外型尺寸
Dimensions
型号
HC-49US-SMD
UNIT: mm
包装 PACKING
每 1000 只晶体放入塑料盘,每 1 万只晶体放入一包装盒内。同时,包装形
式也依赖于具体数量而更改。
Deposit 1000 pieces of the quartz crystal units in a polyethylene bag, and pack
enough bags in a packing case to make a 10,000 pieces package. The packing format
may be subject to change by quantity.
RK-0867
TONGLING RIKE ELECTRONIC CO., LTD.
铜陵日科电子有限责任公司
产品规格书/ SPECIFICATION
HC-49US-SMD
型号
HC-49USS/SMD 石英晶体谐振器内部结构图:
Construction fig of quartz resonator:
④
①
⑦
②
⑤
序号
部 件 名 称
NO
COMPONENT
①
②
材
料
MATERIALS
Y/Z 棒
CRYSTAL BLANK
Y/Z BAR
支
架
SUPPORTER
基
座
BASE
外
④
壳
CAN
引
线
⑤
LEAD
玻 璃 子
⑥
⑧
⑥
晶体白片
③
⑦
③
⑧
GLASS
铜 合 金
COPPER
碳钢镍合金
Fe-NI
镍铜合金
NICKEL-COPPER
可 伐 丝
KOVAR
可伐玻璃子
KOVER-GLASS
导 电 胶
银胶树脂
ADHESIVE GENT
Ag-URETHANE
垫
片
CUSHION FLAKE
RK-0867
聚四氟乙烯
PLOYTETRAFLUOROETHYLENE
数量
表面处理方法
OTY
SURFACE
1
抛 光 / 腐 蚀
POLISH/ETCHED
2
1
镀
镍
NI PLATED
1
2
镀镍+浸锡
NI PLATED+SOLDER DIPPED
2
2
1
TONGLING RIKE ELECTRONIC CO., LTD.
铜陵日科电子有限责任公司
产品规格书/ SPECIFICATION
HC-49US-SMD
型号
Ⅷ.SMD 编带尺寸图
HC-49SSMD
7050
6035
5032
4025
3225
W
24.00±0.30
16.00±0.05
12.00±0.05
12.00±0.05
12.00±0.05
12.00±0.05
E
1.75±0.10
1.75±0.10
1.75±0.10
1.75±0.10
1.75±0.10
1.75±0.10
F
11.5±0.10
7.5±0.10
5.5±0.10
5.5±0.10
5.5±0.10
5.5±0.10
T
0.40±0.05
0.35±0.05
0.35±0.05
0.35±0.05
0.35±0.05
0.30±0.05
P
12.00(8.0)±0.10
8.00±0.10
8.00±0.10
8.00±0.10
8.00±0.10
8.00±0.10
P0
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
P2
2.00±0.10
2.00±0.10
2.00±0.10
2.00±0.10
2.00±0.10
2.00±0.10
D0
φ1.50+0.10
φ1.50+0.10
φ1.50+0.10
φ1.50+0.10
φ1.50+0.10
φ1.50+0.10
D1
φ1.50MIN
φ1.50MIN
φ1.50MIN
φ1.50MIN
φ1.50MIN
φ1.50MIN
A0
4.60±0.10
5.40±0.10
3.90±0.10
3.60±0.10
2.80±0.10
2.85±0.10
K0
3.50±0.10
1.80±0.10
1.50±0.10
1.10±0.10
0.90±0.10
0.85±0.10
B0
14.20±0.15
7.40±0.10
6.40±0.10
5.40±0.10
4.30±0.10
3.55±0.10
B
D
W 1
C
T 1
A
A
N
HC-49SMD
8045
7050
6035
5032
4025
3225
φ330±1.0
φ178±2.0
φ178±2.0
φ178±2.0
φ178±2.0
φ178±2.0
φ178±2.0
B
2.30±0.20
2.00±0.50
2.00±0.50
2.00±0.50
2.00±0.50
2.00±0.50
2.00±0.50
C
φ13.5±0.20
φ13.2±0.20
φ13.2±0.20
φ13.2±0.20
φ13.2±0.20
φ13.2±0.20
φ13.2±0.20
D
φ21.5±0.20
φ20.0 min
φ20.0 min
φ20.0 min
φ20.0 min
φ20.0 min
φ20.0 min
N
φ100.0±0.5
φ60.5±1.0
φ60.5±1.0
φ60.5±1.0
φ60.5±1.0
φ60.5±1.0
φ60.5±1.0
W1
24.5±0.20
16.5±0.20
16.5±0.20
12.5±0.20
12.5±0.20
12.5±0.20
12.5±0.20
T1
2.30±0.20
1.80±0.20
1.80±0.20
1.80±0.20
1.80±0.20
1.80±0.20
1.80±0.20
RK-0867
TONGLING RIKE ELECTRONIC CO., LTD.
铜陵日科电子有限责任公司
产品规格书/ SPECIFICATION
型号
HC-49US-SMD
Ⅷ.可靠性试验项目
Reliability Test Items
1.机械性能试验 Mechanical Performance Tests
试 验 项 目
试 验 方 法
规格 No.
Test
Test Method
Spec. No
Item
从 75 厘米高,3 次,自由落在 3 厘米的硬木板上
耐冲击
1-1
shock
Orient the sample in any attitude and drop it three times from a
height of 75 cm onto a hardwood board with a thickness of 3 cm
A
振动频率 10~55Hz,振幅 1.5mm 时间 1.5 分钟循环,在 X、Y、
耐振性
1-2
Vibration
Z 轴方向各 2 小时,总计 6 小时。
Subject the sample to 1.5-minute cycles of frequencies of 10 to 55
A
Hz and amplitudes of 1.5mm for two hours in each of the X,Y, and
Z directions, or 6 hours in total.
引出端强度
1-3
Tensile strength of
terminal
每端子加 1.5Kg 负荷,保持 30±5 秒
Apply a 1.5Kg tensile load to each terminal and sustain it for
A.C
30±5 seconds.
每端子加 0.5Kg 负荷并弯曲成 90°,恢复原状后,再反方向弯
引线弯曲度
1-4
Bending strength
of terminal
曲成 90°。
Apply a 0.5 Kg load to one of the terminals, and after tilting the
A.C
main unit for 90°,restore to its original attitude. Then, tilt it in an
opposite direction for 90°,and restore to its original attitude.
槽焊法,浸锡温度 230±5℃时间 5±0.5 秒,端子浸助焊剂时
间 5±0.5 秒,浸锡高度 2mm。
可焊性
1-5
Solder ability
Dip terminals in RMA flux for5 ± 0.5 seconds. Under room
temperature. Dip terminals in a 230±5℃ solder bath for 5±0.5
seconds. The solder shall leave an undipped terminal length of
D
2
mm at their base .
槽焊法,温度 260±5℃时间 10±0.5 秒,锡面离基座高度
耐焊接热
2mm 以上。
Resistance to
Dip terminals in a 260±5℃ solder bath for 10±0.5 seconds.
Soldering Heat
The solder shall leave an undipped terminal length of 2 mm at their
1-6
A
base.
用氦质谱仪测试或加压测绝缘电阻
1-7
RK-0867
气密性
Leaking Test
Take measurements with a helium leakage detector,or measure
insulation resistance under pressure.
TONGLING RIKE ELECTRONIC CO., LTD.
E
铜陵日科电子有限责任公司
产品规格书/ SPECIFICATION
HC-49US-SMD
型号
Ⅷ.可靠性试项目
Reliability Test Items
2. 环境测试 Environmental Tests
试 验 项 目
试 验 方 法
规格 No.
Test
Test Method
Spec. No.
Item
在-40℃环境中非工作状态放置 500 小时
耐寒性
2-1
2-2
Cold
Expose the sample in an inoperative mode to 500 hours in a -40℃
耐性
在+85℃环境中非工作状态放置 500 小时
Dry heat
Damp heat
热冲击
2-4
Thermal
shock
B
在温度+65℃,湿度 95%环境中非工作状态放置 500 小时
耐湿性
2-3
Expose the sample in an inoperative mode to 500 hours in a 85℃
A
Expose the sample in an inoperative mode to 500 hours in a
B
65℃,and 95%RH
在-40℃保持 30 分钟,100℃保持 30 分钟,循环 5 次。
Subject the sample to 5 temperature variation cycles at -40℃ for
A
30 minutes and +100℃ for the next 30 minutes in each cycles.
SPECIFICATIONS 规格
规格
No.
规
Spec No.
格
Specification
试验前后,频率变化在±5ppm 以内,等效电阻变化在要求范围内。
A
Any variation between the pre- and post-test frequencies shall remain within ±5ppm. The
post-test equivalent series resistance shall remain within its specified tolerance range.
试验前后,频率变化在±10ppm 以内,等效电阻变化在要求范围内。
B
Any variation between the pre- and post-test frequencies shall remain within ± 10ppm.
The post-test equivalent series resistance shall remain within its specified tolerance range.
试验前后,外观未见明显损伤,气密性末破坏。
C
After each test, no visible damage shall be manifested, nor shall the hermetic seal break
down.
D
E
上锡量至少在 90%以上.
At least 90% of each dipped area shall be covered by fresh solder
1×10-2 μPa.m3 /s Max or
IR≥500MΩ
※测试在室温 25±2℃环境中进行,每次试验后,样品必须在 25±2℃环境中恢
复 2 小时以上。
※Measurements shall be taken at 25±2℃,and after each test, the sample be exposed
to two hours at 25±2℃
RK-0867
TONGLING RIKE ELECTRONIC CO., LTD.
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