PRODUCT SPECIFICATION SHEET
Customer
-
Customer P/N
-
Product Type
Temperature Sensing Crystal
Part Number
9Z38400002-Q
Part Description
Nominal Frequency
Prepared
Li Xiang
Reviewed
Kuro Peng
Approved
Xing Yue
Date
Version
B3
SMD TSX 2.0 x 1.6 (TH + Xtal)
38.400000MHz
Customer's Approval & Date:
2022-11-9
广东惠伦晶体科技股份有限公司
中 国 广 东 省 东 莞 市 黄 江 镇 东 环 路 鸡 啼 岗 段 68 号
68 Donghuan Road, Jitigang Village, Huangjiang,
Dongguan, Guangdong Province, P. R. China
WEB : http://www.dgylec.com/
TEL : +86 ( 0 ) 769 - 38879888
FAX : +86 ( 0 ) 769 - 38879889
EMAIL : yl@dgylec.com
FAITH LONG CRYSTAL Proprietary and Confidential Information
RoHS
COMPLIANT
Pb
Lead-Free
Moisture Sensitivity Level 1
Page 1 of 14
SMD TSX 2.0 x 1.6 (TH + Xtal)
PN: 9Z38400002-Q
Ver.
B3
CONTENTS
#
Item
1
History of Specification Revision
3
2
Electrical Specifications
4
3
4
5
6
Page
2.1 Specifications for operation condition and electrical characteristics
4
2.2 Specifications for crystal drive level dependency (DLD)
5
2.3 Specifications for GPS quality
6
2.4 NTC thermistor specification table
7
Product Design
8
3.1 Package dimensions and pad functions
8
3.2 Recommended land pattern
8
3.3 Recommended reflow profile
8
3.4 Marking definition
9
3.5 Recommended reflow profile
9
3.6 Structure illustration
10
Reliability Assurance
11
4.1 Mechanical endurance
11
4.2 Environmental endurance
11
Taping and Packing
12
5.1 Tape and reel
12
5.2 Packing standard
13
Specification of the Environment-related Substances
FAITH LONG CRYSTAL Proprietary and Confidential Information
14
Page 2 of 14
SMD TSX 2.0 x 1.6 (TH + Xtal)
PN: 9Z38400002-Q
Ver.
B3
1. History of Specification Revision
Ver.
Content
Date
Reviser
Initial released
2019-7-2
K. Yasuda
2019-7-4
K. Yasuda
2019-7-4
K. Yasuda
A3
P.8 Update reliability items.
P.10 Update packaging requirement.
P.11 Change specification of the environmentrelated substances
Add MSL and leakage specifications.
2019-12-30
Chen XuanRu
A4
Change ESR.
2020-1-10
Chen XuanRu
B0
Change Drive Level.
2020-3-20
Chen XuanRu
B1
Change Item 22 and 23.
2020-7-22
Chen XuanRu
B2
Update marking
2022-6-29
Li Xiang
B3
Add ESD specifications.
2022-11-9
Li Xiang
A0
A1
A2
Revised the drawing.
Add "Direction of feed."
Add ESD specifications.
Add MSL and Leak specifications.
FAITH LONG CRYSTAL Proprietary and Confidential Information
Remark
Page 3 of 14
SMD TSX 2.0 x 1.6 (TH + Xtal)
PN: 9Z38400002-Q
Ver.
B3
2. Electrical Specifications
2.1 Specifications for operation condition and electrical characteristics
#
Parameter
Min.
Typ.
1
Nominal frequency
38.400000
2
Crystal cut type
AT-cut
3
Mode of vibration
Fundamental
4
ESD
HBM>2000V
5
ESD
CDM ≥ 200V
6
MSL
Level 1
Load
capacitance
(C
)
7
8.0
L
8
Drive level
10
9
Operating temperature range
-30
10
Storage temperature range
-40
-
Max.
100
+105
+105
Unit
MHz
pF
mW
°C
°C
Remark
JESD22-A114-B
JESD22-C101
IPC/JEDEC J-STD-033C
Note 1.
-
11
Initial frequency tolerance
-10
-
+10
ppm
At 25±3°C
12
Frequency drift after reflow
-2.0
-
+2.0
ppm
After two times of reflow
13
Frequency tolerance over temperature
-12
-
+12
ppm
Within -30°C to +85°C.
Above +85°C see Note 2.
14
15
16
17
18
19
20
21
Frequency aging
Equivalent series resistance (ESR)
Insulation resistance
Quality factor (Q)
Spurious mode series resistance
Pullability
ESD (HBM)
ESD (MM)
-0.7
500
75,000
1,100
10
-5
-1
-
+0.7
80
16
+5
+1
ppm/yr
Ω
MΩ
Ω
ppm/pF
ppm
ppm
22
Inflection point
27.5
29
30.5
°C
23
First-order curve fitting parameter (C1)
-0.4
-
-0.1
ppm/°C
24
Second-order curve fitting parameter
(C2)
-4.5
0
+4.5
x10
2
ppm/°C
Note 5.
25
Third-order curve fitting parameter (C3)
+8.5
+10.0
+11.5
x10-5
3
ppm/°C
Note 5.
Note 3.
at DC 100V
Note 4.
Within ±1 MHz offset.
Voltage: 1000V
Voltage: 200V
Specified at max drive
level.
𝐶2
𝑡 = 𝑡0 −
3𝐶3
Note 5.
-4
Note 1
Note 2
Note 3
The load capacitance is measured according to IEC Standard #60444-8.
Above 85°C, the frequency tolerance over temperature is bound by the third order coefficient range.
The ESR max is specified at max drive level minimum Q, drives a smaller ESR; that is, design the crystal to the
minimum Q.
Note 4
Note 5
The minimum Q value calculated from ESR and L is smaller than this specification.
The curve fitting parameter is obtained from the QTI crystal curve fitting algorithm, using the
temperatureinflection point t0 = 29°C.
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Page 4 of 14
SMD TSX 2.0 x 1.6 (TH + Xtal)
PN: 9Z38400002-Q
Ver.
B3
2. Electrical Specifications (Cont.)
2.2 Specifications for crystal drive level dependency (DLD)
#
Parameter
Min.
1
Drive level measurement condition
0.01
Typ.
Max.
Unit
Remark
-
200
mW
Drive level from 0.01 μW
to 200 μW to 0.01 μW
2
Number of points
3
DLD Frequency (Maximum - Minimum)
-
-
3.0
ppm
Define as FDLD.
Note 6.
4
DLD Frequency (Repeatability)
-
-
0.7
ppm
Define as FDLDH.
Note 7.
5
DLD ESR (Maximum - Minimum)
-
-
20
%
Define as DLD10.
Note 6.
6
DLD ESR (Repeatability)
-
-
10
%
Define as DLDH3.
Note 7 ~ 10.
7
Air-tightness
-
-
1.1
8
Moisture sensitivity level
Note 6
Note 7
Note 8
Note 9
Note 10
29
MSL level 1
points
15 points up and 15
points down = 29 total
data points.
×10-9
3
Pa×m /s
ppm/°C
Helium leak detector
-
Maximum - minimum: Difference between the maximum and minimum in a two-way measurement.
In case of ESR, the change rate is (max - min)/min < 20%.
Repeatability of the two-way measurement is defined in the above Drive level measurement condition.
For DLD ESR (Repeatability), the change rate is defined as (ESR2 - ESR1)/ESR1.
ESR1: This is the first measurement on each drive level.
ESR2: This is the second measurement on each drive level.
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Page 5 of 14
SMD TSX 2.0 x 1.6 (TH + Xtal)
PN: 9Z38400002-Q
Ver.
B3
2. Electrical Specifications (Cont.)
2.3 Specifications for GPS quality
#
Parameter
1
2
3
Min.
Drive level measurement condition
Residual frequency stability slope 1
Residual frequency stability slope 2
Typ.
Max.
200
-100
-50
-
+100
-
+50
Unit
Remark
mW
All measurements in GPS
quality are taken at 200 μ
W drive level.
ppb/°C
Within -30°C to -15°C.
Note 11 and Note 12
(Condition 1A).
ppb/°C
Within -15°C to +70°C.
Note 11 and Note 12
(Condition 1A).
4
Residual frequency stability slope 3
-100
-
+100
ppb/°C
Within +70°C to +85°C.
Note 11 and Note 12
(Condition 1A).
5
5°C small orbit hysteresis 1-1
-100
-
+100
ppb/°C
Within -30°C to -15°C.
Note 13 (Condition 1B).
6
5°C small orbit hysteresis 1-2
-50
-
+50
ppb/°C
Within -15°C to +70°C.
Note 13 (Condition 1B).
7
5°C small orbit hysteresis 1-3
-100
-
+100
ppb/°C
Within +70°C to +85°C.
Note 13 (Condition 1B).
8
5°C small orbit hysteresis 2
100 (magnitude)
ppb pk-pk
Note 14.
Note 11
Note 12
Residual = difference from fifth-order curve fit.
Condition 1A – Test condition (continuous temperature rate change of ~1.0°C/min.):
Measure F/T points every 1°C, heating up from -30 to +85°C, subtract a fifth-order polynomial best fit
and then calculate the slope of the residual.
Note 13
Condition 1B – Hysteresis 1 test condition (continuous temperature rate change of ~1.0°C/minute):
Measure F/T points every 0.5°C while cycling temperature over a 5°C small temperature orbit; an
example 5°C small orbit temperature cycle is +30°C to +35°C to +30°C.
During every individual heating/cooling cycle, there should be 11 points. Discard the first point of each
heating and cooling cycle. This leaves 10 points for each heating and cooling cycle. Subtract the fifthorder polynomial best fit from 1A for each of the 10 points, and then calculate the slope of the residual
for each of these heating and cooling 10 point curves.
Note 14
Hysteresis 2 test condition (continuous temperature rate change of ~1.0°C/min.):
Measure F/T points every 0.5°C while cycling temperature over a 5°C small temperature orbit; an
example 5°C small orbit temperature cycle is +30°C to +35°C to +30°C.
During every individual heating/cooling cycle there should be 11 points; discard the first and last point
of each heating and cooling cycle, which results in 9 temperature points. Calculate the average
measured peak-to-peak frequency difference for these 9 temperature points.
The average difference is the magnitude of the small orbit hysteresis 2.
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Page 6 of 14
SMD TSX 2.0 x 1.6 (TH + Xtal)
PN: 9Z38400002-Q
Ver.
B3
2. Electrical Specifications (Cont.)
2.4 NTC thermistor specification table
#
Parameter
1
Operating temperature range
2
Storage temperature range
3
Resistance
4
B-constant
5
Tolerance
Min.
-30
-40
-
Typ.
100
4,250
-
Max.
+105
+105
1
Unit
°C
°C
kΩ
K
%
Remark
At 25°C*
At 25°C - 50°C
-
*In order to get the precise resistance value of the thermistor, the temperature control will be very important
during testing since the resistance value will change ~4% per 1℃ temperature difference.
Please check the following Murata website for detail explanation.
https://www.murata.com/en-us/support/faqs/products/thermistor/ntc/pct/0001
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Page 7 of 14
PN: 9Z38400002-Q
SMD TSX 2.0 x 1.6 (TH + Xtal)
Ver.
B3
3. Product Design
3.1 Package dimensions and pad functions
(Unit : mm)
Top view
3.2 Pad connection diagram and function
Bottom view
#4
#3
#1
#2
#4
#3
YL 3 8 4
■□□□□
#1
#2
Lateral view
Pad
1
2
3
4
Bottom view
3.3 Recommended land pattern
Function
Xtal in
Thermistor out, connecting to ground
Xtal out
Thermistor in
(Unit : mm)
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Page 8 of 14
PN: 9Z38400002-Q
SMD TSX 2.0 x 1.6 (TH + Xtal)
Ver.
B3
3. Product Design (Cont.)
3.4 Marking definition
Frequency code
Ex:38.400MHz=384
Y L 3 8 4
■
LOT code (2 digits)
Year and Month
Administrative Symbo
Table of Year and Month code
Month
JAN FEB
Year
2021
2022
2023
2024
2025
2026
2027
2028
A
N
a
n
B
P
b
p
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
NOV
DEC
C
Q
c
q
D
R
d
r
E
S
e
s
F
T
f
t
G
U
g
u
H
V
h
v
J
W
j
w
K
X
k
x
L
Y
l
y
M
Z
m
z
3.5 Recommended reflow profile
Temp. (℃)
10 sec. Max.
265
260
5
(1) Total time : 360 sec. Max.
(2) Solder melting point : 225℃
220
60 -150 Csec.
180
150
60-120 sec.
Time (sec.)
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SMD TSX 2.0 x 1.6 (TH + Xtal)
PN: 9Z38400002-Q
Ver.
B3
3. Product Design (Cont.)
3.6 Structure illustration
#
1
Components
Cap (Lid)
2
Base (Package)
3
4
5
6
Pad (Package)
Crystal blank
Electrode
Conductive adhesive
7
Thermistor
8
Solder
Materials
Kovar (Fe + Co + Ni)
Ceramic (AI2O3) +
Kovar (Fe + Co + Ni)
Ni + Au
SiO2
Cr + Nobel material
Ag
Alumina Ceramics
(Al2O3), Ni + Ag+ Sn
QTY
1
Finish/Specifications
Ni plating
1
Alumina ceramics
4
1
2
2
Tungsten metalization + Ni plating + Au plating
-
1
-
Sn + Ag + Cu
2
-
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Silicone resin
Page 10 of 14
SMD TSX 2.0 x 1.6 (TH + Xtal)
PN: 9Z38400002-Q
Ver.
B3
4. Reliability Assurance
4.1 Mechanical endurance
#
Item
Test Condition
Reference
1
Drop test
150 cm height, fall freely onto stainless plate, 3 times.
JIS C6701
2
Shock test
150 g weight, 150 cm height onto concrete floor.
Each direction (±x, ±y, ±z) for 3 cycles.
IEC-68-02-27
3
Mechanical shock
Half sine wave 1000 G. Three mutually perpendicular
axes, each axis for 3 times. Duration time 1.0ms.
MIL-STD-202F
4
Vibration
Frequency range : 10 ~ 55 Hz
Amplitude : 1.52 mm
Pendicular axes each test time : 2 hours(x,y,z Axis)
Total test time 6 hours
MIL-STD-883E
5
Gross Leak
Standard sample for automatic gross leak detector.
Test pressure: 2kg /cm2.
MIL-STD-883E
6
Fine Leak
Helium bombing 4.5 kgf/cm for 2 hours.
MIL-STD-883E
Solderability
Temperature : 260°C ± 5°C
Immersing depth : 0.5 mm minimum
Immersion time : 5 ±1 seconds
Flux : Rosin resin methyl alcohol solvent (1:4)
GB/T 2424.172008 / IEC
60068-244:1995;
GB/T 2423.282005 / IEC
60068-220:1979
Resistance To Soldering Heat
Pre-heat temperature 125℃
Pre-heat time 60 ~ 120 sec.
Test temperature 260 ±5℃
Test time 5 ±1 sec.
MIL-STD-202F
7
8
*Storage conditions :18 months
4.2 Environmental endurance
#
Item
1
High temperature storage
2
Low temperature storage
2
*Constant humidity :40~70%
Test Condition
Temperature : +125°C ± 3°C
Duration : 500 ± 12 hours
Reference
MIL-STD-883E
Temperature : -40°C ± 3°C
Duration : 500 ± 12 hours
MIL-STD-883E
Total 100 cycles of the following temperature cycle
1 cycle
o
3
Thermal shock
(Air to Air)
125+/- 3 C
MIL-STD-883E
25 oC
-55+/- 3
o
C
30 min.
30 min.
10 min. max.
4
High temperature &
humidity
Temperature : 85°C ± 3°C
Humidity : RH 85%
Duration : 500 hours
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JIS C5023
Page 11 of 14
SMD TSX 2.0 x 1.6 (TH + Xtal)
PN: 9Z38400002-Q
Ver.
B3
5. Taping and Packing
5.1 Tape and reel (EIA-481-2)
Direction of feed
Index mark
Direction of products
Carrier tape
Reel
Cover tape
Reel label (Model, Qty, Lot, ...)
Package Type
Dimension (Unit : mm)
A0
B0
1.90±0.1
2.30±0.1
2016 TSX (8mm)
P1
P2
4.00±0.1
2.00±0.1
Standard Reel Quantity is 3000 pcs per reel.
The inspection standard of tape tension
Item
K0
1.25±0.10
D1
1.00±0.05
T
0.25±0.05
D0
1.55±0.05
W
8.00±0.3
P0
4.00±0.1
E
1.75±0.2
Defect
Method
F
3.50±0.1
Appearance
All
1. The tape is not coincidence
2. The bubble
Visual inspection
Tape tension
2016 - 8mm
Overstep 34±6g (28 to 40g)
Pull test
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SMD TSX 2.0 x 1.6 (TH + Xtal)
PN: 9Z38400002-Q
Ver.
B3
5. Taping and Packing (Cont.)
5.2 Packing standard
Out-going packing instruction
Reel packing
Name:Reel
Standard:Diameter 18cm
Material:Plastics
Name:Anti-static shielding bag
Standard:205250mm
Material:APET/CPP
Inner packing
Name:Bubble wrap
Standard:430330(t)20mm
Material:HDPE
Quantity : Max.15 reels
Carton
Name:Carton
Standard:400400(H)280mm
Material:AB corrugated paper
Quantity:4 bags
L1
L2
The label information
Label
Label Drawing
Name of Article
Spec.
L1
条码标签
Bar Code Label
(Chintz Paper)
1. Part No.
2. Lot No.
3. Q'ty
4. Freq.
7050mm
White
L2
条码标签
Bar Code Label
(Chintz Paper)
1. Part No.
2. Date Code
3. Q'ty
4. Freq.
7050mm
White
Remark:
Label size
Printing
Specifications on the label is for default templates purpose and may change with different product.
If any specified requirements for labels packaging is needed, please provide the instruction information.
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Page 13 of 14
SMD TSX 2.0 x 1.6 (TH + Xtal)
PN: 9Z38400002-Q
Ver.
B3
6. Specification of the Environment-related Substances
#
Range
Banned Substances
Max. concentration (ppm; mg/kg)
Product
Packing
1
镉及镉化合物
Cadmium and cadmium compounds
100
100
2
铅及铅化合物
Lead and lead compounds
1000
100
3
汞及汞化合物
Mercury and mercury compounds
1000
100
4
六价铬化合物
+6
Hexavalent-Chromium VI (Cr )
1000
100
5
聚溴联苯 PBB
Polybrominated biphenyls
1000
N/A
6
聚溴二苯醚 PBDE
Polybrominated diphenyl ethers
1000
N/A
7
邻苯二甲酸二(2-乙基己基)酯 DEHP
Di (2-ethylhexyl) phthalate
1000
N/A
8
邻苯二甲酸丁苄酯 BBP
Butyl Benzyl Phthalate
1000
N/A
9
邻苯二甲酸二丁酯 DBP
Dibutyl Phthalate
1000
N/A
10
邻苯二甲酸二异丁酯 DIBP
Diisobutyl Phthalate
1000
N/A
11
氟(F)、氯(Cl)、溴(Br)、碘(I)
Fluorine, Chlorine, Bromine, Iodine
900、900、900、900
注:Br + Cl<1000
N/A
12
包装材料中重金属(汞、镉、六价铬、
铅、PBB、PBDE)之总量
Heavy metals (mercury, cadmium, lead,
Cr+6,PBB and PBDE) in packing materials
N/A
100
铅(Pb) + 镉(Cd) + 汞(Hg) + 六价
铬(Cr+6)
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