X503212MSB4SI

CRYSTAL UNIT YSX531SL Applications Features ‧Industrial Control Consumers. ‧Dimensions:5.00 x 3.20 x 0.90 mm. ‧High precision and high frequency stability. ‧Standard Frequency: 8 to 54MHz ‧Extremely good for reducing EMI effect. Specifications 8 to 54 MHz Standard Frequency Vibration Mode AT Fundamental 10pF, 20pF, or specify Load Capacitance Frequency Tolerance (at 25 ℃ ) ±10ppm, ±20ppm, or specify Frequency Versus Temperature Characteristics ±20ppm, or specify -20~+70℃，-40~+85℃，or specify Operating Temperature Storage Temperature -55~+125℃ or specify Shunt Capacitance 5 pF Max. 1~200μWMax. (100uW typical) Level of Drive Aging (at 25 ℃ ) ±3ppm/year Max. Equivalent Series Resistance(ESR) Fundamental 8 ~ 12 MHz 12 ~ 25 MHz 25 ~ 54 MHz 60~80 Ω Max. 40~60 Ω Max. 30~40 Ω Max. Dimensions and Patterns [unit:mm] Package Size – Dimensions (Unit: mm) 0.4 5 .0± 0. 15 G ND 3 Marking To p V i e w GN D 2 1 S i de Vi e w 2 To p Vi e w C r y s t a l C o n n e c t io n 0 .9± 0. 15 1 3 4 3 . 2 ±0. 1 5 4 2 .0 1 .7 2 .0 2. 6 1.0 1.2 2 4 Bo t t o m V i e w 1.2 1.4 1 To p V i e w Su gg e s t e d L a y o ut 3 www.yxcxtal.com CRYSTAL UNIT YSX531SL Reflow Soldering Profile Temperature Pre Heating Temperature Tp1 ~ Tp2 = + 170 °C Heating Temperature TMlt = + 220 °C Peek Temperature TMax. = + 260 °C +260℃ TMax. +220℃ Tmlt Point of measuring In case of Solder ability Terminal. In case of Resistance to soldering heat Surface. Tp2 Tp1 35s 100s t(time) Taping Specification(Unit: mm) Size A B C D E F G H SMD-5032 180±2.0 12.0±0.3 5.40±0.1 3.60±0.1 8.00±0.3 1.45±0.1 61.0±1.0 12.0±1.0 1000 pcs per reel www.yxcxtal.com