0,7
신신 제제
APPROVED
2011.05.23
P.K.KOH
B 인인부 치치 변변 0.8 ⇒ 0.92mm
2011.06.09
P.K.KOH
SHIELD CASE THICKNESS 0.3±0.02 => 0.3 + 0.02 -0
2012.03.30
4 ±0.1
0,3
O
2 ±0.05
+0.1
0
TAPING 사양도 (SCALE 3/1)
4 ±0.1
NOTES
1. MATERIAL : SUS301
2. MATERIAL THICKNESS :0.15t
3. FINISHED : Sn(100%) PLATING ON BOTH SIDE
( NI 0.5㎛ Sn 1.27㎛ )
4. PACKING MATERIALS.
- REEL : HIPS 0.3t
- COVER TAPE : PS
_ Q'TY/REEL : 10,000ea
5. AVAILABLE SHIELD CASE THICKNESS : 0.3+ 0.02 -0
6. CONTACT RESISTANE 300mmΩ MAX
7. STENCLI THICKNESS : 0.12T
0,8
+0.1
0,92 -0.05
0,25 +0.02
-0.05
1,22
SCALE : 15/1
0,8
1,1
1
1,1
0,9 Max
RECOMMENDED PCB LAYOUT
6,4
RECOMMENDED STENCIL LAY-OUT 0.1T
1,5
8. Maintain 90˚±3 while engage & disengage shield can & shield
clip to prevent deformation & to maintain retention force of
shield clip
DATA
2011.05.23
0,8
6,7
P.K.KOH
16
7,5 ±0.1
1,4
3,25
6,5
1
A
DATE
C
1,75 ±0.1
0,5
1,85
0,15
REV
REVISION HISTORY
DESCRIPTION
1,55
0,8
0,4
APP.
CHECK
DESG. 2011.05.23
NAME
LEE
TITLE
P.K.KOH
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES ARE ANGLES ± 0. 3°
0~1 ± 0.05 1 ~ 5 ± 0.1
5 ~ 10 ± 0.15
SIZE DWG NO
SHILED CLIP
A3
ICSRC6508-025SFR
FILE NAME: ICSRC6508-025SFR.dft
SCALE:
WEIGHT:
SHEET 1 OF 1
REV
C
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