MCR08BT1,115

MCR08BT1 SCR 5 September 2018 Product data sheet 1. General description Planar passivated SCR with sensitive gate in a SOT223 surface mountable plastic package. This SCR is designed to be interfaced directly to microcontrollers, logic integrated circuits and other low power gate trigger circuits. 2. Features and benefits • • • • Sensitive gate Planar passivated for voltage ruggedness and reliability Direct triggering from low power drivers and logic ICs Surface mountable package 3. Applications • • • General purpose switching and phase control Ignition circuits, CDI for 2- and 3-wheelers Motor control - e.g. small kitchen appliances 4. Quick reference data Table 1. Quick reference data Symbol Parameter VRRM repetitive peak reverse voltage IT(AV) average on-state current IT(RMS) RMS on-state current ITSM Tj Conditions Min Typ Max Unit - - 200 V half sine wave; Tsp ≤ 112 °C; Fig. 1 - - 0.5 A half sine wave; Tsp ≤ 112 °C; Fig. 2; Fig. 3 - - 0.8 A non-repetitive peak on- half sine wave; Tj(init) = 25 °C; tp = 10 ms; Fig. 4; Fig. 5 state current - - 8 A half sine wave; Tj(init) = 25 °C; tp = 8.3 ms - - 9 A - - 125 °C VD = 12 V; IT = 10 mA; Tj = 25 °C; Fig. 9 - 50 200 µA VDM = 134 V; Tj = 125 °C; RGK = 1 kΩ; (VDM = 67% of VDRM); exponential waveform; Fig. 14 500 800 - V/µs junction temperature Static characteristics IGT gate trigger current Dynamic charateristics dVD/dt rate of rise of off-state voltage MCR08BT1 WeEn Semiconductors SCR Symbol Parameter Conditions Min Typ Max Unit VDM = 134 V; Tj = 125 °C; (VDM = 67% of VDRM); exponential waveform; gate open circuit; Fig. 14 - 25 - V/µs Simplified outline Graphic symbol 4 A 5. Pinning information Table 2. Pinning information Pin Symbol Description 1 K cathode K G 2 A anode 3 G gate 4 A mb; connected to anode sym037 1 2 3 SC-73 (SOT223) 6. Ordering information Table 3. Ordering information Type number MCR08BT1 MCR08BT1 Product data sheet Package Name Description Version SC-73 plastic surface-mounted package with increased heatsink; 4 leads SOT223 All information provided in this document is subject to legal disclaimers. 5 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 2 / 14 MCR08BT1 WeEn Semiconductors SCR 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDRM Min Max Unit repetitive peak off-state voltage - 200 V VRRM repetitive peak reverse voltage - 200 V IT(AV) average on-state current half sine wave; Tsp ≤ 112 °C; Fig. 1 - 0.5 A IT(RMS) RMS on-state current half sine wave; Tsp ≤ 112 °C; Fig. 2; Fig. 3 - 0.8 A ITSM non-repetitive peak onstate current half sine wave; Tj(init) = 25 °C; tp = 10 ms; Fig. 4; Fig. 5 - 8 A half sine wave; Tj(init) = 25 °C; tp = 8.3 ms - 9 A 2 Conditions 2 I t I t for fusing tp = 10 ms; SIN - 0.32 A²s dIT/dt rate of rise of on-state current IT = 2 A; IG = 10 mA; dIG/dt = 100 mA/µs - 50 A/µs IGM peak gate current - 1 A VRGM peak reverse gate voltage - 5 V PGM peak gate power - 2 W PG(AV) average gate power - 0.1 W Tstg storage temperature -40 150 °C Tj junction temperature - 125 °C over any 20 ms period 001aac104 1 Ptot (W) a = 1.57 1.9 0.8 2.8 116 4 0.4 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 0.2 0 0 0.1 0.2 0.3 Tsp(max) (°C) 113 2.2 0.6 110 0.4 0.5 119 α 0.6 IT(AV) (A) 122 125 0.7 a = form factor = IT(RMS) / IT(AV) Fig. 1. Total power dissipation as a function of average on-state current; maximum values MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. 5 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 3 / 14 MCR08BT1 WeEn Semiconductors SCR 001aac107 2.0 001aac108 1.2 IT(RMS) (A) 112 °C IT(RMS) (A) 1.5 0.8 1.0 0.4 0.5 0 10-2 10-1 0 -50 1 10 surge duration (s) f = 50 Hz; Tsp = 112 °C Fig. 2. RMS on-state current as a function of surge duration for sinusoidal currents; maximum values 0 50 100 Tsp (°C) 150 Fig. 3. RMS on-state current as a function of solder point temperature; maximum values 001aac105 10 ITSM (A) 8 6 4 IT ITSM 2 0 t tp Tj initial = 25 °C max 1 102 10 number of cycles 103 f = 50 Hz Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. 5 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 4 / 14 MCR08BT1 WeEn Semiconductors SCR 001aac106 103 IT ITSM (A) ITSM t tp Tj initial = 25 °C max 102 10 1 10-5 10-4 10-3 tp (s) 10-2 tp ≤ 10 ms Fig. 5. Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum values MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. 5 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 5 / 14 MCR08BT1 WeEn Semiconductors SCR 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-sp) thermal resistance from junction to solder point Fig. 6 - - 15 K/W Rth(j-a) thermal resistance from junction to ambient free air printed circuit board mounted; minimum pad area; in free air; Fig. 7 - 70 - K/W printed circuit board mounted; minimum footprint; in free air; Fig. 8 - 156 - K/W 001aac114 102 Zth(j-sp) (K/W) 10 1 P 10-1 tp 10-2 10-5 10-4 10-3 10-2 10-1 1 tp (s) t 10 Fig. 6. Transient thermal impedance from junction to solder point as a function of pulse duration MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. 5 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 6 / 14 MCR08BT1 WeEn Semiconductors SCR 3.8 min 36 1.5 min 18 60 9 4.5 4.6 6.3 1.5 min (3×) 10 2.3 1.5 min 4.6 001aab508 7 All dimensions are in mm 15 Fig. 8. Minimum footprint SOT223 50 001aab509 All dimensions are in mm Printed circuit board: FR4 epoxy glass (1.6 mm thick), copper laminate (35 um thick) Fig. 7. Printed circuit board pad area: SOT223 MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. 5 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 7 / 14 MCR08BT1 WeEn Semiconductors SCR 9. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit Static characteristics IGT gate trigger current VD = 12 V; IT = 10 mA; Tj = 25 °C; Fig. 9 - 50 200 µA IL latching current VD = 12 V; IG = 0.5 mA; Tj = 25 °C; RGK(ext) = 1 kΩ; Fig. 10 - 2 6 mA IH holding current VD = 12 V; Tj = 25 °C; RGK(ext) = 1 kΩ; Fig. 11 - 2 5 mA VT on-state voltage IT = 1.2 A; Tj = 25 °C; Fig. 12 - 1.25 1.7 V VGT gate trigger voltage VD = 12 V; IT = 10 mA; Tj = 25 °C; Fig. 13 - 0.5 0.8 V VD = 200 V; IT = 10 mA; Tj = 125 °C; Fig. 13 0.2 0.3 - V ID off-state current VD = 200 V; RGK(ext) = 1 kΩ; Tj = 125 °C - 0.05 1 mA IR reverse current VR = 200 V; Tj = 125 °C; RGK(ext) = 1 kΩ - 0.05 1 mA VDM = 134 V; Tj = 125 °C; RGK = 1 kΩ; (VDM = 67% of VDRM); exponential waveform; Fig. 14 500 800 - V/µs VDM = 134 V; Tj = 125 °C; (VDM = 67% of VDRM); exponential waveform; gate open circuit; Fig. 14 - 25 - V/µs tgt gate-controlled turn-on ITM = 2 A; VD = 200 V; IG = 10 mA; dIG/ time dt = 0.1 A/µs; Tj = 25 °C - 2 - µs tq commutated turn-off time - 100 - µs Dynamic charateristics dVD/dt rate of rise of off-state voltage MCR08BT1 Product data sheet VDM = 134 V; Tj = 125 °C; ITM = 1.6 A; VR = 35 V; (dIT/dt)M = 30 A/µs; dVD/ dt = 2 V/µs; RGK(ext) = 1 kΩ; (VDM = 67% of VDRM) All information provided in this document is subject to legal disclaimers. 5 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 8 / 14 MCR08BT1 WeEn Semiconductors SCR 001aac110 3 001aab503 3 IGT IGT(25°C) IL IL(25°C) 2 2 1 1 0 -50 0 50 100 Tj (°C) 0 -50 150 Fig. 9. Normalized gate trigger current as a function of junction temperature 50 100 Tj (°C) 150 RGK = 1 kΩ Fig. 10. Normalized latching current as a function of junction temperature 001aab504 3 0 001aac113 5 IT (A) IH 4 IH(25°C) 2 3 2 1 1 0 -50 0 50 100 Tj (°C) (1) 0 0.4 150 RGK = 1 kΩ (2) (3) 1.2 2 VT (V) 2.8 Vo = 1.0 V; Rs = 0.27 Ω (1) Tj = 125 °C; typical values (2) Tj = 125 °C; maximum values (3) Tj = 25 °C; maximum values Fig. 11. Normalized holding current as a function of junction temperature Fig. 12. On-state current as a function of on-state voltage MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. 5 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 9 / 14 MCR08BT1 WeEn Semiconductors SCR 001aac109 1.6 001aac115 104 VGT VGT(25°C) dVD/dt (V/µs) 1.2 103 0.8 102 (1) (2) 0.4 -50 0 50 100 Tj (°C) 10 150 Fig. 13. Normalized gate trigger voltage as a function of junction temperature MCR08BT1 Product data sheet 0 50 100 Tj (°C) 150 (1) RGK = 1 kΩ (2) Gate open circuit Fig. 14. Critical rate of rise of off-state voltage as a function of junction temperature; typical values All information provided in this document is subject to legal disclaimers. 5 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 10 / 14 MCR08BT1 WeEn Semiconductors SCR 10. Package outline Plastic surface-mounted package with increased heatsink; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 e1 3 Lp bp w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 4.6 2.3 7.3 6.7 1.1 0.7 0.95 0.85 0.2 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT223 JEITA EUROPEAN PROJECTION ISSUE DATE 04-11-10 06-03-16 SC-73 Fig. 15. Package outline SC-73 (SOT223) MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. 5 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 11 / 14 MCR08BT1 WeEn Semiconductors SCR Right to make changes — WeEn Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 11. Legal information Data sheet status Document status [1][2] Product status [3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] [2] [3] Definition Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 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Notwithstanding any damages that customer might incur for any reason whatsoever, WeEn Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of WeEn Semiconductors. Product data sheet Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. WeEn Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.ween-semi.com. MCR08BT1 Suitability for use — WeEn Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an WeEn Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. WeEn Semiconductors and its suppliers accept no liability for inclusion and/or use of WeEn Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Customers are responsible for the design and operation of their applications and products using WeEn Semiconductors products, and WeEn Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the WeEn Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. WeEn Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using WeEn Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). WeEn does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. 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In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without WeEn Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond WeEn Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies WeEn Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond WeEn Semiconductors’ standard warranty and WeEn Semiconductors’ product specifications. All information provided in this document is subject to legal disclaimers. 5 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 12 / 14 MCR08BT1 WeEn Semiconductors SCR Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. 5 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 13 / 14 MCR08BT1 WeEn Semiconductors SCR 12. Contents 1. General description......................................................1 2. Features and benefits.................................................. 1 3. Applications.................................................................. 1 4. Quick reference data....................................................1 5. Pinning information......................................................2 6. Ordering information....................................................2 7. Limiting values............................................................. 3 8. Thermal characteristics............................................... 6 9. Characteristics..............................................................8 10. Package outline........................................................ 11 11. Legal information..................................................... 12 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved For more information, please visit: http://www.ween-semi.com For sales office addresses, please send an email to: salesaddresses@ween-semi.com Date of release: 5 September 2018 MCR08BT1 Product data sheet All information provided in this document is subject to legal disclaimers. 5 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 14 / 14