0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm
High-Speed Board-to-Board Connections
FX11 Series
Stacking height : 2.5mm, 3mm
■Features
10 Signal : 1 Ground Arrangement
1. Low Profile Design
The board-to-board mating height of 2mm, 2.5mm and 3mm suits
smaller, thinner case designs. (Fig.2)
2. Improved Transmission Efficiency Between Boards
Transmission characteristics have been improved through a design
that fixes ground plates to both sides of the header and receptacle.
Ground Plate
Signal contact
m
5m
0.7
Housing
3. 10 Signal:1 Ground Arrangement
mm
0.5
Metal fitting
Signal and ground are arranged in a ratio of 10 : 1 with the ground plate connected to
the board Via SMT. The ground stability achieved serves to reduce noise. (Fig.1)
m
5m
0.7
Fig.1
Ground plate and metal fitting make contact
4. Metal Fittings for Added Strength
Stacking Height Variation
Metal fittings provide for greater adhesion to the board, which
protects the connector against sheaning forces. The unique
connector design provides a connection between the fitting and the
ground plate for a stronger ground.
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bb
'bb
5. Suited to High-Density Applications
The signal contact pitch of 0.5mm affords a compact connector,
and reduces mounting space on the board.
Note: 2.0mm type product cannot be used or interchanged
with the 2.5mm or 3.0mm type product.
Fig.2
6. Structure Prevents Solder Wicking
Structure Prevent Solder Wicking
A solder gap has been designed into the contact SMT portion to
prevent solder wicking. (Fig.3)
7. High Contact Reliability
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Effective wipe length is 0.55mm (2mm height) and 1mm(2.5mm,
3mm height) for signal contacts.
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AVcY
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8. Optional Ground Plate
Fig.3
An alternate style is also available without the ground plate. The
space provided by the absence of the ground plate is filled with
additional signal contacts.
■Signal Integrity Features
120
ICR 3mm(Without GND)
60
115
50
110
30
●Differential Impedance
The differential impedance is
100 + /- 10ø for FX11 at 50 ps
rise time(20% to 80%).
Impedance 3mm(Without GND)
105
40
Z(ø)
●Insertion-Loss-to-Crosstalk Ratio (ICR)
The insertion-loss-to-crosstalk
ratio (ICR) with five differential
FEXT aggressors meets the
extrapolated IEEE802.3ap
specification to 10+ Gbps.
ICR(dB)
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Stacking height : 2mm
100
95
20
90
10
0
85
ICR
IEEEspec
0
1
2
3
4
5
6
7
8
9
10
80
0.8
Frequency(GHz)
In cases where the application will demand a high level of reliability, such as automotive,
please contact a company representative for further information.
FX11- 3mm DifferentialTDR
0.9
1
1.1
1.2
Time(ns)
2017.11e
1.3
1.4
1.5
1
FX11 Series●0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm High-Speed Board-to-Board Connections
BStacking height variation
● With ground plate
Header
Receptacle
FX11L#-*P / *-SV
FX11L#-*S / *-SV
2mm
Header
Receptacle
FX11#-*P / *-SV
FX11#-*P / *-SV0.5
2.5mm
3mm
FX11#-*S / *-SV
● Without ground plate
Header
Receptacle
FX11L#-*P-SV
FX11L#-*S-SV
2mm
Header
Receptacle
FX11#-*P-SV
FX11#-*P-SV0.5
2.5mm
3mm
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
FX11#-*S-SV
Note 1: The thickness of the solder paste is not included in the stacking height.
Note 2: 2mm type and 2.5mm, 3mm type, with ground plate type and without ground type are not mated with each other.
BCross section of mating
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%#** :[[ZXi^kZl^eZaZc\i]
● Stacking height : 2mm
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