19-160

CHEMICALS ROOM TEMPERATURE VULCANIZING One-component elastomer cures to a tough, rubbery solid when exposed to moisture in the air. Designed to fulfill industrial and electronic service sealing and bonding requirements, this sealant has excellent adhesive strength, high elongation and outstanding insulation and heat resistance qualities. Develops primerless adhesion to a variety of materials, including metal, glass, most wood, silicone resin, vulcanized silicone rubber, ceramic, natural and synthetic fibers; most plastics and painted surfaces. Resists weathering, vibration and exposure to oil, moisture, ozone, and temperatures from sub-zero to 400°F. Cures to a tack-free surface in 10 minutes. Full cure, 24 hours. Ideal for many sealing, bonding and insulating applications, including general electrical insulation, potting exposed electronic components, bonding gaskets for heating and refrigeration units, formed-in-place gaskets for gear boxes, compressors, pumps and outdoor motor covers, pressure sealing of aircraft cabins and cockpits, caulking sheet metal stacks, ductwork and equipment housings, and as an anti-abrasion coating. As Cured—Electrical ASTM D 257 Volume Resistivity, ohm-cm – 6 X 1014 ASTM D 149 Dielectric Strength, volts/mil – 635 ASTM D 150 Dielectric Constant, at 60 Hz – 2.8 at 100 Hz – 2.8 at 100 kHz –2.8 ASTM D 150 Dissipation Factor, at 60 Hz – 0.0015 at 100 Hz – 0.0015 at 100 kHz – 0.0015 Part No. 19-159 3 fl. oz. Tube w/Dispensing Nozzle, Clear Part No. 19-158 GC Industrial RTV Silicone is a one-part high modulus Sealant/Adhesive and Gasketing material. Remains flexible from -70°F to +400°F (-57°C to +204°C). Will not crack, crumble or dry out. Unaffected by ultra-violet, weather, most chemicals and solvents. Adheres to metal, wood, glass. fiberglass, ceramics, fabrics and many plastics. Meets the following specifications: Agriculture Canada; USDA; FDA regulation No. 21 CFR 175.105; Mil Spec Mil-A46106A-Type1 and US Fed. Specs. TT-S-001543A Class B and TT-S-00230C Type 2, Class B. Part No. EL-615 10.2 fl. oz. Caulk Tube, Clear Description Silicone Rubber Sealant meets the following requirements: Part No. 19-155 Silicone Caulk Tube Silicone Quick Reference Guide FDA: FDA regulation No. 21 CFR 175.105 when fully cured and washed. UL: Recognized for service to 302°F (150°C) where elongation is not necessary. Meets Mil. Spec. Mil-A-46106A Type 1, Meets Fed. Spec. TT-S-001543A, Class B, TT-S-0230C, Type 2, Class B Part No. 10-150 Chem Silicone Rubber Adhesive/Sealant Non Corrosive High Temperature Extreme High Temp Low Temperature Extreme low temp Thermal Conductivity High Strength Super High Strength High Voltage Paste Flowable One Part Primerless Translucent R ed White Adhesive Sealant Potting Encapsulating Elect. Insulation Form In Place Gasket Food Grade Marine Mil Spec 10-150 19-155 19-157 19-158 19-159 EL-615 X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X Electronic Grade Silicone Sealant/Adhesive One part non-corrosive, neutral cure electronic grade silicone sealant. Will remain flexible from -70º F to +400º F. (-57º C to +204º C) An excellent adhesive for many electrical and electronic applications where corrosion to metals is a problem. Good dielectric properties, high surface resistivity and resists electrical tracking. Meets the requirements of Mil-A-46146AType 1; meets the requirements of FDA status, FDA regulation #177.2600 Part No. 19-155 3 fl. oz. Color: Clear Part No. 19-158 10.2 fl. oz. Caulk Tube, Color: White Part No. 19-159 2.8 fl. oz. Cartridge Color: White Product Data Sheets on Following pages For the latest information–www.gcelectronics.com All quantities are single; BU’s are packages of 10 Unless otherwise noted. 53 CHEMICALS EPOXY CEMENTS (Cont.) Thermally Conductive Potting Epoxy and Adhesive Electronic Grade Self Leveling Silicone is a one-component, RTV (room temperature vulcanizing) product that uses new cross-linking mechanism as a cure method. No acetic or other corrosive by-products are generated during the curing process. It can be used in corrosion sensitive electrical or electronic equipment with no adverse effect and cures at room temperature. This potting Epoxy and adhesive is a highly filled medium viscosity black casting resin formulated for application requiring a high degree of thermal conductivity. Mix ratio 1:1. It contains abrasive aluminum oxide filler which can introduce wear considerations. Cure is normally achieved at room temperature, although an elevated cure schedule can be used to reach final properties quickly. Temperature Range (after cure): Dielectric Strength: Thermal Expansion Coefficient: Volume Resistivity: Part No. 19-160 Part A -57 ºC to +204 ºC (-70˚F to + 400˚F) 452 V/mil (173 KV/cm) 9 x 10 4 1/K 0˚C to 100˚C (32˚F to 212˚F) >2.19 x 10 15 Ohm/cm 10.2 fl. oz. Caulk Tube, Clear Product Data Sheets on Following pages Temperature Range: Part B Dielectric Strength: Thermal Conductivity: Thermal Expansion Coefficient: Volume Resistivity: Part No. 19-161 Chem GC Electronic Grade Self Leveling Potting Silicone Sealant -40˚C to 150˚C (40˚F to 300˚F) 430 V/mil 7.34 (Btu * in/ft 2 hr ˚F) 44 (x 10 6 ˚C) 2.14 x 10 12 Ohm/cm two - 4 oz. Containers CYANOACRYLATE ADHESIVES & DEBONDERS “Instant bonding” cyanoacrylate adhesives cure in seconds, do not depend on evaporation of solvents and require no clamping. They are colorless and moisture resistant. They are ideal for bonding metals, plastics, rubber, glass and ceramics to each other or to dissimilar materials. Bonding strength up to several thousand psi is possible making them among the strongest adhesives available. These adhesives are economical, as only a drop is required. The best type should be determined by experimentation. Use them to repair broken plastic cabinets and other plastic items, attaching nameplates and rubber feet to panels and chassis, cementing broken ceramic glass and rubber items, repairing jewelry, etc. Porous surfaces may be bonded with Gelweld No. 19-0117. The average setting time is between 10 and 100 seconds, after which the cemented articles can be handled. These adhesives may even be used to bond surfaces which are normally difficult to cement, such as teflon, polyethylene, vinyl, silicone rubber and glass. GR-R-RIP World famous Ethyl Cyanoacrylate rapid bonding adhesive in gravity fed bottle. Bond strength not affected by temperatures from -60°C to 85°C (-76°F to 185°F). Part No. 19-115 0.106 fl. oz. Bottle GC Super Glue Regular Formula Ethyl Cyanoacrylate Adhesive Medium viscosity formula for efficient wicking action, faster curing time. Excellent for bonding any combination of plastic, rubber or metal parts. This grade is ideal for small or fine work on non-porous, smooth surfaces. It fills gaps of .003.005”. Highly resistant to acid, alkali, alkali water, solvents and fungus. Non-toxic. Meets Mil. spec. MIL-A-46050B Type 1 Class 2. Part No. 10-120 For the latest information–www.gcelectronics.com All quantities are single; BU’s are packages of 10 Unless otherwise noted. 0.075 fl. oz. Tube 51 ELECTRONICS PRODUCT SPECIFICATIONS SHEET CAT NO. PRODUCT NAME 19-158 19-159 GC Electronic Grade Silicone Sealant Adhesive – White DESCRIPTION: GC Electronic Grade Silicone Sealant/Adhesive is a one-part, moisture-curing RTV (room temperature vulcanizing) silicone sealant/adhesive that is non-slump and cures to form a tough, permanently flexible rubber. The non-corrosive curing system of these products makes it ideally suited for protecting, sealing and insulating corrosion-sensitive electronic and electrical materials such as copper, brass, silver, etc. It has been specifically formulated for use in electrical/electronic production and assembly because it • has good dielectric properties • has high surface resistivity • resists electrical tracking • repels water to protect electrical properties These products are a neutral-cure silicone that emits no objectionable odors during cure and is ideally suited for use in confined areas. However, adequate ventilation should be provided when they are used in large-scale production. These products are 100% silicone and have excellent resistance to: • ozone • UV • airborne chemicals • temperature changes from -57°C to +204°C (-70°F to +400°F) TYPICAL USES: 19-158 and 19-159 are excellent sealants/adhesives for many electrical and electronic applications where corrosion to metals, particularly copper, brass, silver, etc., is a problem. Such applications include: • lead-wire entries • conduit terminal boxes • component mounting • electrical connections • conduit ends • splices • cover plates • coaxial cable connectors • printed circuit boards • conductor entry holes SURFACE PREPARATION; All surfaces should be clean and dry. It is recommended that bonding surfaces be solvent wiped with oilfree solvents such as xylol, toluol naphtha or non-flammable chlorinated solvents. Do not wipe with oilbased solvents such as Varsol. Allow surface to dry thoroughly before applying sealants. DIRECTIONS: 19-158 and 19-159 are ready to use and require no mixing or additives. The cure mechanism begins as soon as the sealant comes in contact with the air. At conditions of 25°C (77°F) and 50% relative humidity, the sealant will skin in 15 minutes and fully cure within 48 hours (1/8” bead). Higher humidity accelerates cure. Tooling should be done before skinning takes place. In applications where partial total confinement of sealant is prevalent, the time required for proper cure is lengthened by the degree of confinement. PRIMING: Priming of these products is normally not required for application to most substrates. Unprimed adhesion can be readily tested by applying a small trial bead and allowing 7 days for maximum adhesion to occur. COLORS: These products are available in white. MILITARY SPECIFICATIONS: 19-158 and 19-159 meet the requirements of MIL-A-46146A Type 1. FDA STATUS: 19-158 and 19-159 are permitted under regulations of the Food and Drug Administration where incidental food contact might be involved. FDA Regulation number is 177.2600. TYPICAL PROPERTIES: CHARACTERISTIC Shore A Hardness Tensile @ Break Elongation @ Break Modulus @ 100% Elongation Tear Strength Adhesion Strength (Peel) Glass Aluminum (Primed) Mortar (Primed) Sag, or Slump Shrinkage (Weight Loss) Extrusion Rate TEST METHOD RESULTS ASTM D2240 ASTM D412 ASTM D412 ASTM D412 ASTM 624 (Die B) TT-S-001543, 3.5.9 30 ± 2 250 ± 25 psi 400 ± 25% 90 ± 10 psi 30 ± 10 ppi TT-S-001543, 3.5.2 TT-S-001543, 3.5.5 1/8” orifice @ 50 psi 10 ± 2 ppi 8 ± 2 ppi 12 ± 2 ppi Nil 2.19 x 1015 ohm/cm 0.00106 at 10 kHz 0.00022 at 100 Hz 71 at 100 Hz 2.71 at 10 kHz SAFETY PRECAUTIONS: 19-160 is a neutral cure system, no acetic acid is released during cure. STORAGE: 19-160 should be stored in original unopened container at or below 32°C (90°F). SHELF LIFE, CLOSED CONTAINERS 12 months ELECTRONICS PRODUCT SPECIFICATIONS SHEET CAT NO. PRODUCT NAME 19-161 GC Thermal Conductive Potting Epoxy and Adhesive 8 oz. Kit (2 – 4 oz. Containers) Discontinued DESCRIPTION: GC Thermal Conductive Potting Epoxy and Adhesive is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility and a low CTE. It was especially formulated to a 1:1 mix ratio for use in MMD equipment. It contains abrasive aluminum oxide filler which can introduce wear considerations for wetted components. Cure is normally achieved at room temperature although an elevated cure schedule can be used to reach final properties quickly. This product was designed to be cured in less than 2 hours at 65C for ease of processing and also to reduce viscosity. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. Times and temperatures from 3 hours at 65C to 30 minutes at 100C are typical for small castings (less than 50 grams). TYPICAL PROPERTIES: Color Viscosity Specific Gravity Black Part A 44,000 cPs (Low Shear) 35,000 cPs (High Shear) Part B 34,000 cPs (Low Shear) 25,500 cPs (High Shear) Mixed 39,000 cPs (Low Shear) 30,000 cPs (High Shear) Part A Part B Mixed 1.92 1.98 1.95 Pot Life 120 minutes Mass 200 grams CURED PHYSICAL PROPERTIES: Hardness 75 Shore-D Lap Shear 1500 psi 2014 REV. A 19-161 Page 1 of 3 Tensile Strength (Yield) 450 psi Elongation @ Break 15% Compressive PSI Yield Strength 1,500 Ultimate Strength 7,500 Modulus 24,000 Coefficient of Thermal Expansion 45*ppm/C (below Tg) Thermal Conductivity (Btu*in/ft2 hrF) 7.2 Temperature Range ** -40 to 150C Onset Temperature 55C Exothermic Energy 63.3 J/g Glass Transition Temperature 26C Discontinued ELECTRICAL PROPERTIES: Dielectric Constant (25C, 100 Hz) 5.0* Dielectric Strength 400 v/mil* Volume Resistivity 7.6 x 1013 Ohm-Cm* MIX RATIO: (Part A to B) By Weight By Volume 1 to 1 1 to 1 CURE SCHEDULE: 24 – 72 hours at 25C Or 3 hours @ 65C 30 minutes @ 100C SHELF LIFE, CLOSED CONTAINERS: 12 months INSTRUCTIONS: 1) Bring both components to room temperature and stir individually before use. Mix equal parts A and B thoroughly. 2) Weigh and mix parts A and B accurately and thoroughly, scraping sides of container often. Do not pour from mixing container; transfer to a new container as residual unmixed material may cause a tacky spot on the surface of casting. 2014 REV. A 19-161 Page 2 of 3 Discontinued 3) Allow product to cure undisturbed until it is fully gelled or tack-free to the touch. 4) Clean up uncured resin with a suitable organic solvent such as MEK, acetone or other organic solvent. *Asterisk denotes values considered typical to associated resin systems or extrapolated from other test results. **General use guideline, based on weight loss at elevated temperature. Notes: Values presented above are considered to be typical properties, not to be used for specification purposes. Many epoxy resin systems are prone to crystallization as epoxy resin is a super-cooled fluid. This condition may give the product a gritty or grainy appearance (or hazy in clear products). Products in this state will not usually cure to normal and expected properties. In extreme cases it may appear solid and cured. Fluctuating temperatures (within 5-50C) may aggravate this phenomena. Heating the individual component to 50 to 60C while stirring can usually restore the product to original state. Storage at 25+/10C is optimum for most products. GC Electronics makes no express or implied warranties or merchantability, fitness or otherwise with respect to its products. In addition, while the information contained herein is believed to be reliable, no warranty is expressed or implied regarding the accuracy of the data or the results to be obtained from the use thereof. All recommendations or suggestions for use are made without guarantee inasmuch as conditions of use are beyond our control. The properties given are typical values and are not intended for use in preparing specifications. Users should make their own test to determine the suitability of this product for their own purposes. 2014 REV. A 19-161 Page 3 of 3