RS10N65D
N Channel MOSFET
ID
RDS(ON)(Typ )
VDSS
10A
0.93Ω
650V
Applications:
• Switch Mode Power Supply(SMPS)
• Adapter & Charger
• AC-DC Switching Power Supply
Features:
• Fast switching speed
• 100% avalanche tested
• Improved dv/dt capability
Ordering Information
Part Number
Package
Marking
Packing
Qty.
RS10N65D
T0-252
RS10N65D
Tape&reel
2500 PCS
Absolute Maximun Ratings Tc= 2 5℃ unless otherwise specified
Symbol
Parameter
RS10N65D
Units
V
VDSS
Drain-to-Source Voltage
650
ID
Continuous Drain Current TC=25℃
10
IDM
Pulsed Drain Current (Note*1)
28
PD
Power Dissipation
179
W
VGS
Gate- to- Source Voltage
±30
V
EAS
Single Pulse Avalanche Engergy
L = 10mH, VDD = 50V, RG = 25 Ω
217
mJ
A
Maximum Temperature for Soldering
300
260
Leads at 0.063in(1.6mm)from Case for 10 seconds
℃
Package Body for 10 seconds
TJ and
Operating Junction and Storage
-55 to 150
TSTG
Temperature Range
* Drain Current Limited by Maximum Junction Temperature
Caution: Stresses greater than those listed in the“ Absolute Maximum Ratings” Table may cause
permanent damage to the device.
TL TPKG
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RS10N65D
N Channel MOSFET
Thermal Resistance
Symbol
RθJC
Parameter
RS10N65D
Junction-to-Case
Units
Test Conditions
Drain lead soldered to water cooled
heatsink, PD adjusted for a peak
junction temperature of + 1 5 0 ℃
0.7
℃/ W
RθJA
Junction-toAmbient
62.5
1 cubic foot chamber,free air.
OFF Characteristics TJ= 25℃ unless otherwise specified
Symbol
Parameter
Min.
Typ.
Max.
Units
Test Conditions
650
--
--
V
VGS=0V,ID=250µA
µA
VDS=650V,VGS=0
V
BVDSS
Drain- to- source Breakdown
Voltage
IDSS
Drain- to- Source Leakage Current
--
--
1
Gate- to- Source Forward Leakage
--
--
100
Gate- to- Source Reverse Leakage
--
--
-100
Min.
Typ.
Max.
Units
IGSS
nA
VGS=30V ,VDS=0V
VGS=-30V ,VDS=0
V
ON Characteristics TJ=25℃ unless otherwise specified
Symbol
Parameter
Test Conditions
RDS(on)
Static Drain- to- Source OnResistance(Note*2)
--
0.93
1.05
Ω
VGS=10V,ID=5A
VGS(TH)
Gate Threshold Voltage
3
--
4
V
VGS=VDS,ID=250µ
A
Resistive Switching Characteristics Essentially independent of operating temperature
Symbol
Parameter
Min.
Typ.
Max.
td(ON)
Turn- on Delay Time
--
43
--
trise
Rise Time
--
16.5
--
td(OFF)
Turn- OFF Delay Time
--
125
--
tfall
Fall Time
--
37
--
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Units
nS
Test Conditions
VDS=325V
ID=10A
RG=25Ω
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RS10N65D
N Channel MOSFET
Dynamic Characteristics Essentially independent of operating temperature
Symbol
Parameter
Min.
Typ.
Max.
Units
Test Conditions
Ciss
Input Capacitance
--
1246
--
Coss
Output Capacitance
--
104
--
pF
VGS=0V
VDS=25V
f=1.0MHz
Crss
Reverse Transfer Capacitance
--
0.5
--
Qg
Total Gate Charge
--
22
-nC
VDS=520V
ID=10A
VGS=10V
Qgs
Gate- to- Source Charge
--
6
--
Qgd
Gate-to-Drain(" Miller") Charge
--
8
--
Min.
Typ.
Max.
Units
Test Conditions
Source- Drain Diode Characteristics
Symbol
Parameter
IS
Continuous Source Current
--
--
10
A
ISM
Maximum Pulsed Current
--
--
40
A
Integral pn- diode
in MOSFET
VSD
Diode Forward Voltage
--
--
1.4
V
IS=5A,VGS=0V
trr
Reverse Recovery Time
--
360
--
nS
Qrr
Reverse Recovery Charge
--
3.9
--
µC
VGS=0V
IS=10A,di/dt=100A
/µs
Notes:
* 1. Repetitive rating, pulse width limited by maximum junction temperature.
* 2. Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 1%
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RS10N65D
N Channel MOSFET
Typical Feature Curve
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RS10N65D
N Channel MOSFET
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RS10N65D
N Channel MOSFET
Test Circuits and Waveforms
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RS10N65D
N Channel MOSFET
Test Circuits and Waveforms
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RS10N65D
N Channel MOSFET
Package outline drawing(TO-252 Unit: mm )
尺寸
尺寸
符号
W
尺寸
符号
Min
Max
6.50
6.70
W1
(4.572)
符号
Min
Max
Min
Max
L1
0.80
1.20
T1
0.48
0.58
L2
0.60
1.00
T2
0.95
1.15
W2
0.6
0.8
L3
9.70
10.30
T3
0.48
0.58
W3
0.68
0.88
L4
1.30
1.70
T4
0.00
0.12
0
0
8
W4
L
(5.3)
6.00
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L5
6.20
T
(5.20)
2.20
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2.40
Copyright Reasunos
RS10N65D
N Channel MOSFET
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As used herein:
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be reasonably expected to result in significant injury to the user.
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