RS60N50D
N Channel MOSFET
ID
RDS(ON)(Typ )
VDSS
50A
14mΩ
60V
Applications:
• Load Switch
• PWM Applications
• Power Managment
Features:
• Fast switching speed
• 100% avalanche tested
• Improved dv/dt capability
Ordering Information
Part Number
Package
Marking
Packing
Qty.
RS60N50D
T0-252
RS60N50D
Tape&reel
2500 PCS
Absolute Maximun Ratings Tc= 2 5℃ unless otherwise specified
Symbol
Parameter
RS60N50D
Units
V
VDSS
Drain-to-Source Voltage
60
ID
Continuous Drain Current TC=25℃
50
ID
Continuous Drain Current TC=100℃
35
IDM
Pulsed Drain Current
200
PD
Power Dissipation
89
W
VGS
Gate- to- Source Voltage
±20
V
85
mJ
EAS
Single Pulse Avalanche Engergy
L = 0.5mH,VDD = 30V, VG = 10V, Tj = 25℃
Maximum Temperature for Soldering
TL TPKG
Leads at 0.063in(1.6mm)from Case for 10 seconds
Package Body for 10 seconds
TJ and
Operating Junction and Storage
TSTG
Temperature Range
A
300
260
℃
-55 to 150
* Drain Current Limited by Maximum Junction Temperature
Caution: Stresses greater than those listed in the“ Absolute Maximum Ratings” Table may cause permanent damage to the device.
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RS60N50D
N Channel MOSFET
Thermal Resistance
Symbol
Parameter
RS60N50D
Units
Test Conditions
Drain lead soldered to water cooled
RθJC
Junction-to-Case
1.8
heatsink, PD adjusted for a peak
junction temperature of + 1 5 0 ℃
℃/ W
RθJA
Junction-toAmbient
60
1 cubic foot chamber,free air.
OFF Characteristics TJ= 25℃ unless otherwise specified
Symbol
BVDSS
IDSS
IGSS
Parameter
Min.
Typ.
Max.
Units
Test Conditions
60
--
--
V
VGS=0V,ID=250µA
Drain- to- Source Leakage Current
--
--
1
µA
VDS=60V,VGS=0V
Gate- to- Source Forward Leakage
--
--
100
Gate- to- Source Reverse Leakage
--
--
-100
Min.
Typ.
Max.
Units
--
14
20
mΩ
VGS=10V,ID=30A
--
17
25
mΩ
VGS=4.5V,ID=30A
1.2
1.6
2.5
V
Drain- to- source Breakdown
Voltage
VGS=20V ,VDS=0V
nA
VGS=-20V ,VDS=0
V
ON Characteristics TJ=25℃ unless otherwise specified
Symbol
RDS(on)
VGS(TH)
Parameter
Static Drain- to- Source OnResistance
Gate Threshold Voltage
Test Conditions
VGS=VDS,ID=250µ
A
Resistive Switching Characteristics Essentially independent of operating temperature
Symbol
Parameter
Min.
Typ.
Max.
td(ON)
Turn- on Delay Time
--
7.4
--
trise
Rise Time
--
5.1
--
td(OFF)
Turn- OFF Delay Time
--
28.2
--
tfall
Fall Time
--
5.5
--
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Units
nS
Test Conditions
VDS=30V RL=6.7Ω
RG=3Ω VGS=10V
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RS60N50D
N Channel MOSFET
Dynamic Characteristics Essentially independent of operating temperature
Symbol
Parameter
Min.
Typ.
Max.
Units
Ciss
Input Capacitance
--
2050
--
Coss
Output Capacitance
--
158
--
Crss
Reverse Transfer Capacitance
--
120
--
Qg
Total Gate Charge
--
50
--
Qgs
Gate- to- Source Charge
--
6
--
Qgd
Gate-to-Drain(" Miller") Charge
--
15
--
Min.
Typ.
Max.
Units
Test Conditions
VGS= 0V
pF
VDS=30V
f=1.0MHz
VDS= 30V
nC
ID=20A
VGS=10V
Source- Drain Diode Characteristics
Symbol
Parameter
Test Conditions
IS
Continuous Source Current
--
--
50
A
ISM
Maximum Pulsed Current
--
--
200
A
VSD
Diode Forward Voltage
--
--
1.2
V
IS=20A,VGS=0V
trr
Reverse Recovery Time
--
28
--
nS
VGS=0V
Qrr
Reverse Recovery Charge
--
40
--
nC
di/dt=100A/µs
Integral pn- diode
in MOSFET
IS=20A
Notes:
* 1. Repetitive rating,pulse width limited by maximum junction temperature.
* 2. Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 1%
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RS60N50D
N Channel MOSFET
Typical Feature Curve
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RS60N50D
N Channel MOSFET
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RS60N50D
N Channel MOSFET
Test ircuits and Waveforms
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RS60N50D
N Channel MOSFET
Test ircuits and Waveforms
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RS60N50D
N Channel MOSFET
Package outline drawing(TO-252 Unit: mm )
尺寸
尺寸
符号
W
尺寸
符号
Min
Max
6.50
6.70
W1
(4.572)
符号
Min
Max
Min
Max
L1
0.80
1.20
T1
0.48
0.58
L2
0.60
1.00
T2
0.95
1.15
W2
0.6
0.8
L3
9.70
10.30
T3
0.48
0.58
W3
0.68
0.88
L4
1.30
1.70
T4
0.00
0.12
0
0
8
W4
L
(5.3)
6.00
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L5
6.20
T
(5.20)
2.20
8 /9
2.40
Copyright Reasunos
RS60N50D
N Channel MOSFET
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