CONSMA003.062

REVISIONS REV DESCRIPTION A INITIAL RELEASE OF LINX INTERNAL DRAWING 1/4"36-UNS-2A THREADS 4X Ø0.45 DIMPLE EQUALLY SPACED 0 0.000 APPV 01/MAR/19 CLL 1.30 0.051 7.93 0.312 3.57 0.140 4.62 0.182 6.35 0.250 DATE 1.70 0.067 3.90 0.154 4.00 0.157 11.51 0.453 6.10 0.240 NOTES: (UNLESS OTHERWISE SPECIFIED) 1. ALL DIMENSIONS ARE IN mm [INCHES]. 2. DIMENSIONS APPLY AFTER FINISHING. 3. MANUFACTURE TO BE COMPLIANT WITH EU RoHS DIRECTIVE, USE MATERIALS THAT DO NOT CONTAIN REACH SUBSTANCES OF VERY HIGH CONCERN >1000ppm, AND USE DRC CONFLICT-FREE SOURCED MATERIALS. 4. SAFETY BREAK ALL SHARP CORNERS AND EDGES 0.5 MAXIMUM. 5 SEE TABLE I FOR ELECTRICAL SPECIFICATIONS. (SHEET 2) 6 SEE TABLE II FOR ENVIRONMENTAL SPECIFICATIONS. (SHEET 2) 7 SEE TABLE III FOR MECHANICAL SPECIFICATIONS. (SHEET 2) 8. SEE PARTSLIST. "*" INDICATES FINISH TYPE. WARNING: THIS DRAWING CONTAINS PROPRIETARY INFORMATION 159 ORT LANE THAT IS THE SOLE PROPERTY OF LINX TECHNOLOGIES, AND SHALL BE MERLIN, OR 97532 TREATED AS SUCH. NO DISCLOSURE OR REPRODUCTION OF THIS DOCUMENT IS PERMITTED, IN WHOLE OR IN PART, WITHOUT THE EXPRESS WRITTEN PERMISSION OF LINX TECHNOLOGIES OR ITS DESIGNATED AGENTS. MATERIAL: SCALE 1 : 1 FINISH: TOLERANCES: 0.50 [.020]-5.00 [.200]= 0.20 [.008] 5.00 [.200]-30.00 [1.200]= 0.40 [.016] 30.0 [1.20]-120.0 [4.75]= 0.60 [0.24] 120.0 [4.75]-315.0 [12.40]= 1.0 [.040] DRAWN: M. SCHULTE PROJECTION: ANGLES: 1 DT: 21/JAN/19 ENGR: D. VARATHARAJAN DT: 08/MAR/19 TITLE: SMA FEMALE EDGE MOUNT FOR 0.062" THICK BOARD SIZE DWG. NO. A REV CONSMA003.062-* SCALE: 4:1 DO NOT SCALE DRAWING A SHEET 1 OF 2 LDCFDAL_C 5 SEE SHEET 1 FOR REVISIONS TABLE I 6.50 0.256 6 TABLE II RECOMMENDED MOUNTING HOLE 1.52 0.060 7 1.57 0.062 0.062" PCB TABLE III 4.06 0.160 5.08 0.200 2.54 0.100 BOTTOM RECOMMENDED FOOTPRINT 2.54 0.100 TOP SIZE DWG. NO. A REV CONSMA003.062-* SCALE: 4:1 DO NOT SCALE DRAWING A SHEET 2 OF 2 LDCFDAL_A Solder Reflow Practices - Connectors Application Note AN-00504 Reflow Soldering Reflow soldering is the most common method of attaching surface mount electronic components to a circuit board. The goal of the reflow process is to melt the solder and heat the conductive surfaces, without overheating or damaging any electrical components. In the conventional reflow soldering process, there are four distinct stages, or zones, having specific thermal profiles: preheat, thermal soak, reflow, and cooling. For high-volume assembly, surface mount components are generally auto-placed by machine. Reflow Temperature Profile The single most critical stage in the automated assembly process is the reflow stage. The reflow profile for any given component should be closely followed because excessive temperatures or transport times during reflow can irreparably damage the component. Assembly personnel need to pay careful attention to the oven’s profile to ensure that it meets the requirements necessary to successfully reflow all components while still remaining within the limits mandated by components requiring shorter flow periods. 300 Recommended RoHS Profile Max RoHS Profile Recommended Non-RoHS Profile 255°C 250 235°C 217°C Temperature (°C) 200 185°C 180°C 150 125°C 100 50 0 30 60 90 120 150 180 210 240 270 300 330 Time (Seconds) Copyright © 2018 Linx Technologies 159 Ort Lane, Merlin, OR 97532 Phone: +1 541 471 6256 Fax: +1 541 471 6251 www.linxtechnologies.com –1– AN-00504 Reflow Soldering Revised 7/16/2018 360