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DF06S

DF06S

  • 厂商:

    MSKSEMI(美森科)

  • 封装:

    DBS_8.5X6.5MM_SM

  • 描述:

    整流桥 10μA 600V DBS_8.5X6.5MM_SM

  • 数据手册
  • 价格&库存
DF06S 数据手册
www.msksemi.com DF005S-DF10S Semiconductor Compiance Features Ideal for printed circuit board Reliable low cost construction utilizing molded plastic technique .205(5.2) .335(8.50) . 195(5.0) High temperature soldering guaranteed: 260°/ 10 seconds at 5 lbs., (2.3kg) tension Small size, simple installation .307(7.8) + High surge current capability . 09 3 ( 2 . 3 5 ) .047( 1.20) .035(0.9) (2 ) .402( 10.2) ( ) - .382(9.70) .255(6 .5 ) Mechanical Data .014(0.35) .245(6 .2 ) .008(0.20) Case : JEDEC DBS Molded plastic body Terminals : Solder plated, solderable per MIL- STD- 75 0 , Method 2026 Polarity : Polarity symbol marking on case Mounting Position : 45 . 118(3.0) .008(0.20) .002(0.05) .060( 1 .53) ( 4 ~) ( 3 ~) .040( 1.02) Dimensions in inches and ( millimeters) Any Weight : 0 .02 ounce, 0 .4 grams REEL SPECIFICATION P/N PKG QTY DF005S-DF10S DBS 1500 Maximum Ratings And Electrical Characteristics Ratings at 2 5 ° C ambient temperature unless otherwisespecified. Single phase half- wave 6 0 Hz, resistive or inductive load, for capacitive load current derate by 2 0 % . Parameter Marking Code Maximum repetitive Maximum RMS Maximum DC peak reverse voltage voltage blocking voltage Maximum average forward rectified current at TC=40°C SYMBOL S DF005S V RRM V RMS V DC DF01S DF02S DF04S 50 100 200 35 50 70 100 140 200 DF10S UNITS DF06S DF08S 400 600 800 1000 V 280 400 420 600 560 800 700 1000 V V IF(AV) 1.0 A IFSM 50 A VF 1.1 V IR 10 500 µA µA TJ T STG -55 to + 150 -55 to + 150 °C °C Peak forward surge current, 8. 3 ms single half sine- wave superimposed on rated load ( JEDEC Method) Maximum instantaneous forward voltage drop per leg at 1 A Maximum DC reverse current at rated DC blocking voltage Operating temperature TA=25°C TA=100°C range storage temperature range NOTES:DBS for surface mount package. www.msksemi.com DF005S-DF10S Semiconductor FIG. FIG . 2 - MAXIMUM 1 - MAXIMUN DERATING CURVE FOR OUTPUT RECTIFIED CURRENT 60 1.0 0.6 ''( 1 .5mm ) REPETITIVE C opper Pa uls .51 '' x 51'' ( 1 3 mmx1 3 mm) PEAK FORWARD TJ= 2 5* Sin g le s i ne w ave ( JED EC Meth od) 50 0.8 0.6 NON- SURGE CURRENT Compiance 40 30 0.4 20 S in gle 0.2 Phase Ha l f Wave 6 0 R e s istive in d u ctive or Hz 10 Load 0 20 40 60 80 100 120 AMBIENT TEMPERATURE, FIG. 140 150 0 1 2 C 4 6 10 20 40 NUMBER OF CYCLES AT 6 0 3 - TYPICAL REVERSE CHARACTERISTICS PER BRIDGE ELEMENT FIG. 10 60 100 Hz 4 - TYPICAL FORWARD CHARACTERISTICS PER BRIDGE ELEMNT 100 TJ= 1 1 2 * 5 10 1 1.0 0.1 0.1 T .10 J=25* T J= 25 * PULSE WIDTH : 300 * S 1 % DUT Y CYCLE 0 .01 .01 0 20 40 60 80 100 120 140 0.01 0 .4 0 .6 0 .8 1 .0 1 .2 1 .4 1 .6 FORWARD VOLTAGE, ( V) PERCENT OF RATED PEAK REVERSE VOLTAGE . ( % ) FIG. 3 - TYPICAL JUNCTION CAPACITANCE PER BRIDGE ELEMENT 100 10 T J = 25 * f= 1 . 0 M Z H Vi sg=5 0 mV p p 1 1 10 100 REVERSE VOLTAGE. ( V) The curve above is for reference only. www.msksemi.com DF005S-DF10S Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from theauthorities concerned in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. www.msksemi.com
DF06S 价格&库存

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DF06S
  •  国内价格
  • 1+0.33570
  • 30+0.32371
  • 100+0.31172
  • 500+0.28774
  • 1000+0.27575
  • 2000+0.26856

库存:0