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DF005S-DF10S
Semiconductor
Compiance
Features
Ideal for printed circuit board
Reliable low cost construction utilizing molded plastic technique
.205(5.2)
.335(8.50)
. 195(5.0)
High temperature soldering guaranteed: 260°/ 10 seconds at 5
lbs., (2.3kg) tension
Small size, simple installation
.307(7.8)
+
High surge current capability
. 09 3 ( 2 . 3 5 )
.047( 1.20)
.035(0.9)
(2 )
.402( 10.2)
(
)
-
.382(9.70)
.255(6 .5 )
Mechanical Data
.014(0.35)
.245(6 .2 )
.008(0.20)
Case : JEDEC DBS Molded plastic body
Terminals : Solder plated, solderable per MIL- STD- 75 0 , Method
2026
Polarity : Polarity symbol marking on case
Mounting Position :
45
. 118(3.0)
.008(0.20)
.002(0.05)
.060( 1 .53)
( 4 ~)
( 3 ~)
.040( 1.02)
Dimensions in inches and ( millimeters)
Any
Weight : 0 .02 ounce, 0 .4 grams
REEL SPECIFICATION
P/N
PKG
QTY
DF005S-DF10S
DBS
1500
Maximum Ratings And Electrical Characteristics
Ratings at 2 5 ° C ambient temperature unless otherwisespecified.
Single phase half- wave 6 0 Hz, resistive or inductive load, for capacitive load current derate by 2 0 % .
Parameter
Marking Code
Maximum
repetitive
Maximum
RMS
Maximum
DC
peak
reverse voltage
voltage
blocking
voltage
Maximum average forward rectified current
at TC=40°C
SYMBOL S
DF005S
V RRM
V RMS
V DC
DF01S
DF02S
DF04S
50
100
200
35
50
70
100
140
200
DF10S
UNITS
DF06S
DF08S
400
600
800
1000
V
280
400
420
600
560
800
700
1000
V
V
IF(AV)
1.0
A
IFSM
50
A
VF
1.1
V
IR
10
500
µA
µA
TJ
T STG
-55 to + 150
-55 to + 150
°C
°C
Peak forward surge current,
8. 3 ms single half sine- wave superimposed on
rated load ( JEDEC Method)
Maximum instantaneous forward voltage drop
per leg at 1 A
Maximum DC reverse current
at rated DC blocking voltage
Operating
temperature
TA=25°C
TA=100°C
range
storage temperature range
NOTES:DBS for surface mount package.
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DF005S-DF10S
Semiconductor
FIG.
FIG . 2 - MAXIMUM
1 - MAXIMUN DERATING CURVE FOR
OUTPUT RECTIFIED CURRENT
60
1.0
0.6 ''( 1 .5mm )
REPETITIVE
C opper Pa uls .51 '' x 51''
( 1 3 mmx1 3 mm)
PEAK
FORWARD
TJ= 2 5*
Sin g le s i ne w ave
( JED EC Meth od)
50
0.8
0.6
NON-
SURGE CURRENT
Compiance
40
30
0.4
20
S in gle
0.2
Phase
Ha l f Wave
6 0
R e s istive
in d u ctive
or
Hz
10
Load
0
20
40
60
80
100
120
AMBIENT TEMPERATURE,
FIG.
140 150
0
1
2
C
4
6
10
20
40
NUMBER OF CYCLES AT 6 0
3 - TYPICAL REVERSE CHARACTERISTICS
PER BRIDGE ELEMENT
FIG.
10
60
100
Hz
4 - TYPICAL FORWARD CHARACTERISTICS
PER BRIDGE ELEMNT
100
TJ=
1
1 2
*
5
10
1
1.0
0.1
0.1
T
.10
J=25*
T J= 25 *
PULSE WIDTH : 300 * S
1 % DUT Y CYCLE
0 .01
.01
0
20
40
60
80
100
120
140
0.01
0 .4
0 .6
0 .8
1 .0
1 .2
1 .4
1 .6
FORWARD VOLTAGE, ( V)
PERCENT OF RATED PEAK REVERSE VOLTAGE . ( % )
FIG.
3 - TYPICAL JUNCTION CAPACITANCE
PER BRIDGE ELEMENT
100
10
T J = 25 *
f= 1 . 0 M Z
H
Vi sg=5 0 mV p p
1
1
10
100
REVERSE VOLTAGE. ( V)
The curve above is for reference only.
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DF005S-DF10S
Semiconductor
Compiance
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you
before using any MSKSEMI Semiconductor products described or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described
orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.
■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to
accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention
circuitsfor safedesign, redundant design, and structural design.
■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described
or contained herein are controlled under any of applicable local export control laws and regulations, such
products must not be exported without obtaining the export license from theauthorities concerned in
accordance with the above law.
■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,
without the prior written permission of MSKSEMI Semiconductor.
■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not
guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and
reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property
rights or other rightsof third parties.
■ Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the
MSKSEMI Semiconductor productthat you intend to use.
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