FS1-Z38-20Z6-60

7 8 6 #38 F 5 18.20 16.60 2.90 #20 1.14 MIN 5.35 #1 3.50 3 4 1 2 7.25 REVISIONS DESCRIPTION DATE REV. 3.25 A INITIAL RELEASE APPROVED MAR 23/16 J. SI 0.4 5.60 F 1.65 0.4 16.80 C 7.37 0.95 15.53 0.4 D 8.40 E 0.10 C D 9.88 E 12.5 D D 7 7 7.40 7.40 18.20 C 0.35±0.030 0.05 L A B 0.80 2.51 C #38 FS1 - Z38 - X0Z6 - 60 CONTACT PLATING OPTION #1 B 1.80±0.030 0.05 L A B #20 2 = 30 MICRO INCHES MINIMUM OF GOLD ON MATING END WITH 100 MICRO INCHES MINIMUM OF MATTE TIN ON SOLDER TERMINATION, 50 MIN. MICRO INCHES OF NICKEL UNDER PLATE ALL OVER 3 = 15 MICRO INCHES MINIMUM OF GOLD ON MATING END WITH 100 MICRO INCHES MINIMUM OF MATTE TIN ON SOLDER TERMINATION, 50 MIN. MICRO INCHES OF NICKEL UNDER PLATE ALL OVER #19 0.40 NOTES: 7.37 A 16.80 1) MATERIAL: 2X HOUSING: SOLDER REFLOW PROCESS COMPATIBLE LCP, UL94V-0 CONTACTS: PHOSPHOR BRONZE RESONANCE DAMPENING FEATURE: CONDUCTIVE POLYMER 1.55±0.050 2) ROHS COMPLIANT 1 REF. ( B 1 1.55) A B 1.78 REF. APPROVALS UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILIMETERS TOLERANCES ARE: DRAWN 2.66 16.80±0.050 RECOMMENDED PCB LAYOUT FOR FS1-Z38-XXXX-XX KEEPOUT ZONE IN HATCHED AREAS NO TRACES OR INK MARKING ALLOWED DECIMALS DO NOT SCALE DRAWING .X .XX 0.2 0.1 ENG.REL.NO. 6 5 4 3 DATE A. CHEN MAR23/16 A. CHEN MAR23/16 CHECKED J. SI QA APP'D J. PEN MAR23/16 03554 DWG APP'D 2 J. SI Amphenol High Speed Interconnects A Division of Amphenol Corp. www.amphenol‐highspeed.com TITLE UltraPort QSFP 4x28 38 POSITION CONNECTOR MAR23/16 IE APP'D ANDY CHEN MAR23/16 CODE IDENT. NO. 7 2 DESIGNED MATERIAL AND FINISH THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY PURPOSE OR USED FOR MANUFACTURING PURPOSES WITHOUT PERMISSION FROM AMPHENOL CANADA CORP. 8 ANGLES MAR23/16 SIZE C SCALE A P-FS1-Z38-X0Z6-60 PROJECT SHEET 1 OF 1 FS1 DWG. NO. REV. NTS 1 A