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SIT3808AC-D2-33NE-50.000000Y

SIT3808AC-D2-33NE-50.000000Y

  • 厂商:

    SITIME

  • 封装:

    SMD7050_6P

  • 描述:

    有源晶振 50MHz SMD7050_4P

  • 数据手册
  • 价格&库存
SIT3808AC-D2-33NE-50.000000Y 数据手册
SiT3808 1 MHz to 80 MHz High Performance MEMS VCXO The Smart Timing Choice The Smart Timing Choice Features Applications  Any frequency between 1 MHz and 80 MHz with 6 decimal places of accuracy  Telecom clock synchronization, instrumentation  Low bandwidth analog PLL, jitter cleaner, clock recovery, audio  100% pin-to-pin drop-in replacement to quartz-based VCXO  Video, 3G/HD-SDI, FPGA, broadband and networking  Frequency stability as tight as ±10 ppm  Widest pull range options from ±25 ppm to ±1600 ppm  Industrial or extended commercial temperature range  Superior pull range linearity of ≤1%, 10 times better than quartz  LVCMOS/LVTTL compatible output  Four industry-standard packages: 2.5 mm x 2.0 mm (4-pin), 3.2 mm x 2.5mm (4-pin), 5.0 mm x 3.2 mm (6-pin), 7.0 mm x 5.0 mm (6-pin)  Instant samples with Time Machine II and field programmable oscillators  RoHS and REACH compliant, Pb-free, Halogen-free and Antimony-free Electrical Specifications Table 1. Electrical Characteristics[1, 2, 3] Parameter Symbol Min. Typ. Max. Unit Condition Frequency Range Output Frequency Range f 1 – 80 MHz Frequency Stability and Aging Frequency Stability Aging Operating Temperature Range F_stab -10 – +10 ppm -25 – +25 ppm Inclusive of Initial tolerance[4] at 25 °C, and variation over temperature, rated supply voltage and load. -50 – +50 ppm F_aging -5 – +5 ppm T_use -20 – +70 °C Extended Commercial -40 – +85 °C Industrial 10 years, 25°C Supply Voltage and Current Consumption Supply Voltage Current Consumption Standby Current Vdd Idd I_std 1.71 1.8 1.89 V 2.25 2.5 2.75 V 2.52 2.8 3.08 V 2.97 3.3 3.63 V – 31 33 mA – 29 31 mA No load condition, f = 20 MHz, Vdd = 1.8V – – 70 A Vdd = 2.5V, 2.8V, 3.3V, ST = GND, output is Weakly Pulled Down – 10 A Vdd = 1.8V, ST = GND, output is Weakly Pulled Down – Additional supply voltages between 2.5V and 3.3V can be supported. Contact SiTime for additional information. No load condition, f = 20 MHz, Vdd = 2.5V, 2.8V or 3.3V VCXO Characteristics Pull Range[5, 6] Upper Control Voltage PR VC_U ±25, ±50, ±100, ±150, ±200, ±400, ±800, ±1600 ppm 1.7 – – V Vdd = 1.8V, Voltage at which maximum deviation is guaranteed. 2.4 – – V Vdd = 2.5V, Voltage at which maximum deviation is guaranteed. 2.7 – – V Vdd = 2.8V, Voltage at which maximum deviation is guaranteed. 3.2 – – V Vdd = 3.3V, Voltage at which maximum deviation is guaranteed. Voltage at which minimum deviation is guaranteed. Lower Control Voltage VC_L – – 0.1 V Control Voltage Input Impedance Z_in 100 – – kΩ Control Voltage Input Capacitance C_in – 5 – pF Lin – 0.1 1 % – kHz Linearity Frequency Change Polarity Control Voltage Bandwidth (-3dB) SiTime Corporation Rev. 1.01 – V_BW See the Absolute Pull Range and APR table on page 10 Positive slope – 8 – 990 Almanor Avenue, Sunnyvale, CA 94085 Contact SiTime for 16 kHz and other high bandwidth options (408) 328-4400 www.sitime.com Revised January 8, 2015 SiT3808 1 MHz to 80 MHz High Performance MEMS VCXO The Smart Timing Choice The Smart Timing Choice Electrical Specifications (continued) Table 1. Electrical Characteristics[1, 2, 3] Parameter Symbol Min. Typ. Max. Unit Condition LVCMOS Output Characteristics Duty Cycle DC 45 – 55 % All Vdds. Refer to Note 11 for definition of Duty Cycle Rise/Fall Time Tr, Tf – 1.5 2 ns Vdd = 1.8V, 2.5v, 2.8V or 3.3V, 10% - 90% Vdd level Output High Voltage VOH 90% – – Vdd IOH = -7 mA (Vdd = 3.0V or 3.3V) IOH = -4 mA (Vdd = 2.8V or 2.5V) IOH = -2 mA (Vdd = 1.8V) Output Low Voltage VOL – – 10% Vdd IOL = 7 mA (Vdd = 3.0V or 3.3V) IOL = 4 mA (Vdd = 2.8V or 2.5V) IOL = 2 mA (Vdd = 1.8V) Input Pull-up Impedance Z_in – 100 250 kΩ For the OE/ST pin for 6-pin devices Input Capacitance C_in – 5 – pF For the OE/ST pin for 6-pin devices T_start – – 10 ms See Figure 7 for startup resume timing diagram T_oe – – 180 ns f = 40 MHz, all Vdds. For other freq, T_oe = 100 ns + 3 clock periods T_resume – 7 10 ms See Figure 8 for resume timing diagram f = 20 MHz, Vdd = 2.5V, 2.8V or 3.3V Input Characteristics Startup and Resume Timing Startup Time OE Enable/Disable Time Resume Time Jitter RMS Period Jitter RMS Phase Jitter (random) T_jitt T_phj – 1.5 2 ps – 2 3 ps f = 20 MHz, Vdd = 1.8V – 0.5 1 ps f = 20 MHz, Integration bandwidth = 12 kHz to 20 MHz, All Vdds Notes: 1. All electrical specifications in the above table are specified with 15 pF output load and for all Vdd(s) unless otherwise stated. 2. The typical value of any parameter in the Electrical Characteristics table is specified for the nominal value of the highest voltage option for that parameter and at 25°C temperature. 3. All max and min specifications are guaranteed across rated voltage variations and operating temperature ranges, unless specified otherwise 4. Initial tolerance is measured at Vin = Vdd/2 5. Absolute Pull Range (APR) is defined as the guaranteed pull range over temperature and voltage. 6. APR = pull range (PR) - frequency stability (F_stab) - Aging (F_aging) Rev. 1.01 Page 2 of 11 www.sitime.com SiT3808 1 MHz to 80 MHz High Performance MEMS VCXO The Smart Timing Choice The Smart Timing Choice Table 2. Pin Description. 4-Pin Configuration (For 2.5 x 2.0 mm and 3.2 x 2.5 mm packages) Top View Pin Symbol 1 VIN Input Functionality 2 GND Power Electrical ground 3 CLK Output Oscillator output 4 VDD Power Power supply voltage[7] 0-Vdd: produces voltage dependent frequency change VIN 1 4 VDD GND 2 3 CLK Note: 7. A capacitor value of 0.1 µF between VDD and GND is recommended. Figure 1. Table 3. Pin Description. 6-Pin Configuration (For 5.0 x 3.2 mm and 7.0 x 5.0 mm packages) Pin Symbol 1 VIN Functionality Input No Connect 2 NC/OE/ ST Top View 0-Vdd: produces voltage dependent frequency change H or L or Open: No effect on output frequency or other device functions Output Enable H or Open[8]: specified frequency output L: output is high Standby H or Open[8]: specified frequency output L: output is low (weak pull down)[9]. Oscillation stops 3 GND Power 4 CLK Output 5 NC No Connect 6 VDD Power Electrical ground VIN 1 6 VDD NC/OE/ST 2 5 NC GND 3 4 CLK Oscillator output H or L or Open: No effect on output frequency or other device functions Figure 2. Power supply voltage[10] Notes: 8. In OE or ST mode, a pull-up resistor of 10 kΩ or less is recommended if pin 2 in the 6-pin package is not externally driven. If pin 2 needs to be left floating, use the NC option 9. Typical value of the weak pull-down impedance is 5 mΩ 10. A capacitor value of 0.1 µF between VDD and GND is recommended. Table 4. Absolute Maximum Limits Attempted operation outside the absolute maximum ratings may cause permanent damage to the part. Actual performance of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings. Min. Max. Unit Storage Temperature Parameter -65 150 °C VDD -0.5 4 V Electrostatic Discharge – 2000 V Soldering Temperature (follow standard Pb free soldering guidelines) – 260 °C Table 5. Thermal Consideration JA, 4 Layer Board JA, 2 Layer Board JC, Bottom 7050 191 263 30 5032 97 199 24 3225 109 212 27 2520 117 222 26 Parameter (°C/W) (°C/W) (°C/W) Table 6. Environmental Compliance Parameter Condition/Test Method Mechanical Shock MIL-STD-883F, Method 2002 Mechanical Vibration MIL-STD-883F, Method 2007 Temperature Cycle JESD22, Method A104 Solderability MIL-STD-883F, Method 2003 Moisture Sensitivity Level MSL1 @ 260°C Rev. 1.01 Page 3 of 11 www.sitime.com SiT3808 1 MHz to 80 MHz High Performance MEMS VCXO The Smart Timing Choice The Smart Timing Choice Phase Noise Plot -100 Phase Noise (dBc/Hz) -110 Integrated random phase jitter (RMS, 12kHz-5MHz): 0.52ps -120 -130 -140 -150 -160 -170 3 10 4 5 10 6 10 Frequency Offset (Hz) 10 Figure 3. Phase Noise, 10 MHz, 3.3V, LVCMOS Output Test Circuit and Waveform Power Supply 0.1µF Vdd Vout 4 3 1 Vout Test Point Power Supply 15pF (including probe and fixture capacitance) 2 OE/ST Function 0.1µF 6 5 4 1 2 3 Test Point 15pF (including probe and fixture capacitance) OE/ST Function Vc Vc Figure 4. Test Circuit (4-Pin Device) Vdd Figure 5. Test Circuit (6-Pin Device) tr tf 90% Vdd 50% 10% Vdd High Pulse (TH) Low Pulse (TL) Period Figure 6. Waveform Note: 11. Duty Cycle is computed as Duty Cycle = TH/Period. 12. SiT3808 supports the configurable duty cycle feature. For custom duty cycle at any given frequency, contact SiTime. Rev. 1.01 Page 4 of 11 www.sitime.com SiT3808 1 MHz to 80 MHz High Performance MEMS VCXO The Smart Timing Choice The Smart Timing Choice Timing Diagram 80% Vdd, 2.5/2.8/3.3V devices 80% Vdd, 1.8V devices Vdd Vdd 50% Vdd Pin 4 Voltage T_start ST Voltage No Glitch during start up T_resume CLK Output CLK Output T_start: Time to start from power-off Figure 7. Startup Timing (OE/ST Mode) T_resume: Time to resume from ST Figure 8. Standby Resume Timing (ST Mode Only) u Vdd Vdd 50% Vdd OE Voltage OE Voltage 50% Vdd T_oe T_oe CLK Output CLK Output HZ T_oe: Time to re-enable the clock output T_oe: Time to put the output in High Z mode Figure 9. OE Enable Timing (OE Mode Only) Figure 10. OE Disable Timing (OE Mode Only) Notes: 13. SiT3808 supports “no runt” pulses and “no glitch” output during startup or resume. 14. SiT3808 supports gated output which is accurate within rated frequency stability from the first cycle. Rev. 1.01 Page 5 of 11 www.sitime.com SiT3808 1 MHz to 80 MHz High Performance MEMS VCXO The Smart Timing Choice The Smart Timing Choice Programmable Drive Strength The SiT3808 includes a programmable drive strength feature to provide a simple, flexible tool to optimize the clock rise/fall time for specific applications. Benefits from the programmable drive strength feature are: • Improves system radiated electromagnetic interference (EMI) by slowing down the clock rise/fall time. • Improves the downstream clock receiver’s (RX) jitter by decreasing (speeding up) the clock rise/fall time. • Ability to drive large capacitive loads while maintaining full swing with sharp edge rates. For more detailed information about rise/fall time control and drive strength selection, see the SiTime Application Notes section; http://www.sitime.com/support/application-notes. EMI Reduction by Slowing Rise/Fall Time Figure 11 shows the harmonic power reduction as the rise/fall times are increased (slowed down). The rise/fall times are expressed as a ratio of the clock period. For the ratio of 0.05, the signal is very close to a square wave. For the ratio of 0.45, the signal is very close to near-triangular waveform. These results, for example, show that the 11th clock harmonic can be reduced by 35 dB if the rise/fall edge is increased from 5% of the period to 45% of the period.   trise=0.05 trise=0.1 trise=0.15 trise=0.2 trise=0.25 trise=0.3 10 Harmonic amplitude (dB) 0 -10 increasing the drive strength setting to “P” (reference to the drive strength code in Table 10) on the SiT3808. The SiT3808 can support up to 60 pF maximum capacitive loads. Refer to the Rise/Tall Time Tables to determine the proper drive strength for the desired combination of output load vs. rise/fall time. SiT3808 Drive Strength Selection Tables 7 through 10 define the rise/fall times for a given capacitive load and supply voltage. 1. Select the table that matches the SiT3808 nominal supply voltage (1.8V, 2.5V, 2.8V, 3.3V). 2. Select the capacitive load column that matches the application requirement (5 pF to 60 pF) 3. Under the capacitive load column, select the desired rise/fall times. 4. The left-most column represents the part number code for the corresponding drive strength. 5. Add the drive strength code to the part number for ordering purposes. Calculating Maximum Frequency Based on the rise and fall time data given in Tables 7 through 10, the maximum frequency the oscillator can operate with guaranteed full swing of the output voltage over temperature can be calculated as follows: Max Frequency = trise=0.35 trise=0.4 -20 trise=0.45 1 6 x Trf_10/90 -30 Where Trf_10/90 is the typical rise/fall time at 10% to 90% Vdd. -40 -50 Example 1 -60 Calculate fMAX for the following condition: -70 -80 1 3 5 7 9 11 Harm onic num ber Figure 11. Harmonic EMI reduction as a Function of Slower Rise/Fall Time Jitter Reduction with Faster Rise/Fall Time Power supply noise can be a source of jitter for the downstream chipset. One way to reduce this jitter is to increase rise/fall time (edge rate) of the input clock. Some chipsets would require faster rise/fall time in order to reduce their sensitivity to this type of jitter. Refer to the Rise/Fall Time Tables to determine the proper drive strength. • Vdd = 3.3V (Table 10) • Capacitive Load: 30 pF • Typical Tr/f time = 1.66 ns (drive strength part number code = G) Part number for the above example: SiT3808AIGG2-33EH-49.152000 Drive strength code is inserted here. Default setting is “-” High Output Load Capability The rise/fall time of the input clock varies as a function of the actual capacitive load the clock drives. At any given drive strength, the rise/fall time becomes slower as the output load increases. As an example, for a 3.3V SiT3808 device with default drive strength setting, the typical rise/fall time is 1.15 ns for 15 pF output load. The typical rise/fall time slows down to 2.72 ns when the output load increases to 45 pF. One can choose to speed up the rise/fall time to 1.41 ns by then Rev. 1.01 Page 6 of 11 www.sitime.com SiT3808 1 MHz to 80 MHz High Performance MEMS VCXO The Smart Timing Choice The Smart Timing Choice Rise/Fall Time (10% to 90%) vs CLOAD Tables Table 7. Vdd = 1.8V Rise/Fall Times for Specific CLOAD Table 8. Vdd = 2.5V Rise/Fall Times for Specific CLOAD Rise/Fall Time Typ (ns) Rise/Fall Time Typ (ns) Drive Strength \ CLOAD 5 pF 15 pF 30 pF 45 pF 60 pF Drive Strength \ CLOAD 5 pF 15 pF 30 pF 45 pF 60 pF L 12.45 17.68 19.48 46.21 57.82 L 8.68 13.59 18.36 32.70 42.06 A 6.50 10.27 16.21 23.92 30.73 A 4.42 7.18 11.93 16.60 21.38 R 4.38 7.05 11.61 16.17 20.83 R 2.93 4.78 8.15 11.19 14.59 B 3.27 5.30 8.89 12.18 15.75 B 2.21 3.57 6.19 8.55 11.04 S 2.62 4.25 7.20 9.81 12.65 S 1.67 2.87 4.94 6.85 8.80 D 2.19 3.52 6.00 8.31 10.59 D 1.50 2.33 4.11 5.68 7.33 T 1.76 3.01 5.14 7.10 9.15 T 1.06 2.04 3.50 4.84 6.26 E 1.59 2.59 4.49 6.25 7.98 E 0.98 1.69 3.03 4.20 5.51 U 1.49 2.28 3.96 5.55 7.15 U 0.93 1.48 2.69 3.73 4.92 F 1.22 2.10 3.57 5.00 6.46 F 0.90 1.37 2.44 3.34 4.42 W 1.07 1.88 3.23 4.50 5.87 W 0.87 1.29 2.21 3.04 4.02 G 1.01 1.64 2.95 4.12 5.40 G or "-": Default 0.67 1.20 2.00 2.79 3.69 X 0.96 1.50 2.74 3.80 4.98 X 0.44 1.10 1.86 2.56 3.43 K 0.92 1.41 2.56 3.52 4.64 K 0.38 0.99 1.76 2.37 3.18 Y 0.88 1.34 2.39 3.25 4.32 Y 0.36 0.83 1.66 2.20 2.98 Q 0.86 1.29 2.24 3.04 4.06 Q 0.34 0.71 1.58 2.07 2.80 Z or "-": Default 0.82 1.24 2.07 2.89 3.82 Z 0.33 0.65 1.51 1.95 2.65 M 0.77 1.20 1.94 2.72 3.61 M 0.32 0.62 1.44 1.85 2.50 N 0.66 1.15 1.84 2.58 3.41 N 0.31 0.59 1.37 1.77 2.39 P 0.51 1.09 1.76 2.45 3.24 P 0.30 0.57 1.29 1.70 2.28 Table 9. Vdd = 2.8V Rise/Fall Times for Specific CLOAD Table 10. Vdd = 3.3V Rise/Fall Times for Specific CLOAD Rise/Fall Time Typ (ns) Rise/Fall Time Typ (ns) Drive Strength \ CLOAD 5 pF 15 pF 30 pF 45 pF 60 pF Drive Strength \ CLOAD 5 pF 15 pF 30 pF 45 pF 60 pF L 7.93 12.69 17.94 30.10 38.89 L 7.18 11.59 17.24 27.57 35.57 A 4.06 6.66 11.04 15.31 19.80 A 3.61 6.02 10.19 13.98 18.10 R 2.68 4.40 7.53 10.29 13.37 R 2.31 3.95 6.88 9.42 12.24 B 2.00 3.25 5.66 7.84 10.11 B 1.65 2.92 5.12 7.10 9.17 S 1.59 2.57 4.54 6.27 8.07 S 1.43 2.26 4.09 5.66 7.34 D 1.19 2.14 3.76 5.21 6.72 D 1.01 1.91 3.38 4.69 6.14 T 1.00 1.79 3.20 4.43 5.77 T 0.94 1.51 2.86 3.97 5.25 E 0.94 1.51 2.78 3.84 5.06 E 0.90 1.36 2.50 3.46 4.58 U 0.90 1.38 2.48 3.40 4.50 U 0.86 1.25 2.21 3.03 4.07 F 0.87 1.29 2.21 3.03 4.05 F or "-": Default 0.48 1.15 1.95 2.72 3.65 W 0.62 1.19 1.99 2.76 3.68 W 0.38 1.04 1.77 2.47 3.31 G or "-": Default 0.41 1.08 1.84 2.52 3.36 G 0.36 0.87 1.66 2.23 3.03 X 0.37 0.96 1.72 2.33 3.15 X 0.34 0.70 1.56 2.04 2.80 K 0.35 0.78 1.63 2.15 2.92 K 0.33 0.63 1.48 1.89 2.61 Y 0.33 0.67 1.54 2.00 2.75 Y 0.32 0.60 1.40 1.79 2.43 Q 0.32 0.63 1.46 1.89 2.57 Q 0.32 0.58 1.31 1.69 2.28 Z 0.31 0.60 1.39 1.80 2.43 Z 0.30 0.56 1.22 1.62 2.17 M 0.30 0.57 1.31 1.72 2.30 M 0.30 0.55 1.12 1.54 2.07 N 0.30 0.56 1.22 1.63 2.22 N 0.30 0.54 1.02 1.47 1.97 P 0.29 0.54 1.13 1.55 2.13 P 0.29 0.52 0.95 1.41 1.90 Rev. 1.01 Page 7 of 11 www.sitime.com SiT3808 1 MHz to 80 MHz High Performance MEMS VCXO The Smart Timing Choice The Smart Timing Choice Instant Samples with Time Machine and Field Programmable Oscillators SiTime supports a field programmable version of the SiT3808 low power oscillator for fast prototyping and real time customization of features. The field programmable devices (FP devices) are available for all four standard SiT3808 package sizes and can be configured to one’s exact specification using the Time Machine II, an USB powered MEMS oscillator programmer. For more information regarding SiTime’s field programmable solutions, visit http://www.sitime.com/time-machine and http://www.sitime.com/fp-devices. SiT3808 is typically factory-programmed per customer ordering codes for volume delivery. Customizable Features of the SiT3808 FP Devices Include • Any frequency between 1 and 80 MHz • Three frequency stability options: ±10 ppm, ±25 ppm, ±50 ppm • Two operating temperatures: -20 to 70°C or -40 to 85°C • Four supply voltage options: 1.8V, 2.5V, 2.8V, and 3.3V • Eight pull range options: ±25 ppm, ±50 ppm, ±100 ppm, ±150 ppm, ±200 ppm, ±400 ppm, ±800 ppm, ±1600 ppm Rev. 1.01 Page 8 of 11 www.sitime.com SiT3808 1 MHz to 80 MHz High Performance MEMS VCXO The Smart Timing Choice The Smart Timing Choice Dimensions and Patterns Package Size – Dimensions (Unit: mm)[15] Recommended Land Pattern (Unit: mm) 2.7 x 2.4 x 0.75 mm (100% compatible with 2.5 x 2. 0 mm footprint) 1.9 1.25 1.5 YXXXX 0.50 1.00 2.4 ± 0.05 2.7 ± 0.05 1.0 0.85 0.75 ± 0.05 1.1 3.2 x 2.5 x 0.75 mm 3.2 ± 0.05 #3 1.9 #2 #1 0.9 0.75 ± 0.05 #2 1.2 #1 0.7 YXXXX #4 0.9 #3 2.5 ± 0.05 #4 2.2 2.1 1.4 5.0 x 3.2 x 0.75 mm #5 #4 #2 #3 #4 #5 #6 1.20 #6 YXXXX #1 #3 #2 #1 0.75±0.05 7.0 x 5.0x 0.90 mm 7.0±0.10 #3 #3 #2 3.80 #6 #5 #1 1.60 #2 #4 1.10 YXXXX #1 5.08 5.08 #4 2.60 #5 5.0±0.10 #6 0.90 ±0.10 1.40 1.60 Note: 15.Top marking: Y denotes manufacturing origin and XXXX denotes manufacturing lot number. The value of “Y” will depend on the assembly location of the device. Rev. 1.01 Page 9 of 11 www.sitime.com SiT3808 1 MHz to 80 MHz High Performance MEMS VCXO The Smart Timing Choice The Smart Timing Choice Ordering Information SiT3808AC -22-33EH-49.152000D Packing Method “T”: 12 mm Tape & Reel, 3ku reel “Y”: 12 mm Tape & Reel, 1ku reel “D”: 8 mm Tape & Reel, 3ku reel “E”: 8 mm Tape & Reel, 1ku reel Blank for Bulk Part Family “SiT3808” Revision Letter “A” is the revision Temperature Range Frequency “C” Commercial, -20 to 70ºC 1.000000 to 80.000000 MHz “I” Industrial, -40 to 85ºC Pull Range Options “M” for ±25 ppm “B” for ±50 ppm “E” for ±100 ppm “G” for ±150 ppm “H” for ±200 ppm “X” for ±400 ppm “Y” for ±800 ppm “Z” for ±1600 ppm Output Drive Strength “–” Default (datasheet limits) See rise/fall tables on page 7 “S” “D” “T” “E” “L” “A” “R” “B” “U” “F” “W” “G” “X” “K” “Y” “Q” “Z” “M” “N” “P” Feature Pin “N” for No Connect in 6-pin devices, Default value in 4-pin device Package “G” 2.5 x 2.0 mm x mm “2” 4-pin, 3.2 x 2.5 mm x mm “C” 6-pin, 5.0 x 3.2 mm x mm “D” 6-pin, 7.0 x 5.0 mm x mm “E” for Output Enable (6-pin only) “S” for Standby (6-pin only) Supply Voltage Frequency Stability “F” for ±10 ppm “2” for ±25 ppm “3” for ±50 ppm “18” for 1.8 V ±5% “25” for 2.5 V ±10% “28” for 2.8 V ±10% “33” for 3.3 V ±10% Table 12. APR Definition Absolute pull range (APR) = Norminal pull range (PR) - frequency stability (F_stab) - Aging (F_aging) Frequency Stability Nominal Pull Range ± 10 ± 25 ± 50 APR (PPM) ± 25 ± 10 – ± 50 ± 35 ± 20 – – ± 100 ± 85 ± 70 ± 45 ± 150 ± 135 ± 120 ± 95 ± 200 ± 185 ± 170 ± 145 ± 400 ± 385 ± 370 ± 345 ± 800 ± 785 ± 770 ± 745 ± 1600 ± 1585 ± 1570 ± 1545 Table 13. Ordering Codes for Supported Tape & Reel Packing Method[16] Device Size 12 mm T&R (3ku) 12 mm T&R (1ku) 8 mm T&R (3ku) 8 mm T&R 1ku) 2.5 x 2.0 mm – – D E 3.2 x 2.5 mm – – D E 5.0 x 3.2 mm T Y – – 7.0 x 5.0 mm T Y – – Note: 16. “–” indicates “not available.” Rev. 1.01 Page 10 of 11 www.sitime.com SiT3808 1 MHz to 80 MHz High Performance MEMS VCXO The Smart Timing Choice The Smart Timing Choice Table 14. Additional Information Document Description Download Link Manufacturing Notes Tape & Reel dimension, reflow profile and other manufacturing related info http://www.sitime.com/component/docman/doc_download/85-manufaturing-notes-for-sitime-oscillators Qualification Reports RoHS report, reliability reports, composition reports http://www.sitime.com/support/quality-and-reliability Performance Reports Additional performance data such as phase noise, current consumption and jitter for selected frequencies http://www.sitime.com/support/performance-measurement-report Termination Techniques Termination design recommendations http://www.sitime.com/support/application-notes Layout Techniques Layout recommendations http://www.sitime.com/support/application-notes VCXO Specifications Definition of key VCXO specifications such as APR and Kv http://www.sitime.com/support2/documents/AN10020_VCXO_SpecDefinitions_rev1.pdf VCXO in PLL Design Selection of VCXO parameters and trade-offs in PLL designs http://www.sitime.com/support2/documents/AN10021_VCXO_PLL_Design_Guidelines_1v0.pdf Revision History Table 15. Datasheet Version and Change Log Version Release Date 0.6 1/24/2013 Change Summary 1.0 3/7/14 • Preliminary removed from title • Updated features and application • Updated electrical specifications table • Updated figure 4, • Added new 6-pin device for figure 5 • Updated timing diagrams • Updated programmable drive strength section • Updated ordering information drawing • Updated APR table • Updated ordering codes for tape and reel table • Reformatted additional information table columns 1.01 1/8/15 • • Preliminary Corrected CLK and VDD functionality description in Table 2 Revised VIN functionality description in Table 3 © SiTime Corporation 2015. The information contained herein is subject to change at any time without notice. SiTime assumes no responsibility or liability for any loss, damage or defect of a Product which is caused in whole or in part by (i) use of any circuitry other than circuitry embodied in a SiTime product, (ii) misuse or abuse including static discharge, neglect or accident, (iii) unauthorized modification or repairs which have been soldered or altered during assembly and are not capable of being tested by SiTime under its normal test conditions, or (iv) improper installation, storage, handling, warehousing or transportation, or (v) being subjected to unusual physical, thermal, or electrical stress. Disclaimer: SiTime makes no warranty of any kind, express or implied, with regard to this material, and specifically disclaims any and all express or implied warranties, either in fact or by operation of law, statutory or otherwise, including the implied warranties of merchantability and fitness for use or a particular purpose, and any implied warranty arising from course of dealing or usage of trade, as well as any common-law duties relating to accuracy or lack of negligence, with respect to this material, any SiTime product and any product documentation. Products sold by SiTime are not suitable or intended to be used in a life support application or component, to operate nuclear facilities, or in other mission critical applications where human life may be involved or at stake. All sales are made conditioned upon compliance with the critical uses policy set forth below. CRITICAL USE EXCLUSION POLICY BUYER AGREES NOT TO USE SITIME'S PRODUCTS FOR ANY APPLICATION OR IN ANY COMPONENTS USED IN LIFE SUPPORT DEVICES OR TO OPERATE NUCLEAR FACILITIES OR FOR USE IN OTHER MISSION-CRITICAL APPLICATIONS OR COMPONENTS WHERE HUMAN LIFE OR PROPERTY MAY BE AT STAKE. SiTime owns all rights, title and interest to the intellectual property related to SiTime's products, including any software, firmware, copyright, patent, or trademark. The sale of SiTime products does not convey or imply any license under patent or other rights. SiTime retains the copyright and trademark rights in all documents, catalogs and plans supplied pursuant to or ancillary to the sale of products or services by SiTime. Unless otherwise agreed to in writing by SiTime, any reproduction, modification, translation, compilation, or representation of this material shall be strictly prohibited. Rev. 1.01 Page 11 of 11 www.sitime.com The Smart Timing Choice The Smart Timing Choice Supplemental Information The Supplemental Information section is not part of the datasheet and is for informational purposes only. SiTime Corporation 990 Almanor Avenue, Sunnyvale, CA 94085 (408) 328-4400 www.sitime.com The Smart Timing Choice The Smart Timing Choice Silicon MEMS Outperforms Quartz SiTime Corporation Silicon MEMS Outperforms Quartz Rev. 1.1 990 Almanor Avenue, Sunnyvale, CA 94085 (408) 328-4400 www.sitime.com Revised October 5, 2013 Silicon MEMS Outperforms Quartz The Smart Timing Choice The Smart Timing Choice Best Reliability Best Electro Magnetic Susceptibility (EMS) Silicon is inherently more reliable than quartz. Unlike quartz suppliers, SiTime has in-house MEMS and analog CMOS expertise, which allows SiTime to develop the most reliable products. Figure 1 shows a comparison with quartz technology. SiTime’s oscillators in plastic packages are up to 54 times more immune to external electromagnetic fields than quartz oscillators as shown in Figure 3. Why is SiTime Best in Class: • SiTime’s MEMS resonators are vacuum sealed using an advanced EpiSeal™ process, which eliminates foreign particles and improves long term aging and reliability • World-class MEMS and CMOS design expertise Why is SiTime Best in Class: • Internal differential architecture for best common mode noise rejection • Electrostatically driven MEMS resonator is more immune to EMS SiTime vs Quartz Electro Magnetic Susceptibility (EMS) Mean Time Between Failure (Million Hours) - 30 - 39 500 IDT (Fox) 38 SiTime 20X Better 28 Epson TXC 16 Pericom 14 Average Spurs (dB) SiTime - 40 - 40 - 42 - 43 - 45 - 50 - 60 SiTime 54X Better - 70 - 73 - 80 - 90 200 0 Kyocera 600 400 Figure 1. Reliability Comparison[1] Epson TXC CW SiLabs SiTime Figure 3. Electro Magnetic Susceptibility (EMS)[3] Best Aging Best Power Supply Noise Rejection Unlike quartz, MEMS oscillators have excellent long term aging performance which is why every new SiTime product specifies 10-year aging. A comparison is shown in Figure 2. SiTime’s MEMS oscillators are more resilient against noise on the power supply. A comparison is shown in Figure 4. • SiTime’s MEMS resonators are vacuum sealed using an advanced EpiSeal process, which eliminates foreign particles and improves long term aging and reliability • Inherently better immunity of electrostatically driven MEMS resonator SiTime MEMS vs. Quartz Aging 10 SiTime MEMS Oscillator Quartz Oscillator 8.0 Aging (±PPM) 8 SiTime 2X Better 6 4 2 0 3.0 3.5 1.5 1-Year 10-Year Figure 2. Aging Comparison[2] Silicon MEMS Outperforms Quartz Rev. 1.1 Why is SiTime Best in Class: • On-chip regulators and internal differential architecture for common mode noise rejection • Best analog CMOS design expertise Additive Integrated Phase Jitter per mVp-p Injected Noise (ps/mv) Why is SiTime Best in Class: Power Supply Noise Rejection SiTIme 5.0 NDK Epson Kyocera 4.0 3.0 2.0 SiTime  SiTime 3X Better 1.0 0.0 10 100 1,000 Power Supply Noise Frequency (kHz) 10,000 Figure 4. Power Supply Noise Rejection[4] www.sitime.com Silicon MEMS Outperforms Quartz The Smart Timing Choice The Smart Timing Choice Best Vibration Robustness Best Shock Robustness High-vibration environments are all around us. All electronics, from handheld devices to enterprise servers and storage systems are subject to vibration. Figure 5 shows a comparison of vibration robustness. SiTime’s oscillators can withstand at least 50,000 g shock. They all maintain their electrical performance in operation during shock events. A comparison with quartz devices is shown in Figure 6. Why is SiTime Best in Class: Why is SiTime Best in Class: • The moving mass of SiTime’s MEMS resonators is up to 3000 times smaller than quartz • Center-anchored MEMS resonator is the most robust design • The moving mass of SiTime’s MEMS resonators is up to 3000 times smaller than quartz • Center-anchored MEMS resonator is the most robust design Vibration Sensitivity (ppb/g) TXC Epson Connor Winfield Kyocera SiLabs 100.00 10.00 1.00 SiTime Up to 30x Better 0.10 10 100 Vibration Frequency (Hz) Figure 5. Vibration Robustness[5] 1000 Peak Frequency Deviation (PPM) Vibration Sensitivity vs. Frequency SiTime 16 14 Differential XO Shock Robustness - 500 g 14.3 12.6 12 10 8 SiTime Up to 25x Better 6 3.9 4 2.9 2.5 2 0.6 0 Kyocera Epson TXC CW SiLabs SiTime Figure 6. Shock Robustness[6] Notes: 1. Data Source: Reliability documents of named companies. 2. Data source: SiTime and quartz oscillator devices datasheets. 3. Test conditions for Electro Magnetic Susceptibility (EMS): • According to IEC EN61000-4.3 (Electromagnetic compatibility standard) • Field strength: 3V/m • Radiated signal modulation: AM 1 kHz at 80% depth • Carrier frequency scan: 80 MHz – 1 GHz in 1% steps • Antenna polarization: Vertical • DUT position: Center aligned to antenna Devices used in this test: SiTime, SiT9120AC-1D2-33E156.250000 - MEMS based - 156.25 MHz Epson, EG-2102CA 156.2500M-PHPAL3 - SAW based - 156.25 MHz TXC, BB-156.250MBE-T - 3rd Overtone quartz based - 156.25 MHz Kyocera, KC7050T156.250P30E00 - SAW based - 156.25 MHz Connor Winfield (CW), P123-156.25M - 3rd overtone quartz based - 156.25 MHz SiLabs, Si590AB-BDG - 3rd overtone quartz based - 156.25 MHz 4. 50 mV pk-pk Sinusoidal voltage. Devices used in this test: SiTime, SiT8208AI-33-33E-25.000000, MEMS based - 25 MHz NDK, NZ2523SB-25.6M - quartz based - 25.6 MHz Kyocera, KC2016B25M0C1GE00 - quartz based - 25 MHz Epson, SG-310SCF-25M0-MB3 - quartz based - 25 MHz 5. Devices used in this test: same as EMS test stated in Note 3. 6. Test conditions for shock test: • MIL-STD-883F Method 2002 • Condition A: half sine wave shock pulse, 500-g, 1ms • Continuous frequency measurement in 100 μs gate time for 10 seconds Devices used in this test: same as EMS test stated in Note 3 7. Additional data, including setup and detailed results, is available upon request to qualified customers. Please contact productsupport@sitime.com. Silicon MEMS Outperforms Quartz Rev. 1.1 www.sitime.com Document Feedback Form The Smart Timing Choice The Smart Timing Choice SiTime values your input in improving our documentation. Click here for our online feedback form or fill out and email the form below to productsupport@sitime.com. 1. Does the Electrical Characteristics table provide complete information? Yes No If No, what parameters are missing? _________________________________________________________________________________________________ 2. Is the organization of this document easy to follow? Yes No If “No,” please suggest improvements that we can make: _________________________________________________________________________________________________ 3. Is there any application specific information that you would like to see in this document? (Check all that apply) EMI Termination recommendations Shock and vibration performance Other If “Other,” please specify: _________________________________________________________________________________________________ 4. Are there any errors in this document? Yes No If “Yes”, please specify (what and where): _________________________________________________________________________________________________ 5. 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Feedback Form Rev. 1.0 www.sitime.com
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